SCHEMBL686767

SCHEMBL686767

NCc1c(CC2CO2)c(CN)c(CC2CO2)c(CC2CO2)c1CC1CO1

nearest known ligand 0.33

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
TP53 P04637 1/20 0.32
HBB P68871 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL912784 1.00 ALDH1A1 (0.33) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL9178335 1.00 ALDH1A1 (0.33) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL8026352 0.79 ALDH1A1 (0.33) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL18428573 0.78 MEN1 (0.42) TDP1SMN1; SMN2
SCHEMBL6924763 0.77 ALDH1A1 (0.32) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL30490439 0.77
SCHEMBL132722 0.76 ALDH1A1 (0.35) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL30865852 0.74 ALDH1A1 (0.33) ALDH1A1TDP1TP53HBBSMN1; SMN2
SCHEMBL6678130 0.73 PNMT (0.38) ALDH1A1TDP1TP53SMN1; SMN2
SCHEMBL21114057 0.72 ALDH1A1 (0.32) ALDH1A1TDP1TP53HBBSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 661 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4573143-A1 COATING COMPOSITIONS PPG Industries Ohio Inc. (US) 2025-06-25 EP claimed
CN-120118480-A Degradable epoxy resin composite material with adjustable curing speed and preparation and moderate full recycling methods thereof 哈尔滨工业大学 2025-06-10 CN claimed
EP-4563615-A1 USE OF POLYFUNCTIONAL EPOXY COMPOUNDS FOR IMPROVING PROPERTIES OF A CHEMICAL DOWEL Hilti Aktiengesellschaft (LI) 2025-06-04 EP claimed
CN-119768448-A Coating composition PPG工业俄亥俄公司 2025-04-04 CN claimed
CN-118420226-B Conductive glass for thin film solar cell, and preparation method and application thereof 淄博金晶新能源有限公司 2024-10-22 CN claimed
CN-118420226-A Conductive glass for thin film solar cell, and preparation method and application thereof 淄博金晶新能源有限公司 2024-08-02 CN claimed
CN-113861878-B High temperature resistant protection film 合肥乐凯科技产业有限公司 2024-05-14 CN claimed
CN-117925049-A Waterproof epoxy resin film and preparation method and application thereof 北京云上星辰数字科技有限公司 2024-04-26 CN claimed
CN-117701232-A Low-dielectric non-fluorine modified polyimide and preparation method and application thereof 华烁科技股份有限公司 2024-03-15 CN claimed
WO-2024040260-A1 COATING COMPOSITIONS PPG INDUSTRIES OHIO, INC. (US) 2024-02-22 WO claimed
CN-117050318-B Modified saturated carbon ring type epoxy resin and preparation method and application thereof 络合高新材料(上海)有限公司 2023-12-19 CN claimed
CN-117050318-A Modified saturated carbon ring type epoxy resin and preparation method and application thereof 络合高新材料(上海)有限公司 2023-11-14 CN claimed
EP-1221453-B1 Curing agent composition and curable epoxy resin composition ASAHI DENKA KOGYO KK (JP) 2004-12-08 EP claimed
US-6498200-B1 OXIRANE OR OXETANE RING COMPOUND, ORGANIC PEROXIDE, ONIUM SALT CATALYST, AND ALKALINE FILLER; CURES RAPIDLY; STABLE DOES NOT CAUSE INCREASE IN ELECTROCONDUCTIVITY OR CORROSION; SEALANT, BINDER, ENCAPSULATING AGENT, DIELECTRIC FILM NAMICS CORPORATION (JP) 2002-12-24 US claimed
US-20020132955-A1 Curing agent composition and curing epoxy resin composition ASAHI DENKA KOGYO KABUSHIKI KAISHA 2002-09-19 US claimed
US-6451931-B1 REACTION PRODUCT OF AMINE, DIHYDRAZIDE AND POLYISOCYANATE ASAHI DENKI KOGYO KABUSHIKI KAISHA (JP) 2002-09-17 US claimed
EP-1221453-A1 Curing agent composition and curable epoxy resin composition ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 2002-07-10 EP claimed
US-4880881-A POLYETHERS, EPOXY COMPOUNDS TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) 1989-11-14 US claimed
JP-61120875-A None JP disclosed
EP-0135027-A2 Polymer composition Du Pont-Mitsui Polychemicals Co., Ltd. (JP) 1985-03-27 EP disclosed