2-Nitrofluorene

2-Nitrofluorene

SCHEMBL7722767

O=[N+]([O-])c1ccc2c(c1)Cc1ccccc1-2.c1ccc(SSc2ccccc2)cc1

nearest known ligand 0.56

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.56
TLR9 Q9NR96 2/20 0.56
LMNA P02545 2/20 0.56
RAB9A P51151 2/20 0.56
MEN1 O00255 1/20 0.56
KMT2A Q03164 1/20 0.56
HSP90AA1 P07900 3/20 0.53
CYP1A2 P05177 2/20 0.47
HSD17B10 Q99714 1/20 0.47
TDP2 O95551 1/20 0.47
PTPRC P08575 2/20 0.45
ACHE P22303 2/20 0.45
BCHE P06276 1/20 0.45
CES1 P23141 1/20 0.45
S100A4 P26447 1/20 0.45
PARP1 P09874 2/20 0.45
CRHBP P24387 1/20 0.44
CRHR2 Q13324 1/20 0.44
SRD5A2 P31213 1/20 0.44
PDE7A Q13946 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
2-Nitrofluorene SCHEMBL28029750 0.91 MAPT (0.56) MAPTTLR9LMNARAB9AMEN1
2-Nitrofluorene SCHEMBL644332 0.89 MAPT (0.68) MAPTTLR9LMNARAB9AMEN1
2-Nitrofluorene SCHEMBL29450702 0.89 MAPT (0.68) MAPTTLR9LMNARAB9AMEN1
2-Nitrofluorene SCHEMBL28186600 0.88 MAPT (0.62) MAPTTLR9LMNARAB9AMEN1
2-Nitrofluorene SCHEMBL28251179 0.84 MAPT (0.60) MAPTTLR9LMNARAB9AMEN1
SCHEMBL7618863 0.83 MAPT (0.58) MAPTTLR9LMNARAB9AMEN1
SCHEMBL12298162 0.82 PTPRC (0.58) MAPTTLR9LMNARAB9AMEN1
2-Nitrofluorene SCHEMBL8006385 0.81 MAPT (0.85) MAPTTLR9LMNARAB9AMEN1
SCHEMBL987760 0.81 TLR9 (0.79) MAPTTLR9LMNARAB9AMEN1
SCHEMBL30049268 0.81 TLR9 (0.79) MAPTTLR9LMNARAB9AMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 79 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240191072-A1 CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT TAIYO HOLDING CO., LTD. (JP) 2024-06-13 US disclosed
CN-117980364-A Curable organopolysiloxane composition, organopolysiloxane adhesive layer obtained by curing the same, and laminate 陶氏东丽株式会社 2024-05-03 CN disclosed
CN-117940529-A Curable organopolysiloxane composition, micro-adhesive organopolysiloxane adhesive layer obtained by curing the same, and laminate 陶氏东丽株式会社 2024-04-26 CN disclosed
CN-117940471-A Hot-melt curable polyorganosiloxane composition, cured product of the composition, and method for producing film or the like from the composition 陶氏东丽株式会社 2024-04-26 CN disclosed
CN-117916280-A Curable hot-melt silicone composition, cured product of the composition, and method for producing film or the like comprising the composition 陶氏东丽株式会社 2024-04-19 CN disclosed
CN-117897421-A High-energy ray-curable composition and use thereof 陶氏东丽株式会社 2024-04-16 CN disclosed
CN-111708251-B Curable resin composition, dry film, cured product, and electronic component 太阳控股株式会社 2024-04-16 CN disclosed
WO-2024075717-A1 CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD 太陽ホールディングス株式会社 2024-04-11 WO disclosed
WO-2024075714-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD 太陽ホールディングス株式会社 2024-04-11 WO disclosed
CN-117850164-A Curable resin composition, dry film, cured product, and printed wiring board 太阳控股株式会社 2024-04-09 CN disclosed
CN-102123830-B Abrasive material product, its production method and use method 3M INNOVATIVE PROPERTIES CO 2015-03-18 CN disclosed
CN-104423152-A PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND PRINTED WIRING BOARD TAIYO INK MFG CO LTD 2015-03-18 CN disclosed
CN-102123830-A Abrasive material product, its production method and use method 3M INNOVATIVE PROPERTIES CO 2011-07-13 CN disclosed
CN-1179244-C Photopolymerizable thermosetting resin composition ���ٿƹɷݹ�˾ 2004-12-08 CN disclosed
US-6399277-B1 Photopolymerizable thermosetting resin composition VANTICO INC. 2002-06-04 US disclosed
EP-0909407-B1 PHOTOPOLYMERIZABLE THERMOSETTING RESIN COMPOSITION CIBA SC HOLDING AG (CH) 2000-08-09 EP disclosed
CN-1223727-A Photopolymerizable thermosetting resin composition CIBA SC HOLDING AG (CH) 1999-07-21 CN disclosed
EP-0909407-A1 PHOTOPOLYMERIZABLE THERMOSETTING RESIN COMPOSITION Ciba SC Holding AG (CH) 1999-04-21 EP disclosed
WO-1998000759-A1 PHOTOPOLYMERIZABLE THERMOSETTING RESIN COMPOSITION CIBA SPECIALTY CHEMICALS HOLDING INC. (CH) 1998-01-08 WO disclosed
US-4894317-A Method of forming a printed circuit and the printed circuit formed therefrom KANSAI PAINT CO., LTD. (JP) 1990-01-16 US disclosed