SCHEMBL7665295

SCHEMBL7665295

O=[N+]([O-])c1ccccc1Sc1ccc(Cl)cc1

nearest known ligand 0.67

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
PDE7A Q13946 13/20 0.67
PDE7B Q9NP56 5/20 0.67
MEN1 O00255 1/20 0.59
KMT2A Q03164 1/20 0.59
SMN1; SMN2 Q16637 2/20 0.56
BCL2L1 Q07817 2/20 0.55
POLB P06746 2/20 0.55
PDE4B Q07343 1/20 0.55
PDE4D Q08499 1/20 0.55
IDO1 P14902 1/20 0.52
PLA2G4A P47712 1/20 0.52
TDP1 Q9NUW8 1/20 0.51
L3MBTL1 Q9Y468 1/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30338244 0.85 PDE7A (0.65) PDE7APDE7BMEN1KMT2ASMN1; SMN2
SCHEMBL1713219 0.85 PDE7A (0.65) PDE7APDE7BMEN1KMT2ASMN1; SMN2
SCHEMBL8881808 0.83 MAPT (0.58) PDE7APDE7BMEN1KMT2ASMN1; SMN2
SCHEMBL2614719 0.83 PDE7A (0.59) PDE7APDE7BMEN1KMT2ASMN1; SMN2
SCHEMBL9186731 0.83 PDE7A (0.56) PDE7APDE7BMEN1KMT2ASMN1; SMN2
SCHEMBL4963975 0.83 PDE7A (0.82) PDE7APDE7BMEN1KMT2ABCL2L1
SCHEMBL10923003 0.83 PDE7A (0.65) PDE7APDE7BMEN1KMT2ASMN1; SMN2
SCHEMBL11760310 0.83 PDE7A (0.56) PDE7APDE7BMEN1KMT2ASMN1; SMN2
SCHEMBL12925885 0.82 PDE7A (0.51) PDE7APDE7BMEN1KMT2ASMN1; SMN2
SCHEMBL28267868 0.82 PDE7A (0.66) PDE7APDE7BMEN1KMT2ASMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118390125-B Copper electroplating additive suitable for IC carrier plate and preparation method and application thereof 深圳市板明科技股份有限公司 2024-08-16 CN claimed
CN-118390125-A Copper electroplating additive suitable for IC carrier plate and preparation method and application thereof 深圳市板明科技股份有限公司 2024-07-26 CN claimed
CN-114524517-B Method for strengthening biological treatment of high-salt high-ammonia nitrogen industrial wastewater 浙江卓锦环保科技股份有限公司 2023-01-24 CN claimed
CN-118390125-B Copper electroplating additive suitable for IC carrier plate and preparation method and application thereof 深圳市板明科技股份有限公司 2024-08-16 CN disclosed
CN-118390125-A Copper electroplating additive suitable for IC carrier plate and preparation method and application thereof 深圳市板明科技股份有限公司 2024-07-26 CN disclosed
CN-114524517-B Method for strengthening biological treatment of high-salt high-ammonia nitrogen industrial wastewater 浙江卓锦环保科技股份有限公司 2023-01-24 CN disclosed
CN-114524517-A Method for strengthening biological treatment of high-salt high-ammonia nitrogen industrial wastewater 浙江卓锦环保科技股份有限公司 2022-05-24 CN disclosed
CN-103524455-A 2-chloro-10,11-Dihydro-11-oxodibenzo [b, f] [1, 4] thiazepine-11 (10-H)-one preparing method SUZHOU JINGYE MEDICINE & CHEMICAL CO LTD 2014-01-22 CN disclosed
US-6403607-B1 ANTIULCER Hidaka, Hiroyoshi (JP) 2002-06-11 US disclosed
EP-1072587-A1 SULFONAMIDE DERIVATIVES AND DRUGS CONTAINING THE SAME AS THE ACTIVE INGREDIENT Hidaka, Hiroyoshi (JP) 2001-01-31 EP disclosed
US-5679695-A Aryl and heteroaryl compounds having anti-retrovirus activity THE UNIVERSITY OF CONNECTICUT (US) 1997-10-21 US disclosed
EP-0554377-A4 ARYL AND HETEROARYL COMPOUNDS HAVING ANTI-RETROVIRUS ACTIVITY 1993-10-20 EP disclosed
EP-0554377-A1 ARYL AND HETEROARYL COMPOUNDS HAVING ANTI-RETROVIRUS ACTIVITY THE UNIVERSITY OF CONNECTICUT (US) 1993-08-11 EP disclosed
WO-1992006683-A1 ARYL AND HETEROARYL COMPOUNDS HAVING ANTI-RETROVIRUS ACTIVITY RESEARCH CORPORATION TECHNOLOGIES, INC. (US) 1992-04-30 WO disclosed
EP-0102476-A1 Method of modulating the immune response system in mammals AMERICAN CYANAMID COMPANY (US) 1984-03-14 EP disclosed