⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7621894 | 0.92 | — | — | |
| SCHEMBL14024194 | 0.86 | GABRR1 (0.30) | — | |
| Bromide SCHEMBL28686512 | 0.86 | LMNA (0.43) | — | |
| SCHEMBL28282472 | 0.84 | CPB2 (0.31) | — | |
| SCHEMBL25182938 | 0.83 | DNM1 (0.35) | — | |
| SCHEMBL9394728 | 0.83 | DNM1 (0.35) | — | |
| Diaminooctane SCHEMBL28334949 | 0.83 | DNM1 (0.35) | — | |
| SCHEMBL24748379 | 0.83 | — | — | |
| SCHEMBL24396 | 0.81 | ALDH1A1 (0.32) | — | |
| SCHEMBL8643910 | 0.79 | CPB2 (0.31) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4663703-A1 | POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE | Mitsui Chemicals, Inc. (JP) | 2025-12-17 | — | — | EP | disclosed |
| EP-4663374-A1 | POLYAMIDE RESIN COMPOSITION FOR INSERT MOLDING, METAL RESIN COMPOSITE BODY AND METHOD FOR PRODUCING SAME | Mitsui Chemicals, Inc. (JP) | 2025-12-17 | — | — | EP | disclosed |
| EP-4582484-A1 | POLYAMIDE RESIN COMPOSITION, METAL/RESIN JOINED BODY AND METHOD FOR PRODUCING SAME, BUS BAR UNIT, DRIVE UNIT, AND MOBILE OBJECT | Mitsui Chemicals, Inc. (JP) | 2025-07-09 | — | — | EP | disclosed |
| WO-2025084296-A1 | POLYAMIDE RESIN COMPOSITION AND MOLDED OBJECT | 三井化学株式会社 | 2025-04-24 | — | — | WO | disclosed |
| WO-2024166903-A1 | POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE | 三井化学株式会社 | 2024-08-15 | — | — | WO | disclosed |
| WO-2024048508-A1 | POLYAMIDE RESIN COMPOSITION, METAL/RESIN JOINED BODY AND METHOD FOR PRODUCING SAME, BUS BAR UNIT, DRIVE UNIT, AND MOBILE OBJECT | 三井化学株式会社 | 2024-03-07 | — | — | WO | disclosed |
| EP-4130140-A1 | SEMI-AROMATIC POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLES THEREFROM | Mitsui Chemicals, Inc. (JP) | 2023-02-08 | — | — | EP | disclosed |
| CN-108473691-B | The manufacturing method of molded product | 三菱瓦斯化学株式会社 | 2019-04-05 | — | — | CN | disclosed |
| CN-108473691-A | The manufacturing method of molded product | 三菱瓦斯化学株式会社 | 2018-08-31 | — | — | CN | disclosed |
| US-6319986-B1 | BLEND OF COPOLYAMIDE FROM TEREPHTHALIC ACID AND MIXTURE OF STRAIGHT-CHAIN AND BRANCH-CHAIN ALKYLENEDIAMINES; COPOLYAMIDE OF DODECANOLACTAM AND DODECANEDIOIC ACID AND DIAMINE; AND GRAFTED OLEFIN COPOLYMER | MITSUI CHEMICALS (JP) | 2001-11-20 | — | — | US | disclosed |
| US-6117942-A | GRAFT-MODIFIED ETHYLENE-ALPHA OLEFIN COPOLYMER, A POLYTEREPHTHALAMIDE EXHIBITS EXCELLENT ANTI-CREEPING PROPERTY UNDER HIGH-TEMPERATURE AND HIGH-HUMIDITY CONDITIONS, MOLDING MATERIAL | MITSUI CHEMICALS (JP) | 2000-09-12 | — | — | US | disclosed |
| EP-0864610-A1 | Semiaromatic polyamide resin composition | Mitsui Chemicals, Inc. (JP) | 1998-09-16 | — | — | EP | disclosed |