SCHEMBL7913152

SCHEMBL7913152

CCCC(=O)C(CCC)C(C)=O

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 2/20 0.38
CES1 P23141 2/20 0.38
HDAC1 Q13547 5/20 0.37
HDAC2 Q92769 5/20 0.37
CHRM1 P11229 1/20 0.37
AKR1A1 P14550 1/20 0.37
CHRM3 P20309 1/20 0.37
HTR2A P28223 1/20 0.37
HTR2C P28335 1/20 0.37
ADRA1A P35348 1/20 0.37
HRH1 P35367 1/20 0.37
DRD3 P35462 1/20 0.37
SLC6A3 Q01959 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
HDAC8 Q9BY41 5/20 0.36
HDAC3 O15379 4/20 0.36
FFAR3 O14843 3/20 0.36
TSHR P16473 3/20 0.36
CYP3A4 P08684 2/20 0.36
NFKB1 P19838 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7916213 0.86 CES1 (0.43) CES2CES1ALDH1A1
SCHEMBL14597251 0.86 ACHE (0.39) CES2CES1
SCHEMBL7916149 0.83 TDP1 (0.39) HDAC1HDAC2CHRM1AKR1A1CHRM3
SCHEMBL7905901 0.83 CES2 (0.39) CES2CES1HDAC1HDAC2HDAC8
SCHEMBL10886321 0.83 HDAC1 (0.50) CES2CES1HDAC1HDAC2CHRM1
SCHEMBL452330 0.82 TDP1 (0.46) CES2CES1HDAC1HDAC2CHRM1
SCHEMBL27780473 0.81 CES2 (0.38) CES2CES1HDAC1HDAC2HDAC8
SCHEMBL7913099 0.81 ALDH1A1 (0.39) CES2CES1HDAC1HDAC2CHRM1
SCHEMBL28820028 0.80 SMN1; SMN2 (0.34) CES2CES1HDAC1HDAC2CHRM1
SCHEMBL15455666 0.79 TDP1 (0.43) CES2CES1HDAC1HDAC2CHRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6207739-B1 Polyamide acid composition containing metal, polyimide film, flexible printed wiring board and method for producing them KANEGAFUCHI KAGAKU KOGYO KABUSHIKI (JP) 2001-03-27 US disclosed
EP-0114059-B1 METHOD OF PREPARING A POLYAMIDE ACID COMPOSITION FOR PREPARING POLYIMIDE KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1989-06-14 EP disclosed
EP-0083690-B1 POLYAMIDE ACID COMPOSITION FOR PREPARING POLYIMIDE AND PROCESS FOR PREPARING POLYIMIDE FROM THE SAME KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1986-03-12 EP disclosed
US-4515915-A Polyamide acid composition for preparing polyimide KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1985-05-07 US disclosed
EP-0114059-A2 Method of preparing a polyamide acid composition for preparing polyimide KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1984-07-25 EP disclosed
US-4454276-A POT LIFE EXTENDING AGENT Kanegafuchi Chkagaku Kogyo Kabushiki Kaisha (JP) 1984-06-12 US disclosed
EP-0083690-A1 Polyamide acid composition for preparing polyimide and process for preparing polyimide from the same KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1983-07-20 EP disclosed