SCHEMBL767170

SCHEMBL767170

C/C(=C\c1cccc2cc3ccccc3cc12)C(=O)O

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 4/20 0.51
AKR1C3 P42330 1/20 0.49
ALDH1A1 P00352 4/20 0.44
GAA P10253 2/20 0.44
MEN1 O00255 3/20 0.41
KMT2A Q03164 3/20 0.41
CYP1A2 P05177 2/20 0.41
MAPT P10636 2/20 0.41
MITF O75030 1/20 0.41
CYP2C9 P11712 1/20 0.41
PKM P14618 1/20 0.41
MAPK1 P28482 1/20 0.41
RAB9A P51151 1/20 0.41
CCR6 P51684 1/20 0.41
NPSR1 Q6W5P4 1/20 0.41
HPGD P15428 2/20 0.41
GLA P06280 1/20 0.41
CYP2C19 P33261 1/20 0.41
HSD17B10 Q99714 1/20 0.41
APEX1 P27695 8/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL767171 1.00 KDM4E (0.51) KDM4EAKR1C3ALDH1A1GAAMEN1
SCHEMBL1521190 0.86 KDM4E (0.50) KDM4EALDH1A1GAAMEN1KMT2A
SCHEMBL819646 0.85 KDM4E (0.68) KDM4EAKR1C3ALDH1A1GAAMEN1
SCHEMBL36974 0.85 KDM4E (0.68) KDM4EAKR1C3ALDH1A1GAAMEN1
SCHEMBL909620 0.83 MTNR1A (0.44) KDM4EALDH1A1GAAMEN1KMT2A
SCHEMBL8746662 0.83 AKR1C3 (0.59) KDM4EAKR1C3ALDH1A1CYP2C9HPGD
SCHEMBL8746663 0.81 AKR1C3 (0.50) KDM4EAKR1C3ALDH1A1GAAMEN1
SCHEMBL8746683 0.81 AKR1C3 (0.50) KDM4EAKR1C3ALDH1A1GAAMEN1
SCHEMBL11142704 0.81 AKR1C3 (0.55) KDM4EAKR1C3ALDH1A1GAAMEN1
SCHEMBL8746664 0.81 AKR1C3 (0.55) KDM4EAKR1C3ALDH1A1GAAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6455416-B1 Developer soluble dyed BARC for dual damascene process ADVANCED MICRO DEVICES, INC. 2002-09-24 US claimed
US-11392037-B2 Resist underlayer film forming composition containing silicone having cyclic amino group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2022-07-19 US disclosed
US-9760006-B2 Silicon-containing resist underlayer film forming composition having urea group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2017-09-12 US disclosed
CN-103748517-B Silicon-containing resist underlayer film-forming composition having sulfone structure 日产化学工业株式会社 2017-04-19 CN disclosed
US-9217921-B2 Resist underlayer film forming composition containing silicon having sulfide bond NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-12-22 US disclosed
US-9093279-B2 Thin film forming composition for lithography containing titanium and silicon NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-07-28 US disclosed
US-9023588-B2 Resist underlayer film forming composition containing silicon having nitrogen-containing ring NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2015-05-05 US disclosed
US-8864894-B2 Resist underlayer film forming composition containing silicone having onium group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-10-21 US disclosed
US-8835093-B2 Resist underlayer film forming composition containing silicon having anion group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-09-16 US disclosed
US-8815494-B2 Resist underlayer film forming composition containing silicon having anion group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2014-08-26 US disclosed
US-20070275321-A1 Methods for enhancing resolution of a chemically amplified photoresist ADVANCED MICRO DEVICES, INC. 2007-11-29 US disclosed
US-7056646-B1 Use of base developers as immersion lithography fluid ADVANCED MICRO DEVICES, INC. (US) 2006-06-06 US disclosed
US-6861209-B2 Method to enhance resolution of a chemically amplified photoresist INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2005-03-01 US disclosed
US-20040106070-A1 Method to enhance resolution of a chemically amplified photoresist INTERNATIONAL BUSINESS MACHINES CORPORATION 2004-06-03 US disclosed
US-6534243-B1 A coating containing a cleaving compound to trim resist features; permitting a deprotection region to form within an inner portion of the patterned resist; removing coating and deprotection region to provide a second patterned feature ADVANCED MICRO DEVICES, INC. 2003-03-18 US disclosed
US-6492075-B1 COATING WITH CLEAVING COMPOUND TO CONTROLLABLY DECREASE SIZE OF DEVELOPED RESIST ADVANCED MICRO DEVICES, INC. 2002-12-10 US disclosed
US-6455416-B1 Developer soluble dyed BARC for dual damascene process ADVANCED MICRO DEVICES, INC. 2002-09-24 US disclosed
US-6274289-B1 Chemical resist thickness reduction process ADVANCED MICRO DEVICES, INC. 2001-08-14 US disclosed
EP-0480314-B1 Polyoxymethylene moulding compositions having an increased thermal stability and a reduced emission of formaldehyde DEGUSSA (DE) 1996-06-05 EP disclosed
EP-0480314-A2 Polyoxymethylene moulding compositions having an increased thermal stability and a reduced emission of formaldehyde DEGUSSA AG (DE) 1992-04-15 EP disclosed