SCHEMBL818839

SCHEMBL818839

C=C(CCC(OCC)Oc1ccccc1-c1ccccc1)C(=O)O

nearest known ligand 0.40

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 14/20 0.40
PKM P14618 1/20 0.40
KMT2A Q03164 5/20 0.40
MEN1 O00255 4/20 0.40
ALDH1A1 P00352 11/20 0.40
SMN1; SMN2 Q16637 3/20 0.40
POLB P06746 2/20 0.39
HTT P42858 1/20 0.39
BLM P54132 1/20 0.39
LMNA P02545 2/20 0.37
L3MBTL1 Q9Y468 2/20 0.37
TDP1 Q9NUW8 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19458792 0.85 KDM4E (0.44) KDM4EPKMKMT2AMEN1ALDH1A1
SCHEMBL19458773 0.82 KDM4E (0.44) KDM4EPKMKMT2AMEN1ALDH1A1
SCHEMBL126626 0.82 TDP1 (0.38) KMT2AMEN1ALDH1A1LMNAL3MBTL1
SCHEMBL19458700 0.78 KDM4E (0.45) KDM4EPKMKMT2AMEN1ALDH1A1
SCHEMBL486621 0.75 TET2 (0.33)
SCHEMBL27164816 0.75 L3MBTL1 (0.39) KDM4EPKMKMT2AMEN1ALDH1A1
SCHEMBL865586 0.73 ADRB2 (0.51) KDM4EPKMKMT2AMEN1ALDH1A1
SCHEMBL11646848 0.72 ADRA2A (0.37) KDM4EPKMALDH1A1SMN1; SMN2HTT
SCHEMBL11646232 0.72 ADRA2A (0.39) KDM4EPKMKMT2AMEN1ALDH1A1
SCHEMBL156467 0.72 KDM4E (0.58) KDM4EPKMKMT2AMEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120010361-A1 CURABLE COMPOSITION AND CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2012-01-12 US disclosed
US-20090252932-A1 ACTINIC ENERGY RAY CURABLE RESION COMPOSITION AND USE THEREOF KURARAY CO., LTD. (JP) 2009-10-08 US disclosed
US-20050222293-A1 Curable resin composition, method for manufacture of laminate using the composition, transfer material, method for manufacture thereof and transferred product KURARAY CO., LTD. (JP) 2005-10-06 US disclosed