Known targets — ChEMBL curated mechanism
GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQ
The experimentally established mechanism targets of Water. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC22A1 | O15245 | 3/20 | 0.86 |
| ▸ | SLC22A2 | O15244 | 1/20 | 0.86 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.75 |
| ▸ | TP53 | P04637 | 1/20 | 0.75 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.75 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.75 |
| ▸ | TSHR | P16473 | 1/20 | 0.75 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.75 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.75 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.75 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.75 |
| ▸ | DNM1 | Q05193 | 7/20 | 0.67 |
| ▸ | APAF1 | O14727 | 1/20 | 0.55 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.55 |
| ▸ | RAD52 | P43351 | 1/20 | 0.55 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Water SCHEMBL3485498 | 1.00 | SLC22A1 (0.86) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL766417 | 1.00 | SLC22A1 (0.86) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3484887 | 1.00 | SLC22A1 (0.86) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL876408 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3486043 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL875909 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3485233 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3485231 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Water SCHEMBL3485321 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 | |
| Tetrahexylammonium SCHEMBL5469443 | 0.97 | SLC22A1 (0.87) | SLC22A1SLC22A2ALDH1A1TP53CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 310 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2026100508-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2026-05-15 | — | — | WO | disclosed |
| US-12619147-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic device | FUJIFILM CORPORATION (JP) | 2026-05-05 | — | — | US | disclosed |
| US-12599937-B2 | Water-based, high-efficiency chemical reagent for substrate surface particle removal | APPLIED MATERIALS, INC. (US) | 2026-04-14 | — | — | US | disclosed |
| US-12535734-B2 | Actinic-ray-sensitive or radiation-sensitive resin composition, actinic-ray-sensitive or radiation-sensitive film, method for forming pattern, and method for producing electronic device | FUJIFILM CORPORATION (JP) | 2026-01-27 | — | — | US | disclosed |
| US-20260003281-A1 | RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2026-01-01 | — | — | US | disclosed |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2026-01-01 | — | — | US | disclosed |
| US-12510822-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, method for manufacturing electronic device, actinic ray-sensitive or radiation-sensitive resin composition for manufacturing photomask, and method for manufacturing photomask | FUJIFILM CORPORATION (JP) | 2025-12-30 | — | — | US | disclosed |
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-12481218-B2 | Treatment liquid, method for washing substrate, and method for removing resist | FUJIFILM CORPORATION (JP) | 2025-11-25 | — | — | US | disclosed |
| US-20160131976-A1 | RESIST COMPOSITION FOR SEMICONDUCTOR MANUFACTURING PROCESS; RESIST FILM, RESIST-COATED MASK BLANKS, PHOTOMASK, AND RESIST PATTERNING METHOD USING SAID RESIST COMPOSITION; ELECTRONIC-DEVICE MANUFACTURING METHOD; AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2016-05-12 | — | — | US | disclosed |
| US-20160116840-A1 | COMPOUND, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM USING SAME, RESIST-COATED MASK BLANK, PHOTOMASK, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2016-04-28 | — | — | US | disclosed |
| US-20160011517-A1 | PATTERN FORMING METHOD, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, METHOD OF MANUFACTURING ELECTRONIC DEVICE USING THE SAME, AND ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2016-01-14 | — | — | US | disclosed |
| EP-2891686-A1 | DISPERSION COMPOSITION, AND CURABLE COMPOSITION, TRANSPARENT FILM, MICROLENS AND SOLID-STATE IMAGING ELEMENT USING SAME | FUJIFILM Corporation (JP) | 2015-07-08 | — | — | EP | disclosed |
| EP-2891685-A1 | DISPERSION COMPOSITION, AND CURABLE COMPOSITION, TRANSPARENT FILM, MICROLENS AND SOLID-STATE IMAGING ELEMENT USING SAME | FUJIFILM Corporation (JP) | 2015-07-08 | — | — | EP | disclosed |
| EP-2891687-A1 | DISPERSION COMPOSITION, AND CURABLE COMPOSITION, TRANSPARENT FILM, MICROLENS AND SOLID-STATE IMAGING ELEMENT USING SAME, AND POLYMER COMPOUND | FUJIFILM Corporation (JP) | 2015-07-08 | — | — | EP | disclosed |
| US-20150166816-A1 | DISPERSION COMPOSITION, CURABLE COMPOSITION USING THE SAME, TRANSPARENT FILM, MICROLENS, AND SOLID-STATE IMAGING DEVICE | FUJIFILM CORPORATION (JP) | 2015-06-18 | — | — | US | disclosed |
| US-20150166783-A1 | DISPERSION COMPOSITION, CURABLE COMPOSITION USING THE SAME, TRANSPARENT FILM, MICROLENS, AND SOLID-STATE IMAGING DEVICE | FUJIFILM CORPORATION (JP) | 2015-06-18 | — | — | US | disclosed |
| US-20150166780-A1 | DISPERSION COMPOSITION, AND CURABLE COMPOSITION, TRANSPARENT FILM, MICROLENS AND SOLID-STATE IMAGING DEVICE USING SAME, AND POLYMER COMPOUND | FUJIFILM CORPORATION (JP) | 2015-06-18 | — | — | US | disclosed |
| US-20100283133-A1 | FILM-FORMING COMPOSITION, INSULATING FILM WITH LOW DIELECTRIC CONSTANT, FORMATION METHOD THEREOF, AND SEMICONDUCTOR DEVICE | HAMADA YOSHITAKA | 2010-11-11 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (8 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12510822-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, method for manufacturing electronic device, actinic ray-sensitive or radiation-sensitive resin composition for manufacturing photomask, and method for manufacturing photomask | LCP1, ARL1, ACTR2 | SLC22A1 4466/4885SLC22A2 4449/4885ALDH1A1 2858/4885 |
| US-20260003281-A1 | RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, SAT1, ASIC1 | SLC22A1 3264/4885SLC22A2 3587/4885ALDH1A1 50/4885 |
| US-20160116840-A1 | COMPOUND, ACTIVE LIGHT SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, RESIST FILM USING SAME, RESIST-COATED MASK BLANK, PHOTOMASK, PATTERN FORMING METHOD, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND ELECTRONIC DEVICE | CHRM1, ESR1, RER1 | SLC22A1 4435/4885SLC22A2 4579/4885ALDH1A1 3574/4885 |
| US-12535734-B2 | Actinic-ray-sensitive or radiation-sensitive resin composition, actinic-ray-sensitive or radiation-sensitive film, method for forming pattern, and method for producing electronic device | RAD51, ACTN1, GLRA1 | SLC22A1 3563/4885SLC22A2 3807/4885ALDH1A1 2191/4885 |
| US-12619147-B2 | Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic device | RAD51, COL1A1, CROCC | SLC22A1 4346/4885SLC22A2 4658/4885ALDH1A1 1614/4885 |
| US-20260003274-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | SEM1, ASIC1, SMARCB1 | SLC22A1 4128/4885SLC22A2 4178/4885ALDH1A1 1444/4885 |
| US-20260003276-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | RER1, SEM1, RAD51 | SLC22A1 4390/4885SLC22A2 4414/4885ALDH1A1 460/4885 |
| US-12599937-B2 | Water-based, high-efficiency chemical reagent for substrate surface particle removal | STUB1, CD2, EPCAM | SLC22A1 4668/4885SLC22A2 4601/4885ALDH1A1 528/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.