SCHEMBL810668

SCHEMBL810668

CCc1nc(C)cn1C(C)C#N.CCc1nc(C)cn1C(C)C#N.CCc1nc(C)cn1C(C)C#N.O=C(O)c1ccc(C(=O)O)c(C(=O)O)c1

nearest known ligand 0.34

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 2/20 0.34
KMT2A Q03164 2/20 0.34
NPC1 O15118 2/20 0.34
RAB9A P51151 2/20 0.34
MYC P01106 1/20 0.34
KDM4E B2RXH2 1/20 0.34
CYP19A1 P11511 1/20 0.34
SORT1 Q99523 2/20 0.34
ACE2 Q9BYF1 2/20 0.33
POLB P06746 1/20 0.33
PABPC1 P11940 1/20 0.33
PDE4A P27815 1/20 0.32
PDE4B Q07343 1/20 0.32
PDE4C Q08493 1/20 0.32
PDE4D Q08499 1/20 0.32
HCAR3 P49019 2/20 0.32
HSD17B10 Q99714 2/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
CDC25A P30304 1/20 0.32
CDC25B P30305 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3033418 1.00 MEN1 (0.34) MEN1KMT2ANPC1RAB9AMYC
SCHEMBL29713436 0.78 CYP19A1 (0.41) MEN1KMT2ANPC1RAB9AMYC
SCHEMBL29389456 0.78 CYP19A1 (0.41) MEN1KMT2ANPC1RAB9AMYC
SCHEMBL1695811 0.75 MYC (0.37) RAB9AMYCKDM4EACE2POLB
SCHEMBL811490 0.75 MYC (0.37) RAB9AMYCKDM4EACE2POLB
SCHEMBL28081900 0.73 ALDH1A1 (0.31)
SCHEMBL217673 0.72 ALDH1A1 (0.40)
SCHEMBL346573 0.72 ALDH1A1 (0.40)
SCHEMBL27709983 0.72 RAB9A (0.36) MEN1KMT2ANPC1RAB9AMYC
SCHEMBL23203187 0.72 ALDH1A1 (0.35) MEN1KMT2ANPC1RAB9AMYC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 122 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112724867-B Insulating adhesive film material and preparation method and application thereof 深圳先进技术研究院 2023-01-10 CN claimed
CN-111763403-A Liquid epoxy resin composition and preparation method and application thereof 深圳先进电子材料国际创新研究院 2020-10-13 CN claimed
US-20080261049-A1 Electroconductive Paste and Substrate Using the Same for Mounting Electronic Parts HITACHI CHEMICAL COMPANY, LTD. (JP) 2008-10-23 US claimed
US-20060051587-A1 Thermosetting resin composition and adhesive film SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2006-03-09 US claimed
EP-4582235-A1 METHOD OF PRODUCING CARBON FIBER BUNDLE COMPOSITE AND METHOD OF PRODUCING CARBON FIBER COMPOSITE SHEET Mitsubishi Chemical Corporation (JP) 2025-07-09 EP disclosed
EP-4578884-A2 RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED PLASTIC Mitsubishi Chemical Corporation (JP) 2025-07-02 EP disclosed
EP-4563630-A1 PREPREG, FIBER-REINFORCED COMPOSITE MATERIAL, AND FIBER-REINFORCED COMPOSITE MATERIAL MANUFACTURING METHOD Mitsubishi Chemical Corporation (JP) 2025-06-04 EP disclosed
US-20250163229-A1 PREPREG, FIBER-REINFORCED COMPOSITE ARTICLE, AND METHOD OF PRODUCING FIBER-REINFORCED COMPOSITE ARTICLE MITSUBISHI CHEMICAL CORPORATION (JP) 2025-05-22 US disclosed
CN-119585346-A Prepreg, fiber-reinforced composite material, and method for producing fiber-reinforced composite material 三菱化学株式会社 2025-03-07 CN disclosed
US-20250073958-A1 METHOD FOR PRODUCING CARBON FIBER BUNDLE COMPOSITE AND METHOD FOR PRODUCING CARBON FIBER BUNDLE COMPOSITE SHEET MITSUBISHI CHEMICAL CORPORATION (JP) 2025-03-06 US disclosed
WO-2025027951-A1 PREPREG AND FIBER-REINFORCED PLASTIC 三菱ケミカル株式会社 2025-02-06 WO disclosed
CN-119307169-A Curable composition, cured product, overcoat film for flexible wiring board, and method for producing flexible wiring board 日保丽公司 2025-01-14 CN disclosed
EP-0747399-A2 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1996-12-11 EP disclosed
US-5512628-A COMBINING A PIPERAZINYLETHYLAMINOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE COPOLYMER WITH A MALEIMIDE CONTAINING COMPOUND IN AN ORGANIC SOLVENT; CURABLE TOMOEGAWA PAPER CO., LTD. (JP) 1996-04-30 US disclosed
US-5510189-A COMPRISING A PIPERAZINYLETHYLAMINOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE COPOLYMER AND A MALEIMIDE COMPOUND; ADHERED AND CURED AT LOW TEMPERATURE; HEAT RESISTANCE TOMOEGAWA PAPER CO., LTD. (JP) 1996-04-23 US disclosed
US-5500294-A MODIFIED ACRYLONITRILE-BUTADIENE COPOLYMER TOMOEGAWA PAPER CO., LTD. (JP) 1996-03-19 US disclosed
US-5494757-A BLEND OF A PIPERAZINYLETHYLAMIDOCARBONYL-CONTAINING BUTADIENE-ACRYLONITRILE TERPOLYMER AND A MALEIMIDE RESIN TOMOEGAWA PAPER CO., LTD. (JP) 1996-02-27 US disclosed
US-5446080-A Piperazinylethylaminocarbonyl containing acrylonitrile-butadiene copolymer and bismaleimide compound TOMOEGAWA PAPER CO., LTD. (JP) 1995-08-29 US disclosed
EP-0649892-A1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1995-04-26 EP disclosed
EP-0649893-A1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO. LTD. (JP) 1995-04-26 EP disclosed