⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL397660 | 0.84 | — | — | |
| SCHEMBL2400701 | 0.84 | TSHR (0.32) | — | |
| SCHEMBL397678 | 0.81 | — | — | |
| SCHEMBL12973427 | 0.77 | DNM1 (0.33) | — | |
| SCHEMBL22462196 | 0.77 | ALDH1A1 (0.32) | — | |
| SCHEMBL22462195 | 0.77 | ALDH1A1 (0.32) | — | |
| SCHEMBL3465953 | 0.77 | — | — | |
| SCHEMBL3623131 | 0.76 | — | — | |
| SCHEMBL19532759 | 0.76 | OPRM1 (0.36) | — | |
| SCHEMBL3465318 | 0.75 | DNM1 (0.35) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4720163-A1 | SILOXANE COMPOSITION FOR LOWER TEMPERATURE ADHESION | GELEST, INC. (US) | 2026-04-08 | — | — | EP | disclosed |
| US-20260062519-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, LAYERED BODY, AND OPTICAL DEVICE OR OPTICAL DISPLAY | DOW TORAY CO LTD (JP) | 2026-03-05 | — | — | US | disclosed |
| US-12552936-B2 | Curable organopolysiloxane composition and cured product thereof, protective agent or adhesive, and electric/electronic device | DOW TORAY CO., LTD. (JP) | 2026-02-17 | — | — | US | disclosed |
| EP-3868833-B1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION HAVING EXCELLENT COLD RESISTANCE, PATTERN FORMING METHOD, ELECTRONIC COMPONENTS, ETC | DOW TORAY CO LTD (JP) | 2025-09-03 | — | — | EP | disclosed |
| EP-4574910-A1 | CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, LAYERED BODY, AND OPTICAL DEVICE OR OPTICAL DISPLAY | Dow Toray Co., Ltd. (JP) | 2025-06-25 | — | — | EP | disclosed |
| CN-120118523-A | Curable polyorganosiloxane composition, cured product thereof, protective agent or adhesive, and electric/electronic device | 陶氏东丽株式会社 | 2025-06-10 | — | — | CN | disclosed |
| CN-119790108-A | Curable silicone composition, cured product thereof, laminate, and optical device or optical display | 陶氏东丽株式会社 | 2025-04-08 | — | — | CN | disclosed |
| US-20240400827-A1 | SILOXANE COMPOSITION FOR LOWER TEMPERATURE ADHESION | GELEST, INC. | 2024-12-05 | — | — | US | disclosed |
| WO-2024248900-A1 | SILOXANE COMPOSITION FOR LOWER TEMPERATURE ADHESION | GELEST, INC. (US) | 2024-12-05 | — | — | WO | disclosed |
| US-20240376347-A1 | CURABLE HOT MELT ORGANOPOLYSILOXANE COMPOSITION, CURED PRODUCT THEREOF AND METHOD FOR PRODUCING FILM, ETC. COMPRISING SAME | DOW TORAY CO LTD (JP) | 2024-11-14 | — | — | US | disclosed |
| US-20140288246-A1 | Multi-Component Room-Temperature-Curable Silicone Elastomer Composition | DOW CORNING TORAY CO., LTD. (JP) | 2014-09-25 | — | — | US | disclosed |
| US-20140256539-A1 | SILANOL CONDENSATION CATALYST, HEAT-CURABLE SILICONE RESIN COMPOSITION FOR SEALING PHOTOSEMICONDUCTORS AND SEALED PHOTOSEMICONDUCTOR USING SAME | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2014-09-11 | — | — | US | disclosed |
| US-20140238471-A1 | Multi-Component Type Curable Silicone Rubber Composition, Material For Electronic Parts Using Such, And Solar Cell Module | DOW CORNING TORAY CO LTD (JP) | 2014-08-28 | — | — | US | disclosed |
| EP-2768885-A1 | MULTI-COMPONENT ROOM-TEMPERATURE-CURABLE SILICONE ELASTOMER COMPOSITION | Dow Corning Toray Co., Ltd. (JP) | 2014-08-27 | — | — | EP | disclosed |
| US-8772431-B2 | Silanol condensation catalyst, heat-curable silicone resin composition for sealing photosemiconductors and sealed photosemiconductor using same | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2014-07-08 | — | — | US | disclosed |
| WO-2013100175-A1 | MULTI-COMPONENT TYPE CURABLE SILICONE RUBBER COMPOSITION, MATERIAL FOR ELECTRONIC PARTS USING SUCH, AND SOLAR CELL MODULE | DOW CORNING TORAY CO., LTD. (JP) | 2013-07-04 | — | — | WO | disclosed |
| WO-2013058293-A1 | MULTI-COMPONENT ROOM-TEMPERATURE-CURABLE SILICONE ELASTOMER COMPOSITION | DOW CORNING TORAY CO., LTD. (JP) | 2013-04-25 | — | — | WO | disclosed |
| US-8304489-B2 | Curable silicone resin composition | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2012-11-06 | — | — | US | disclosed |
| US-20120071604-A1 | CURABLE SILICONE RESIN COMPOSITION | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2012-03-22 | — | — | US | disclosed |
| US-20110248314-A1 | SILANOL CONDENSATION CATALYST, HEAT-CURABLE SILICONE RESIN COMPOSITION FOR SEALING PHOTOSEMICONDUCTORS AND SEALED PHOTOSEMICONDUCTOR USING SAME | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2011-10-13 | — | — | US | disclosed |