SCHEMBL836444

SCHEMBL836444

Oc1c(F)cc(C(c2ccccc2)c2cc(F)c(O)c(F)c2)cc1F

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SLC6A2 P23975 2/20 0.41
SLC6A4 P31645 2/20 0.41
SLC6A3 Q01959 2/20 0.41
HKDC1 Q2TB90 1/20 0.40
AKR1C2 P52895 2/20 0.39
AKR1C1 Q04828 2/20 0.39
RPS6KA3 P51812 1/20 0.39
CFTR P13569 1/20 0.38
GOPC Q9HD26 1/20 0.38
HDAC1 Q13547 1/20 0.37
HDAC8 Q9BY41 1/20 0.37
HDAC6 Q9UBN7 1/20 0.37
GRIN2B Q13224 1/20 0.36
MEN1 O00255 3/20 0.36
KMT2A Q03164 3/20 0.36
AKR1B1 P15121 1/20 0.36
PTGS1 P23219 3/20 0.35
PTGS2 P35354 2/20 0.35
FABP2 P12104 1/20 0.35
TSHR P16473 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1596154 0.89 SHBG (0.37) AKR1C2AKR1C1RPS6KA3MEN1KMT2A
SCHEMBL4471799 0.86 ADRB2 (0.39) RPS6KA3
SCHEMBL834372 0.83 RPS6KA3 (0.39) RPS6KA3HDAC1HDAC8HDAC6PTGS1
SCHEMBL19806917 0.82 HKDC1 (0.57) SLC6A2SLC6A4SLC6A3HKDC1CFTR
SCHEMBL27620448 0.79 SHBG (0.47) SLC6A2SLC6A4SLC6A3HKDC1HDAC1
SCHEMBL29948191 0.79 SHBG (0.47) SLC6A2SLC6A4SLC6A3HKDC1HDAC1
SCHEMBL833877 0.79 SHBG (0.47) SLC6A2SLC6A4SLC6A3HKDC1HDAC1
SCHEMBL31619784 0.78 SLC6A2 (0.46) SLC6A2SLC6A4SLC6A3CFTRGOPC
SCHEMBL24206377 0.76 SLC6A2 (0.43) SLC6A2SLC6A4SLC6A3HKDC1CFTR
Hydrogen Peroxide SCHEMBL9845549 0.75 SLC6A2 (0.63) SLC6A2SLC6A4SLC6A3CFTRGOPC

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240101859-A1 RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM, AND METHOD FOR MANUFACTURING THE SAME FUJIFILM CORPORATION (JP) 2024-03-28 US disclosed
US-20240092967-A1 RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM, AND METHOD FOR MANUFACTURING THE SAME FUJIFILM CORPORATION (JP) 2024-03-21 US disclosed
EP-4339251-A1 COATING RESIN COMPOSITION, POLYMER, POLYMER PRODUCTION METHOD, COATING FILM AND PRODUCTION METHOD THEREFOR FUJIFILM Corporation (JP) 2024-03-20 EP disclosed
EP-4339252-A1 RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM AND METHOD FOR PRODUCING SAME FUJIFILM Corporation (JP) 2024-03-20 EP disclosed
CN-117242145-A Resin composition for coating, polymer, method for producing polymer, coating film, and method for producing coating film 富士胶片株式会社 2023-12-15 CN disclosed
CN-117203294-A Resin composition for coating, polymer, method for producing polymer, coating film, and method for producing coating film 富士胶片株式会社 2023-12-08 CN disclosed
WO-2022239655-A1 RESIN COMPOSITION FOR COATING, POLYMER, METHOD FOR PRODUCING POLYMER, COATING FILM AND METHOD FOR PRODUCING SAME 富士フイルム株式会社 2022-11-17 WO disclosed
WO-2022239656-A1 COATING RESIN COMPOSITION, POLYMER, POLYMER PRODUCTION METHOD, COATING FILM AND PRODUCTION METHOD THEREFOR 富士フイルム株式会社 2022-11-17 WO disclosed
US-20210139390-A1 PRODUCTION METHOD OF ORGANIC COMPOUND UNITIKA LTD. (JP) 2021-05-13 US disclosed
EP-3819283-A1 METHOD FOR PRODUCING ORGANIC COMPOUND Unitika Ltd. (JP) 2021-05-12 EP disclosed
US-6777464-B1 ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE HITACHI CHEMICAL COMPANY, LTD. (JP) 2004-08-17 US disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
EP-0884342-B1 Resin for coating formation and method for producing the same UNITIKA LTD (JP) 2003-09-24 EP disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed
US-6235842-B1 USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. HITACHI CHEMICAL COMPANY, LTD. (JP) 2001-05-22 US disclosed
EP-0979854-A1 CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-02-16 EP disclosed
EP-0943640-A1 HIGHLY HEAT-RESISTANT, HIGH-PURITY POLYARYLATE AND FILM PRODUCED FROM THE SAME UNITIKA LTD. (JP) 1999-09-22 EP disclosed
US-5902872-A POLYARYLATE COMPRISING 2,2-BIS/3-METHYL-4-HYDROXYPHENYL/PROPANE UNITS, TEREPHTHALIC ACID UNITS AND ISOPHTHALIC ACID UNITS, HAVING SPECIFIED INHERENT VISCOSITY UNITIKA, LTD. (JP) 1999-05-11 US disclosed
EP-0884342-A1 Resin for coating formation and method for producing the same UNITIKA LTD. (JP) 1998-12-16 EP disclosed