SCHEMBL834372

SCHEMBL834372

Oc1c(F)cc(C(c2ccc(F)cc2)c2cc(F)c(O)c(F)c2)cc1F

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RPS6KA3 P51812 1/20 0.39
CA3 P07451 1/20 0.38
CA6 P23280 1/20 0.38
CA5A P35218 1/20 0.38
CA9 Q16790 1/20 0.38
CA14 Q9ULX7 1/20 0.38
CA5B Q9Y2D0 1/20 0.38
POLB P06746 1/20 0.38
AOC3 Q16853 1/20 0.36
IDO1 P14902 2/20 0.35
TDO2 P48775 2/20 0.35
HDAC3 O15379 1/20 0.35
HDAC4 P56524 1/20 0.35
HDAC1 Q13547 1/20 0.35
HDAC7 Q8WUI4 1/20 0.35
HDAC2 Q92769 1/20 0.35
HDAC10 Q969S8 1/20 0.35
HDAC11 Q96DB2 1/20 0.35
HDAC8 Q9BY41 1/20 0.35
HDAC6 Q9UBN7 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1596154 0.93 SHBG (0.37) RPS6KA3CA3CA6CA5ACA9
SCHEMBL4471799 0.86 ADRB2 (0.39) RPS6KA3CA3CA6CA5ACA9
SCHEMBL836444 0.83 SLC6A2 (0.41) RPS6KA3HDAC1HDAC8HDAC6PTGS1
SCHEMBL25121951 0.81 SHBG (0.49) CA3CA6CA5ACA9CA14
SCHEMBL835607 0.81 SHBG (0.49) CA3CA6CA5ACA9CA14
SCHEMBL29948072 0.81 SHBG (0.49) CA3CA6CA5ACA9CA14
SCHEMBL1596959 0.79 PTGS1 (0.37) SHBGPTGS1PTGS2ADRB2ADRB1
SCHEMBL27739781 0.79 ESR1 (0.46) RPS6KA3CA3CA6CA5ACA9
SCHEMBL15134980 0.79 PTGS1 (0.52) POLBGAAPTGS1PTGS2ALOX5
SCHEMBL28024268 0.78 IDO1 (0.40) POLBAOC3IDO1TDO2HDAC3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 92 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1542273-B1 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL CO LTD (JP) 2013-09-25 EP disclosed
EP-1717851-B1 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL CO LTD (JP) 2012-10-17 EP disclosed
US-8142605-B2 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-27 US disclosed
US-7967943-B2 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-06-28 US disclosed
US-20110114893-A1 CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD HITACHI CHEMICAL CO., LTD. (JP) 2011-05-19 US disclosed
US-7879956-B2 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-02-01 US disclosed
US-7666967-B2 Ester compound, polymer, resist composition, and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2010-02-23 US disclosed
US-7629050-B2 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-12-08 US disclosed
US-7629056-B2 SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-12-08 US disclosed
US-7618713-B2 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-11-17 US disclosed
US-20020048724-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-04-25 US disclosed
US-20020042017-A1 Chemically amplified positive resist composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-04-11 US disclosed
US-20020012871-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-01-31 US disclosed
US-20020004569-A1 Polymer, chemically amplified resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2002-01-10 US disclosed
US-20010038969-A1 Novel polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. OF (JP) 2001-11-08 US disclosed
US-20010033989-A1 Novel polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-25 US disclosed
US-20010018162-A1 Novel polymers, chemical amplification resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-08-30 US disclosed
EP-1126322-A2 Fluorine-containing polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-08-22 EP disclosed
US-6235842-B1 USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. HITACHI CHEMICAL COMPANY, LTD. (JP) 2001-05-22 US disclosed
EP-0979854-A1 CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-02-16 EP disclosed