SCHEMBL7929101

SCHEMBL7929101

O=S(=O)(Cc1cccc(O)c1)Cc1cccc(O)c1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ENPP2 Q13822 1/20 0.54
MGLL Q99685 1/20 0.50
DRD2 P14416 1/20 0.50
DRD1 P21728 1/20 0.50
TAAR1 Q96RJ0 1/20 0.50
CYP3A4 P08684 2/20 0.48
CYP1A2 P05177 1/20 0.48
PKM P14618 1/20 0.48
ALOX15 P16050 1/20 0.48
NFKB1 P19838 1/20 0.48
MAPK1 P28482 1/20 0.48
LMNA P02545 2/20 0.47
KMT2A Q03164 2/20 0.47
KDM4E B2RXH2 1/20 0.47
MAPT P10636 1/20 0.47
BLM P54132 1/20 0.47
PMP22 Q01453 1/20 0.47
MMP2 P08253 1/20 0.46
ALDH1A1 P00352 2/20 0.46
CA12 O43570 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8532609 0.87 ENPP2 (0.54) ENPP2MGLLDRD2DRD1TAAR1
SCHEMBL1577595 0.83 ENPP2 (0.50) ENPP2MGLLDRD2DRD1TAAR1
SCHEMBL29650395 0.83 ENPP2 (0.50) ENPP2MGLLDRD2DRD1TAAR1
SCHEMBL27361352 0.79 MGLL (0.60) ENPP2MGLLDRD2DRD1TAAR1
SCHEMBL26659340 0.79 CYP1A2 (0.46) ENPP2MGLLDRD2DRD1TAAR1
SCHEMBL16938221 0.79 MMP2 (0.55) ENPP2MGLLDRD2DRD1TAAR1
SCHEMBL30680228 0.79 CYP1A2 (0.46) ENPP2MGLLDRD2DRD1TAAR1
SCHEMBL28537078 0.76 CYP1A2 (0.47) ENPP2MGLLDRD2DRD1TAAR1
SCHEMBL23714486 0.75 HPGD (0.63) KMT2AKDM4EMAPTALDH1A1
SCHEMBL3928821 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5385990-A Blend of epoxy compound, amine hardener and hydroxy substituted aromatic compound LORD CORPORATION (US) 1995-01-31 US claimed
EP-0596622-A2 Epoxy resin structural adhesive composition having high temperature resistance LORD CORPORATION (US) 1994-05-11 EP claimed
US-6242654-B1 REACTING A PHENOLATE COMPOUND WITH AN ORGANIC FLUORINATING AGENT TO PREPARE A FLUORINE SUBSTITUTED AROMATIC COMPOUND MITSUI CHEMICALS, INC. (JP) 2001-06-05 US disclosed
EP-1013629-A1 Preparation process of fluorine subsituted aromatic compound Mitsui Chemicals, Inc. (JP) 2000-06-28 EP disclosed
US-5385990-A Blend of epoxy compound, amine hardener and hydroxy substituted aromatic compound LORD CORPORATION (US) 1995-01-31 US disclosed
EP-0596622-A2 Epoxy resin structural adhesive composition having high temperature resistance LORD CORPORATION (US) 1994-05-11 EP disclosed