SCHEMBL7760047

SCHEMBL7760047

O=C(OCC(C1=CC2OC2CC1)C1=CC2OC2CC1)OCC(C1=CC2OC2CC1)C1=CC2OC2CC1

nearest known ligand 0.30

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
PPM1B O75688 1/20 0.30
PTPN1 P18031 1/20 0.30
PPP1CC P36873 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5363800 0.73
SCHEMBL3365711 0.67 OAT (0.44)
Ethylene Glycol SCHEMBL6908251 0.66 OAT (0.43)
SCHEMBL21569413 0.65 SLC6A2 (0.32)
SCHEMBL1375382 0.64 CES2 (0.32)
SCHEMBL242205 0.63 TSHR (0.32)
SCHEMBL1376683 0.62 PKM (0.31)
SCHEMBL4560836 0.62
SCHEMBL7962273 0.61
SCHEMBL187260 0.58

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2001088959-A2 NO-FLOW REWORKABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS GEORGIA TECH RESEARCH CORPORATION (US) 2001-11-22 WO claimed
WO-2001072898-A1 THERMALLY DEGRADABLE EPOXY UNDERFILLS FOR FLIP-CHIP APPLICATIONS GEORGIA TECH RESEARCH CORPORATION (US) 2001-10-04 WO claimed