⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10627367 | 0.85 | KIF11 (0.33) | — | |
| SCHEMBL7702002 | 0.79 | — | — | |
| SCHEMBL4376536 | 0.77 | KIF11 (0.47) | — | |
| SCHEMBL28868996 | 0.76 | AR (0.31) | — | |
| Hydrogen Sulfide SCHEMBL28175895 | 0.75 | KIF11 (0.45) | — | |
| SCHEMBL24990 | 0.73 | ESR1 (0.45) | — | |
| SCHEMBL17042662 | 0.72 | NPC1 (0.31) | — | |
| SCHEMBL3146069 | 0.71 | ALDH1A1 (0.52) | — | |
| SCHEMBL6760781 | 0.71 | ESR1 (0.31) | — | |
| SCHEMBL10821948 | 0.71 | PTPN1 (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20220204695-A1 | RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2022-06-30 | — | — | US | disclosed |
| EP-3605602-B1 | HEAT-CONDUCTING MEMBER AND HEAT-DISSIPATING STRUCTURE INCLUDING SAID HEAT-CONDUCTING MEMBER | DENKA COMPANY LTD (JP) | 2022-01-12 | — | — | EP | disclosed |
| US-20210229407-A1 | Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-07-29 | — | — | US | disclosed |
| US-20210214547-A1 | Resin Composition, Prepreg, Metal Foil-Clad Laminate, Resin Sheet, and Printed Wiring Board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-07-15 | — | — | US | disclosed |
| US-11034623-B2 | Thermal conductive member and heat dissipation structure including the same | DENKA COMPANY LIMITED (JP) | 2021-06-15 | — | — | US | disclosed |
| EP-3805293-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL-TIGHTENED LAMINATED SHEET, RESIN SHEET, AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-04-14 | — | — | EP | disclosed |
| EP-3805316-A1 | RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN SHEET AND PRINTED WIRING BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2021-04-14 | — | — | EP | disclosed |
| EP-3605602-A1 | HEAT-CONDUCTING MEMBER AND HEAT-DISSIPATING STRUCTURE INCLUDING SAID HEAT-CONDUCTING MEMBER | Denka Company Limited (JP) | 2020-02-05 | — | — | EP | disclosed |
| US-20200031723-A1 | THERMAL CONDUCTIVE MEMBER AND HEAT DISSIPATION STRUCTURE INCLUDING THE SAME | DENKA COMPANY LIMITED (JP) | 2020-01-30 | — | — | US | disclosed |
| US-6716958-B1 | BROAD VARIABLE REFRACTIVE INDEX RANGE | PIRELLI CAVI E SISTEMI S.P.A. (IT) | 2004-04-06 | — | — | US | disclosed |