SCHEMBL7766099

SCHEMBL7766099

Cc1ccc(OC(=O)c2ccc(C(=O)O)cc2)c(C(C)(C)C)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
WDR5 P61964 1/20 0.47
RARA P10276 2/20 0.47
RARB P10826 2/20 0.47
RARG P13631 2/20 0.47
SMN1; SMN2 Q16637 2/20 0.46
ALDH1A1 P00352 1/20 0.46
MRGPRX4 Q96LA9 1/20 0.45
RXRA P19793 2/20 0.45
RXRB P28702 2/20 0.45
RXRG P48443 1/20 0.45
EPHX2 P34913 1/20 0.42
NR1H4 Q96RI1 1/20 0.42
SRD5A2 P31213 1/20 0.42
MEN1 O00255 1/20 0.42
NPC1 O15118 1/20 0.42
CYP1A2 P05177 1/20 0.42
CYP2C9 P11712 1/20 0.42
CYP2C19 P33261 1/20 0.42
RAB9A P51151 1/20 0.42
KMT2A Q03164 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7766106 0.94 KMT2A (0.46) SMN1; SMN2NR1H4MEN1NPC1CYP1A2
SCHEMBL11392449 0.90 MAPT (0.49) SMN1; SMN2MRGPRX4MEN1KMT2A
SCHEMBL28945602 0.85 RARB (0.50) WDR5RARARARBRARGALDH1A1
SCHEMBL25492650 0.84 ALDH1A1 (0.53) WDR5RARARARBRARGSMN1; SMN2
Bicarbonate SCHEMBL11154685 0.84 RARB (0.49) WDR5RARARARBRARGALDH1A1
Benzamide SCHEMBL21771961 0.83 PARP10 (0.49) SMN1; SMN2ALDH1A1MRGPRX4MEN1CYP2C19
SCHEMBL10904763 0.83 NR1H4 (0.51) WDR5RARARARBRARGALDH1A1
SCHEMBL13509242 0.82 POLB (0.49) SMN1; SMN2ALDH1A1MEN1KMT2A
SCHEMBL17301254 0.82 NR1H4 (0.57) SMN1; SMN2NR1H4MEN1NPC1CYP1A2
SCHEMBL8459307 0.82 RXRA (0.69) SMN1; SMN2MRGPRX4RXRARXRBRXRG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114539675-A Stable resin composition SABIC环球技术有限责任公司 2022-05-27 CN claimed
EP-0067817-A1 METHOD FOR THE PREPARATION OF SHAPED PARTS OF POLYOLEFINS GEORG FISCHER AKTIENGESELLSCHAFT (CH) 1982-12-29 EP claimed
WO-1982002207-A1 METHOD FOR THE PREPARATION OF SHAPED PARTS OF POLYOLEFINS VOEGELI MARCEL 1982-07-08 WO claimed
EP-4130095-B1 POLYESTER RESIN AND METHOD FOR PRODUCING BLOW MOLDED BODY FORMED OF POLYESTER RESIN TOYO BOSEKI (JP) 2024-07-03 EP disclosed
US-20230151208-A1 COPOLYMERIZED POLYESTER RESIN, HEAT-SHRINKABLE FILM, HEAT-SHRINKABLE LABEL, AND PACKAGED PRODUCT TOYOBO CO., LTD. (JP) 2023-05-18 US disclosed
EP-4130095-A1 POLYESTER RESIN AND METHOD FOR PRODUCING BLOW MOLDED BODY FORMED OF POLYESTER RESIN TOYOBO CO., LTD. (JP) 2023-02-08 EP disclosed
CN-110234700-B Exterior or semi-exterior automotive part SABIC环球技术有限责任公司 2022-11-29 CN disclosed
CN-115397914-A Thermoplastic resin composition, method for producing same, and molded article comprising same 株式会社LG化学 2022-11-25 CN disclosed
CN-115244129-A Thermoplastic resin composition, method for producing same, and molded article comprising same 株式会社LG化学 2022-10-25 CN disclosed
CN-115119512-A Thermoplastic resin composition, method for producing the same, and molded article comprising the same 株式会社LG化学 2022-09-27 CN disclosed
CN-115119513-A Thermoplastic resin composition, method for producing the same, and molded article comprising the same 株式会社LG化学 2022-09-27 CN disclosed
CN-114539675-A Stable resin composition SABIC环球技术有限责任公司 2022-05-27 CN disclosed
CN-113330040-A Polymerizable liquid crystal composition, retardation plate, elliptically polarizing plate, and organic EL display device 住友化学株式会社 2021-08-31 CN disclosed
CN-113169351-A Resin composition for redox flow battery membrane, method for producing redox flow battery membrane using same, and redox flow battery membrane 乐天化学株式会社 2021-07-23 CN disclosed
WO-2020196080-A1 POLYMERIZABLE LIQUID CRYSTAL COMPOSITION, LIQUID CRYSTAL CURED FILM, ELLIPTICALLY POLARIZING PLATE, AND ORGANIC EL DISPLAY DEVICE 住友化学株式会社 2020-10-01 WO disclosed
CN-102138104-B Photosensitive resin composition for protective film of printed wiring board for semiconductor package HITACHI CHEMICAL CO LTD 2013-01-23 CN disclosed
CN-1671764-A Thermosetting resin composition and adhesive film obtained by forming the composition SUMITOMO CHEMICAL CO (JP) 2005-09-21 CN disclosed
EP-1108733-A1 Propylene-ethylene block copolymer, resin composition, and blow-molded article IDEMITSU PETROCHEMICAL CO., LTD. (JP) 2001-06-20 EP disclosed
US-5405904-A Blends of aromatic polyamides, graft-modified alpha olefin random copolymers, vinyl aromatic hydrocarbon-conjugated-diene copolymer, polyethylene wax and metal acid salts; tough, heat resistance, lightweight MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1995-04-11 US disclosed