SCHEMBL836033

SCHEMBL836033

Oc1c(F)cc(-c2ccc(Cc3ccc(-c4cc(F)c(O)c(F)c4)cc3)cc2)cc1F

nearest known ligand 0.56

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
CYP17A1 P05093 7/20 0.56
CYP11B1 P15538 6/20 0.56
CYP11B2 P19099 6/20 0.56
CYP3A4 P08684 5/20 0.56
CYP19A1 P11511 3/20 0.56
ESR1 P03372 4/20 0.50
ESR2 Q92731 4/20 0.50
ERN1 O75460 4/20 0.45
AKR1C2 P52895 1/20 0.43
AKR1C1 Q04828 1/20 0.43
KIF11 P52732 1/20 0.42
VRK1 Q99986 1/20 0.39
RPS6KA3 P51812 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5071950 0.84 ESR1 (0.48) CYP17A1CYP11B1CYP11B2CYP3A4CYP19A1
SCHEMBL23512339 0.83 ESR1 (0.47) CYP17A1CYP11B1CYP11B2CYP3A4CYP19A1
SCHEMBL833876 0.81 CYP17A1 (0.80) CYP17A1CYP11B1CYP11B2CYP3A4CYP19A1
SCHEMBL16038459 0.80 MCL1 (0.49) CYP17A1CYP11B1CYP11B2CYP3A4CYP19A1
SCHEMBL13104729 0.79 ESR1 (0.67) ESR1ESR2AKR1C2AKR1C1KIF11
SCHEMBL25146564 0.79 AKR1C2 (0.52) ESR1ESR2AKR1C2AKR1C1RPS6KA3
SCHEMBL9788948 0.78 ESR1 (0.61) CYP17A1CYP11B1CYP11B2CYP3A4CYP19A1
SCHEMBL833139 0.78 ESR1 (0.56) ESR1ESR2ERN1AKR1C2AKR1C1
SCHEMBL36980 0.76 MEP1B (0.44) CYP17A1CYP11B1CYP11B2CYP3A4CYP19A1
SCHEMBL19829088 0.75 MCL1 (0.44) ESR1ESR2AKR1C2AKR1C1RPS6KA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1717851-B1 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL CO LTD (JP) 2012-10-17 EP disclosed
US-8142605-B2 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-27 US disclosed
US-7967943-B2 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-06-28 US disclosed
US-20110114893-A1 CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD HITACHI CHEMICAL CO., LTD. (JP) 2011-05-19 US disclosed
US-7879956-B2 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL COMPANY, LTD. (JP) 2011-02-01 US disclosed
US-7713449-B2 Polymer electrolytic material, polymer electrolytic part, membrane electrode assembly, and polymer electrolyte fuel cell TORAY INDUSTRIES, INC. (JP) 2010-05-11 US disclosed
US-7700007-B2 Anisotropic conductive film forming composition CHEIL INDUSTRIES, INC. (KR) 2010-04-20 US disclosed
US-7629050-B2 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-12-08 US disclosed
US-7629056-B2 SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-12-08 US disclosed
US-7618713-B2 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-11-17 US disclosed
EP-1688965-A2 Heatcurable dielectric resin composition and heatcurable dielectric resin film Nippon Paint Co., Ltd. (JP) 2006-08-09 EP disclosed
US-20060148956-A1 Anisotropic conductive film forming composition KUKDO CHEMICAL CO., LTD. (KR) 2006-07-06 US disclosed
US-20060060969-A1 Electronic circuit including circuit-connecting material HITACHI CHEMICAL CO., LTD. (JP) 2006-03-23 US disclosed
US-20060063366-A1 Circuit-connecting material and circuit terminal connected structure and connecting method HITACHI CHEMICAL CO., LTD. (JP) 2006-03-23 US disclosed
EP-1619735-A1 POLYMER ELECTROLYTE MATERIAL, POLYMER ELECTROLYTE PART, MEMBRANE ELECTRODE COMPOSITE AND POLYMER ELECTROLYTE TYPE FUEL CELL TORAY INDUSTRIES, INC. (JP) 2006-01-25 EP disclosed
US-20060014860-A1 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer HITACHI CHEMICAL CO., LTD. (JP) 2006-01-19 US disclosed
US-20040222408-A1 SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE HITACHI CHEMICAL COMPANY, LTD. (JP) 2004-11-11 US disclosed
US-6777464-B1 ELECTRONIC CIRCUIT-CONNECTING MATERIAL HAVING A SUPERIOR LOW-TEMPERATURE RAPID CURABILITY AND ALSO HAVING A LONG POT LIFE HITACHI CHEMICAL COMPANY, LTD. (JP) 2004-08-17 US disclosed
US-6235842-B1 USEFUL AS ADHESIVES, FILM MATERIALS, AND MOLDING MATERIALS FOR ENCAPSULATING ELECTRONIC COMPONENTS. HITACHI CHEMICAL COMPANY, LTD. (JP) 2001-05-22 US disclosed
EP-0979854-A1 CIRCUIT CONNECTING MATERIAL, AND STRUCTURE AND METHOD OF CONNECTING CIRCUIT TERMINAL HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-02-16 EP disclosed