SCHEMBL81086

SCHEMBL81086

Cc1nc(CCC#N)c[nH]1

nearest known ligand 0.31

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
APOBEC3G Q9HC16 1/20 0.30
ATM Q13315 1/20 0.30
L3MBTL1 Q9Y468 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8648415 0.83 THRB (0.33)
SCHEMBL9237749 0.80
SCHEMBL1695812 0.79 KDM5A (0.38) MEN1KMT2AL3MBTL1
SCHEMBL31536694 0.78 MEN1 (0.32) MEN1KMT2AATML3MBTL1
SCHEMBL19689367 0.78
SCHEMBL8611446 0.78
SCHEMBL30586310 0.77 SMN1; SMN2 (0.31)
Propionitrile SCHEMBL27976984 0.77 ALDH1A1 (0.35)
SCHEMBL1985579 0.77 CTSK (0.31) KMT2AL3MBTL1
SCHEMBL8589014 0.77 ATM (0.31) ATML3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 233 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118206718-A Core-shell material and preparation method thereof 华为技术有限公司 2024-06-18 CN claimed
EP-3728414-A1 A CURATIVE COMPOSITION AND A RESIN COMPOSITION CONTAINING THE CURATIVE COMPOSITION Hexcel Composites Limited (GB) 2020-10-28 EP claimed
EP-3548574-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES Momentive Performance Materials Inc. (US) 2019-10-09 EP claimed
EP-3344676-A1 CYANATE ESTER DUAL CURE RESINS FOR ADDITIVE MANUFACTURING CARBON, INC. (US) 2018-07-11 EP claimed
WO-2018102509-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2018-06-07 WO claimed
EP-2915848-B1 THERMOSETTING RESIN COMPOSITION AND USE THEREOF SHENGYI TECHNOLOGY CO LTD (CN) 2018-05-30 EP claimed
WO-2017040883-A1 CYANATE ESTER DUAL CURE RESINS FOR ADDITIVE MANUFACTURING CARBON, INC. (US) 2017-03-09 WO claimed
EP-3115416-A1 THERMOSETTING RESIN COMPOSITION AND USE THEREOF Shengyi Technology Co., Ltd. (CN) 2017-01-11 EP claimed
US-9193858-B2 Thermoset resin composition and its use GUANGDONG SHENGYI SCI. TECH CO., LTD. (CN) 2015-11-24 US claimed
EP-2915848-A1 THERMOSETTING RESIN COMPOSITION AND USE THEREOF Shengyi Technology Co., Ltd. (CN) 2015-09-09 EP claimed
EP-1194953-A1 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2002-04-10 EP claimed
WO-2001074798-A1 REWORKABLE COMPOSITION OF OXIRANE(S) OR THIIRANE(S)-CONTAINING RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2001-10-11 WO claimed
EP-1090057-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2001-04-11 EP claimed
WO-2000079582-A9 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORP (US) 2001-03-15 WO claimed
WO-2000079582-A1 CONTROLLABLY DEGRADABLE COMPOSITION OF HETEROATOM CARBOCYCLIC OR EPOXY RESIN AND CURING AGENT LOCTITE CORPORATION (US) 2000-12-28 WO claimed
WO-2000056799-A1 REWORKABLE THERMOSETTING RESIN COMPOSITIONS LOCTITE CORPORATION (US) 2000-09-28 WO claimed
EP-0858725-A1 MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME Sumitomo Bakelite Company Limited (JP) 1998-08-19 EP claimed
WO-1997016948-A1 MULTILAYER PRINTED CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME SUMITOMO BAKELITE COMPANY LIMITED (JP) 1997-05-09 WO claimed
EP-0192180-B1 5-(AZOLYLOXYPHENYLCARBAMOYL)-BARBITURIC ACID DERIVATIVES AS ACTIVE AGENTS IN ANTHELMICS CIBA-GEIGY AG (CH) 1989-08-09 EP claimed
EP-0192180-A1 5-(Azolyloxyphenylcarbamoyl)-barbituric acid derivatives as active agents in anthelmics CIBA-GEIGY AG (CH) 1986-08-27 EP claimed