Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.46 |
| ▸ | CASP6 | P55212 | 1/20 | 0.46 |
| ▸ | SHBG | P04278 | 1/20 | 0.44 |
| ▸ | MAPK8 | P45983 | 1/20 | 0.38 |
| ▸ | CA1 | P00915 | 2/20 | 0.36 |
| ▸ | CA2 | P00918 | 2/20 | 0.36 |
| ▸ | TTR | P02766 | 1/20 | 0.36 |
| ▸ | TP53 | P04637 | 1/20 | 0.36 |
| ▸ | ACHE | P22303 | 1/20 | 0.35 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.33 |
| ▸ | HPGD | P15428 | 2/20 | 0.33 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.33 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.33 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.33 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.33 |
| ▸ | PDXK | O00764 | 1/20 | 0.33 |
| ▸ | KLF10 | Q13118 | 1/20 | 0.33 |
| ▸ | GRIA1 | P42261 | 1/20 | 0.33 |
| ▸ | GRIA2 | P42262 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2121614 | 0.85 | PTPN1 (0.52) | KDM4EALDH1A1HPGDHSD17B10CYP3A4 | |
| SCHEMBL25446793 | 0.85 | SHBG (0.45) | KDM4ECASP6SHBGCA1CA2 | |
| SCHEMBL16581437 | 0.85 | MEN1 (0.44) | KDM4ECASP6SHBGCYP3A4CYP2D6 | |
| SCHEMBL10782836 | 0.82 | ALOX5 (0.47) | KDM4ECASP6TTRHPGDCYP3A4 | |
| SCHEMBL16257501 | 0.82 | PRKCE (0.47) | KDM4ECASP6SHBGCA1CA2 | |
| SCHEMBL10900598 | 0.82 | SHBG (0.42) | KDM4ECASP6SHBGCA1CA2 | |
| SCHEMBL9999531 | 0.81 | ACHE (0.48) | KDM4ECASP6SHBGTP53ACHE | |
| SCHEMBL2620982 | 0.80 | PDE4A (0.48) | CA1CA2PKMPDE4APDE4B | |
| SCHEMBL23486768 | 0.80 | PTPN1 (0.61) | KDM4EALDH1A1HPGDHSD17B10CYP3A4 | |
| SCHEMBL18218328 | 0.80 | ERN1 (0.47) | KDM4ECASP6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 276 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-8277234-A | — | — | None | — | — | JP | disclosed |
| JP-8277235-A | — | — | None | — | — | JP | disclosed |
| WO-2025047702-A1 | COMPOSITION FOR PATTERNING AND USE OF SAME | 日産化学株式会社 | 2025-03-06 | — | — | WO | disclosed |
| WO-2025047700-A1 | COMPOSITION FOR FORMING WAVELENGTH CONVERSION FILM AND USE THEREOF | 日産化学株式会社 | 2025-03-06 | — | — | WO | disclosed |
| US-12044968-B2 | Protective film-forming composition having acetal structure and amide structure | NISSAN CHEMICAL CORPORATION (JP) | 2024-07-23 | — | — | US | disclosed |
| US-12044968-B2 | Protective film-forming composition having acetal structure and amide structure | NISSAN CHEMICAL CORPORATION (JP) | 2024-07-23 | — | — | US | disclosed |
| US-12025916-B2 | Resist underlayer film-forming composition that contains triaryldiamine-containing novolac resin to which aromatic vinyl compound is added | NISSAN CHEMICAL CORPORATION (JP) | 2024-07-02 | — | — | US | disclosed |
| US-12025916-B2 | Resist underlayer film-forming composition that contains triaryldiamine-containing novolac resin to which aromatic vinyl compound is added | NISSAN CHEMICAL CORPORATION (JP) | 2024-07-02 | — | — | US | disclosed |
| WO-2024128157-A1 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM | 日産化学株式会社 | 2024-06-20 | — | — | WO | disclosed |
| WO-2024024502-A1 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION | 日産化学株式会社 | 2024-02-01 | — | — | WO | disclosed |
| EP-1376231-A1 | Photosensitive polymer composition, method of forming relief patterns, and electronic equipment | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2004-01-02 | — | — | EP | disclosed |
| EP-0997777-B1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | HITACHI CHEM DUPONT MICROSYS (JP) | 2003-06-04 | — | — | EP | disclosed |
| US-6514658-B2 | Polyimide or precursor thereof soluble in alkaline solution, a photosensitive acid generator, and a compound having a phenolic hydroxyl group; positive-type, heat resistance | HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD. (JP) | 2003-02-04 | — | — | US | disclosed |
| US-6329110-B1 | POSITIVES, POLYIMIDE SOLUBLE IN AN AQUEOUS ALKALINE SOLUTION; QUINONEDIAZIDE CAPABLE OF GENERATING AN ACID WHEN EXPOSED TO LIGHT; COMPOUND HAVING A PHENOLIC HYDROXYL GROUP; | HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) | 2001-12-11 | — | — | US | disclosed |
| US-20010031419-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | NUNOMURA MASATAKA (JP) | 2001-10-18 | — | — | US | disclosed |
| US-6235842-B1 | USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2001-05-22 | — | — | US | disclosed |
| EP-0997777-A1 | Photosensitive polymer composition, method for forming relief patterns, and electronic parts | Hitachi Chemical DuPont MicroSystems Ltd. (JP) | 2000-05-03 | — | — | EP | disclosed |
| EP-0979854-A1 | CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-02-16 | — | — | EP | disclosed |
| JP-H08277235-A | NEW POLYPHENOL COMPOUND AND ITS PRODUCTION | HONSHU CHEM IND CO LTD | 1996-10-22 | — | — | JP | disclosed |
| JP-H08277234-A | BIPHENYL-4,4'-DIOL HAVING HYDROXYMETHYL GROUP AS NUCLEUS-SUBSTITUTING GROUP, COMPOSITION CONTAINING THE SAME AND ITS PRODUCTION | HONSHU CHEM IND CO LTD | 1996-10-22 | — | — | JP | disclosed |