SCHEMBL7758098

SCHEMBL7758098

CCCC(=O)O[SiH](CCC)CCC

nearest known ligand 0.50

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.50
CES2 O00748 1/20 0.38
CES1 P23141 1/20 0.38
HDAC3 O15379 4/20 0.36
HDAC1 Q13547 4/20 0.36
HDAC2 Q92769 4/20 0.36
HDAC8 Q9BY41 4/20 0.36
FFAR3 O14843 3/20 0.36
TSHR P16473 3/20 0.36
HDAC6 Q9UBN7 1/20 0.32
LMNA P02545 1/20 0.32
DGKA P23743 1/20 0.31
CTSD P07339 1/20 0.31
BCL9 O00512 1/20 0.31
CTNNB1 P35222 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7758093 0.83 ALDH1A1 (0.40) ALDH1A1FFAR3TSHR
SCHEMBL7053397 0.83 ALDH1A1 (0.59) ALDH1A1CES2CES1HDAC3HDAC1
SCHEMBL7759950 0.79 ALDH1A1 (0.48) ALDH1A1CES2CES1HDAC3HDAC1
SCHEMBL3809029 0.77 ALDH1A1 (0.57) ALDH1A1CES2CES1HDAC3HDAC1
SCHEMBL12504352 0.76 ALDH1A1 (0.44) ALDH1A1CES2CES1HDAC3HDAC1
SCHEMBL7056877 0.75
SCHEMBL12504305 0.74 ALDH1A1 (0.43) ALDH1A1CES2CES1HDAC3HDAC1
SCHEMBL23529414 0.71 ALDH1A1 (0.50) ALDH1A1CES2CES1HDAC3HDAC1
SCHEMBL7759980 0.71 ALDH1A1 (0.50) ALDH1A1CES2CES1HDAC3HDAC1
SCHEMBL13685 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1085022-A1 A method of manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via Si-C- bonds Dow Corning Asia, Ltd. (JP) 2001-03-21 EP disclosed
US-6060620-A Method for manufacturing an acyloxysilane compound having functional groups bonded to silicon atoms via SI--C bonds DOW CORNING ASIA, LTD. (JP) 2000-05-09 US disclosed