SCHEMBL7702002

SCHEMBL7702002

N#COc1ccc(C(F)(C(F)F)C(F)(F)F)cc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6760780 0.79 — —
SCHEMBL7647444 0.78 ESR1 (0.35) —
SCHEMBL24990 0.77 ESR1 (0.45) —
SCHEMBL10627367 0.77 KIF11 (0.33) —
SCHEMBL4376536 0.77 KIF11 (0.47) —
SCHEMBL29038972 0.76 KIF11 (0.52) —
Hydrogen Sulfide SCHEMBL28175895 0.75 KIF11 (0.45) —
SCHEMBL28868994 0.74 — —
SCHEMBL8426309 0.73 AR (0.46) —
SCHEMBL28868996 0.73 AR (0.31) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 89 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107502277-B High-toughness cyanate ester adhesive 中国科学院化学研究所 2020-02-21 — — CN claimed
CN-107474534-B Preparation method of cyanate foamed plastic 中国科学院化学研究所 2020-02-21 — — CN claimed
CN-107400496-B Silazane hybrid cyanate adhesive 中国科学院化学研究所 2020-02-18 — — CN claimed
CN-115175951-B Resin composition, cured product, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board 三菱瓦斯化学株式会社 2024-07-12 — — CN disclosed
CN-117321091-B Maleimide resin, amine resin, curable resin composition, and cured product thereof 日本化药株式会社 2024-06-04 — — CN disclosed
CN-118139906-A Phenol resin, epoxy resin, curable resin composition, and cured product thereof 日本化药株式会社 2024-06-04 — — CN disclosed
CN-118043384-A Prepreg, laminate and printed circuit board 三菱瓦斯化学株式会社 2024-05-14 — — CN disclosed
CN-113260646-B Aromatic amine resin, maleimide resin, curable resin composition, and cured product thereof 日本化药株式会社 2024-04-02 — — CN disclosed
CN-117529508-A Amine compound, maleimide compound, curable resin composition, and cured product thereof 日本化药株式会社 2024-02-06 — — CN disclosed
CN-117529509-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-02-06 — — CN disclosed
CN-117500850-A Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device 三菱瓦斯化学株式会社 2024-02-02 — — CN disclosed
CN-108779330-A Resin combination, prepreg, clad with metal foil plywood, resin sheet and printed circuit board 三菱瓦斯化学株式会社 2018-11-09 — — CN disclosed
EP-1198724-A1 OPTICAL WAVEGUIDES DERIVED FROM A COMBINATION OF POLY(PERFLUOROCYCLOBUTANES) AND POLYMERIC CYANATES PIRELLI CAVI E SISTEMI S.p.A. (IT) 2002-04-24 — — EP disclosed
EP-1196477-A1 POLYCYANATE COPOLYMERS PREPARED FROM POLYFUNCTIONAL CYANATES AND FLUORINATED MONOCYANATES, AND OPTICAL ELEMENTS PREPARED THEREFROM Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. (DE) 2002-04-17 — — EP disclosed
EP-1194795-A1 THERMOSETTING PLASTICS AS SUBSTRATE MATERIALS FOR OPTICAL SYSTEMS Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. (DE) 2002-04-10 — — EP disclosed
WO-2001002465-A1 POLYCYANATE COPOLYMERS PREPARED FROM POLYFUNCTIONAL CYANATES AND FLUORINATED MONOCYANATES, AND OPTICAL ELEMENTS PREPARED THEREFROM Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. (DE) 2001-01-11 — — WO disclosed
WO-2001002878-A1 THERMOSETTING PLASTICS AS SUBSTRATE MATERIALS FOR OPTICAL SYSTEMS Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. (DE) 2001-01-11 — — WO disclosed
WO-2001002880-A1 OPTICAL WAVEGUIDES DERIVED FROM A COMBINATION OF POLY(PERFLUOROCYCLOBUTANES) AND POLYMERIC CYANATES PIRELLI CAVI E SISTEMI S.P.A. (IT) 2001-01-11 — — WO disclosed
US-5605781-A Photosensitive composition with cyanate esters and use thereof INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1997-02-25 — — US disclosed
US-5464726-A Making resist image by exposing positive photosensitive composition /cyanate ester and cationic photoinitiator generating Bronsted acid upon exposure to actinic light/ in predetermined pattern to actinic light, heating, developing INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1995-11-07 — — US disclosed
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