SCHEMBL8326262

SCHEMBL8326262

Sc1ccccc1-c1nnn[nH]1

nearest known ligand 0.39

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 1/20 0.39
MEN1 O00255 1/20 0.32
ALDH1A1 P00352 1/20 0.32
KMT2A Q03164 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12615990 0.85 ALDH1A1 (0.38) IDO1MEN1ALDH1A1KMT2AL3MBTL1
SCHEMBL9014087 0.85 IDO1 (0.30) IDO1
SCHEMBL3397570 0.76 DCUN1D1 (0.47) ALDH1A1
SCHEMBL1773419 0.76 IDO1 (0.52) IDO1MEN1ALDH1A1KMT2A
SCHEMBL704887 0.76 DCUN1D1 (0.47) IDO1MEN1ALDH1A1KMT2A
SCHEMBL23161505 0.76 MEN1 (0.36) IDO1MEN1ALDH1A1KMT2AL3MBTL1
SCHEMBL918324 0.76 DCUN1D1 (0.47) IDO1MEN1ALDH1A1KMT2A
SCHEMBL7768911 0.76 KCNN4 (0.35) MEN1ALDH1A1KMT2AL3MBTL1
SCHEMBL1774388 0.76 DCUN1D1 (0.47) IDO1ALDH1A1KMT2A
SCHEMBL9389043 0.76 MEN1 (0.32) MEN1ALDH1A1KMT2AL3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 183 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117739798-B Preparation method of flexible resistance type strain sensor, prepared flexible resistance type strain sensor and application of flexible resistance type strain sensor 暨南大学 2024-05-07 CN claimed
CN-117739798-A Preparation method of flexible resistance type strain sensor, prepared flexible resistance type strain sensor and application of flexible resistance type strain sensor 暨南大学 2024-03-22 CN claimed
CN-114958206-B Copper chemical mechanical polishing solution and application thereof and chemical mechanical polishing method 万华化学集团电子材料有限公司 2024-02-02 CN claimed
CN-116288360-A Non-phosphating polishing additive and production process thereof 江西宏伟龙科技有限公司 2023-06-23 CN claimed
CN-115466958-A Chemical polishing bright additive for chemical polishing of aluminum alloy two acids and polishing process 安徽韩铝环保新材料有限公司 2022-12-13 CN claimed
CN-114958206-A Copper chemical mechanical polishing solution, application thereof and chemical mechanical polishing method 万华化学集团电子材料有限公司 2022-08-30 CN claimed
CN-108250972-B Chemical mechanical polishing solution for barrier layer planarization 安集微电子科技(上海)股份有限公司 2021-09-21 CN claimed
CN-113122145-A Chemical mechanical polishing solution 安集微电子(上海)有限公司 2021-07-16 CN claimed
CN-109971355-A A kind of chemical mechanical polishing liquid 安集微电子(上海)有限公司 2019-07-05 CN claimed
CN-109971354-A A kind of chemical mechanical polishing liquid 安集微电子(上海)有限公司 2019-07-05 CN claimed
CN-106928855-A A kind of acidic chemical machine polishing liquor 安集微电子科技(上海)有限公司 2017-07-07 CN claimed
CN-106928857-A A kind of acidic chemical machine polishing liquor 安集微电子科技(上海)有限公司 2017-07-07 CN claimed
CN-106928858-A A kind of chemical mechanical polishing liquid for barrier layer planarization 安集微电子科技(上海)有限公司 2017-07-07 CN claimed
CN-106928862-A A kind of chemical mechanical polishing liquid and its polish ULK- copper-connection processing procedures in barrier layer application 安集微电子科技(上海)有限公司 2017-07-07 CN claimed
CN-106928856-A A kind of acidic chemical machine polishing liquor 安集微电子科技(上海)有限公司 2017-07-07 CN claimed
CN-105802512-A Chemical mechanical polishing liquid and application thereof 安集微电子(上海)有限公司 2016-07-27 CN claimed
CN-104745090-A Chemically mechanical polishing liquid and application thereof ANJI MICROELECTRONICS SHANGHAI 2015-07-01 CN claimed
CN-104745086-A Chemical mechanical polishing solution for barrier layer planarization, and use method thereof ANJI MICROELECTRONICS SHANGHAI 2015-07-01 CN claimed
CN-104745088-A Chemical mechanical polishing solution for barrier layer planarization, and use method thereof ANJI MICROELECTRONICS SHANGHAI 2015-07-01 CN claimed
CN-104745089-A Chemically mechanical polishing liquid for flattening barrier layer and use method thereof ANJI MICROELECTRONICS SHANGHAI 2015-07-01 CN claimed