Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | HBB | P68871 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL686767 | 1.00 | ALDH1A1 (0.33) | ALDH1A1TDP1TP53HBBSMN1; SMN2 | |
| SCHEMBL9178335 | 1.00 | ALDH1A1 (0.33) | ALDH1A1TDP1TP53HBBSMN1; SMN2 | |
| SCHEMBL8026352 | 0.79 | ALDH1A1 (0.33) | ALDH1A1TDP1TP53HBBSMN1; SMN2 | |
| SCHEMBL18428573 | 0.78 | MEN1 (0.42) | TDP1SMN1; SMN2 | |
| SCHEMBL6924763 | 0.77 | ALDH1A1 (0.32) | ALDH1A1TDP1TP53HBBSMN1; SMN2 | |
| SCHEMBL30490439 | 0.77 | — | — | |
| SCHEMBL132722 | 0.76 | ALDH1A1 (0.35) | ALDH1A1TDP1TP53HBBSMN1; SMN2 | |
| SCHEMBL30865852 | 0.74 | ALDH1A1 (0.33) | ALDH1A1TDP1TP53HBBSMN1; SMN2 | |
| SCHEMBL6678130 | 0.73 | PNMT (0.38) | ALDH1A1TDP1TP53SMN1; SMN2 | |
| SCHEMBL21114057 | 0.72 | ALDH1A1 (0.32) | ALDH1A1TDP1TP53HBBSMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 407 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119418980-A | Low-silver conductive paste for low-temperature cured HJT battery and preparation method thereof | 无锡帝科电子材料股份有限公司 | 2025-02-11 | — | — | CN | claimed |
| CN-118667091-A | NIR-II laser-assisted epoxy resin cationic polymerization method | 北京化工大学 | 2024-09-20 | — | — | CN | claimed |
| CN-117946598-A | Chip-scale filter packaging film, filter chip and preparation method of filter chip | 武汉市三选科技有限公司 | 2024-04-30 | — | — | CN | claimed |
| CN-116836388-B | Positive photosensitive resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-12-15 | — | — | CN | claimed |
| CN-116836388-A | Positive photosensitive resin, resin composition, preparation method and application thereof | 明士(北京)新材料开发有限公司 | 2023-10-03 | — | — | CN | claimed |
| CN-116003979-A | Polyglycolic acid resin with high melt viscosity and high thermal stability, and preparation method and application thereof | 中国石油化工股份有限公司 | 2023-04-25 | — | — | CN | claimed |
| WO-2023000582-A1 | PREPARATION METHOD FOR TWO-COMPONENT EPOXY RESIN ADHESIVE AND TWO-COMPONENT EPOXY RESIN ADHESIVE PREPARED THEREBY | 沃顿科技股份有限公司 | 2023-01-26 | — | — | WO | claimed |
| CN-107793991-B | Copper-clad laminate for flexible printed wiring board, and flexible printed wiring board | 荒川化学工业株式会社 | 2022-03-08 | — | — | CN | claimed |
| CN-112457744-A | Graphene modified anticorrosive paint and preparation method thereof | 四川科嘉能源科技有限公司 | 2021-03-09 | — | — | CN | claimed |
| US-9963589-B2 | Epoxy resin composition, prepreg, and fiber-reinforced composite material | TORAY INDUSTRIES, INC. (JP) | 2018-05-08 | — | — | US | claimed |
| EP-0126494-B1 | IMPACT RESISTANT MATRIX RESINS FOR ADVANCED COMPOSITES | AMOCO CORPORATION (US) | 1986-07-09 | — | — | EP | claimed |
| US-20260146169-A1 | CATIONIC ELECTRODEPOSITION COATING MATERIAL COMPOSITION | AXALTA SHINTO COATING SYSTEMS CO., LTD. (JP) | 2026-05-28 | — | — | US | disclosed |
| EP-3746500-B1 | PREPREG SHEETS AND PREPREG STACKS USEFUL FOR PREPARING LOW VOID CONTENT FIBER-REINFORCED COMPOSTITE MATERIALS | TORAY INDUSTRIES (JP) | 2026-04-15 | — | — | EP | disclosed |
| EP-4063457-B1 | THERMOSETTING RESIN COMPOSITION, THERMOSETTING RESIN CURED PRODUCT, PREPREG AND FIBER-REINFORCED COMPOSITE MATERIAL | TORAY INDUSTRIES (JP) | 2026-03-04 | — | — | EP | disclosed |
| EP-4685186-A1 | EPOXY RESIN COMPOSITION AND METHOD FOR PRODUCING SAME | NIPPON STEEL CORPORATION (JP) | 2026-01-28 | — | — | EP | disclosed |
| EP-0229770-B1 | EPOXY/AROMATIC AMINE RESIN SYSTEMS CONTAINING AROMATIC TRIHYDROXY COMPOUNDS AS CURE ACCELERATORS | AMOCO CORPORATION (US) | 1990-09-12 | — | — | EP | disclosed |
| EP-0148534-B1 | BISMALEIMIDES AND PREPREG RESINS THEREFROM | AMOCO CORPORATION (US) | 1989-03-15 | — | — | EP | disclosed |
| EP-0135647-B1 | EPOXY COMPOSITIONS CONTAINING SUBSTITUTED DIAMINE HARDENERS | AMOCO CORPORATION (US) | 1988-07-06 | — | — | EP | disclosed |
| EP-0239804-A1 | Epoxy resins based on tetraglycidyl diamines and the use thereof for epoxy systems and prepregs | AMOCO CORPORATION (US) | 1987-10-07 | — | — | EP | disclosed |
| EP-0130270-B1 | EPOXY COMPOSITIONS CONTAINING OLIGOMERIC DIAMINE HARDENERS AND HIGH STRENGTH COMPOSITES THEREFROM | AMOCO CORPORATION (US) | 1987-07-29 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20260146169-A1 | CATIONIC ELECTRODEPOSITION COATING MATERIAL COMPOSITION | EHMT1, EZH2, SEM1 | ALDH1A1 2134/4885TDP1 1475/4885TP53 2021/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.