SCHEMBL8589014

SCHEMBL8589014

CC(C)c1nc(CCC#N)c[nH]1

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ATM Q13315 1/20 0.31
L3MBTL1 Q9Y468 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL81086 0.77 MEN1 (0.31) ATML3MBTL1
SCHEMBL22893469 0.74
SCHEMBL31536694 0.74 MEN1 (0.32) ATML3MBTL1
SCHEMBL19689367 0.74
SCHEMBL9889780 0.72
SCHEMBL1452116 0.72
SCHEMBL18253594 0.72 NOS3 (0.36)
SCHEMBL3002699 0.70 ALDH1A1 (0.38) L3MBTL1
SCHEMBL8528800 0.69
SCHEMBL22167638 0.68 CAMKK2 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3548574-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES Momentive Performance Materials Inc. (US) 2019-10-09 EP claimed
WO-2018102509-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2018-06-07 WO claimed
EP-3548574-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES Momentive Performance Materials Inc. (US) 2019-10-09 EP disclosed
EP-3500612-A1 EPOXY RESIN COMPOSITIONS CONTAINING AN INTERNAL MOLD RELEASE AGENT Dow Global Technologies LLC (US) 2019-06-26 EP disclosed
EP-3478746-A1 PROCESS FOR MAKING POLYETHERS WITH REDUCED AMOUNTS OF UNSATURATED MONOLS Dow Global Technologies, LLC (US) 2019-05-08 EP disclosed
EP-3478744-A1 PROCESS FOR MAKING POLYETHER DIOLS Dow Global Technologies, LLC (US) 2019-05-08 EP disclosed
WO-2018164794-A1 STABLE EPOXY/INTERNAL MOLD RELEASE AGENT BLENDS FOR THE MANUFACTURE OF COMPOSITE ARTICLES DOW GLOBAL TECHNOLOGIES LLC (US) 2018-09-13 WO disclosed
WO-2018102509-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2018-06-07 WO disclosed
WO-2018034856-A1 EPOXY RESIN COMPOSITIONS CONTAINING AN INTERNAL MOLD RELEASE AGENT DOW GLOBAL TECHNOLOGIES LLC (US) 2018-02-22 WO disclosed
WO-2018005056-A1 PROCESS FOR MAKING POLYETHER DIOLS DOW GLOBAL TECHNOLOGIES LLC (US) 2018-01-04 WO disclosed
WO-2018005055-A1 PROCESS FOR MAKING POLYETHERS WITH REDUCED AMOUNTS OF UNSATURATED MONOLS DOW GLOBAL TECHNOLOGIES LLC (US) 2018-01-04 WO disclosed
WO-2014062891-A1 POLYMER PARTICLE DISPERSIONS WITH DIVINYLARENE DIOXIDES DOW GLOBAL TECHNOLOGIES LLC (US) 2014-04-24 WO disclosed
WO-2014039062-A1 TOUGHENED EPOXY RESIN FORMULATIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2014-03-13 WO disclosed
WO-2014039063-A1 TOUGHENING MASTERBLENDS DOW GLOBAL TECHNOLOGIES LLC (US) 2014-03-13 WO disclosed
EP-2665761-A1 HIGH PERFORMANCE THERMOSET USEFUL FOR ELECTRICAL LAMINATE, HIGH DENSITY INTERCONNECT AND INTERCONNECT SUBSTRATE APPLICATIONS Dow Global Technologies LLC (US) 2013-11-27 EP disclosed
WO-2013070478-A1 BIMODAL TOUGHENING AGENTS FOR THERMOSETTABLE EPOXY RESIN COMPOSITIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-05-16 WO disclosed
WO-2013003202-A1 CURABLE EPOXY RESIN SYSTEMS CONTAINING MIXTURES OF AMINE HARDENERS AND AN EXCESS OF EPOXIDE GROUPS DOW GLOBAL TECHNOLOGIES LLC (US) 2013-01-03 WO disclosed
WO-2012174989-A1 EPOXY RESIN COMPOSITIONS AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-12-27 WO disclosed
WO-2012099713-A1 HIGH PERFORMANCE THERMOSET USEFUL FOR ELECTRICAL LAMINATE, HIGH DENSITY INTERCONNECT AND INTERCONNECT SUBSTRATE APPLICATIONS DOW GLOBAL TECHNOLOGIES LLC (US) 2012-07-26 WO disclosed
EP-0649892-B1 Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO LTD (JP) 1998-06-03 EP disclosed