SCHEMBL7896869

SCHEMBL7896869

Oc1cccc(Cl)c1-c1ccc(Cl)cc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.48
ALDH1A1 P00352 2/20 0.46
ALOX5 P09917 2/20 0.43
CYP1A2 P05177 1/20 0.41
CNR1 P21554 1/20 0.40
HSP90AA1 P07900 1/20 0.40
AR P10275 1/20 0.40
TNKS O95271 1/20 0.38
PARP1 P09874 1/20 0.38
TNKS2 Q9H2K2 1/20 0.38
HSD17B10 Q99714 2/20 0.38
CYP3A4 P08684 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
HSD17B1 P14061 1/20 0.38
HSD17B2 P37059 1/20 0.38
AHR P35869 1/20 0.37
MEN1 O00255 1/20 0.37
NPC1 O15118 1/20 0.37
RAB9A P51151 1/20 0.37
KMT2A Q03164 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27522728 0.89 ALOX5 (0.48) TSHRALDH1A1ALOX5CYP1A2CNR1
SCHEMBL1022491 0.84 ALDH1A1 (0.54) TSHRALDH1A1CYP1A2HSP90AA1HSD17B10
SCHEMBL4456487 0.84 CYP1A2 (0.50) TSHRALDH1A1CYP1A2CNR1HSD17B10
SCHEMBL2939513 0.79 ALOX15 (0.43) TSHRALDH1A1ALOX5CYP1A2AR
SCHEMBL4997683 0.79 TSHR (0.59) TSHRALDH1A1ALOX5CYP1A2HSP90AA1
SCHEMBL25893532 0.78 ALOX5 (0.44) TSHRALDH1A1ALOX5CYP1A2CNR1
SCHEMBL28066782 0.75 ESR1 (0.48) TSHRALDH1A1HSD17B10HSD17B1HSD17B2
SCHEMBL2934393 0.74 ALDH1A1 (0.46) TSHRALDH1A1ALOX5CYP1A2AR
SCHEMBL14860351 0.74 GRIA1 (0.51) TSHRALDH1A1CYP1A2TNKSTNKS2
SCHEMBL25501416 0.74 CYP1A2 (0.41) TSHRALDH1A1CYP1A2CNR1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6190759-B1 ELECTRONIC PACKAGE COMPRISING DIELECTRIC LAYER AND CONDUCTIVE LAYER, SAID DIELECTRIC LAYER INCLUDING REINFORCING MATERIAL, RESIN MATERIAL SELECTED FROM EPOXY, CYANATE AND BISMALEIMIDE RESINS, COLORING AGENT, AND FLUORESCING AGENT INTERNATIONAL BUSINESS MACHINES CORPORATION 2001-02-20 US disclosed
US-6187417-B1 Substrate having high optical contrast and method of making same INTERNATIONAL BUSINESS MACHINES CORPORATION 2001-02-13 US disclosed
US-5238773-A Alkaline developable photoresist composition containing radiation sensitive organosilicon compound with quinone diazide terminal groups INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1993-08-24 US disclosed
EP-0365881-A2 Composition capable of being imaged and use of such a composition International Business Machines Corporation (US) 1990-05-02 EP disclosed