Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEP1B | Q16820 | 1/20 | 0.44 |
| ▸ | DBH | P09172 | 1/20 | 0.41 |
| ▸ | SHBG | P04278 | 1/20 | 0.38 |
| ▸ | CA1 | P00915 | 1/20 | 0.36 |
| ▸ | CA2 | P00918 | 1/20 | 0.36 |
| ▸ | CA4 | P22748 | 1/20 | 0.36 |
| ▸ | CA6 | P23280 | 1/20 | 0.36 |
| ▸ | ESR1 | P03372 | 2/20 | 0.35 |
| ▸ | ESR2 | Q92731 | 2/20 | 0.35 |
| ▸ | HMGB1 | P09429 | 1/20 | 0.35 |
| ▸ | CXCL12 | P48061 | 1/20 | 0.35 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.35 |
| ▸ | ERN1 | O75460 | 1/20 | 0.34 |
| ▸ | CYP17A1 | P05093 | 1/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | CYP19A1 | P11511 | 1/20 | 0.34 |
| ▸ | CYP11B1 | P15538 | 1/20 | 0.34 |
| ▸ | CYP11B2 | P19099 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5071950 | 0.92 | ESR1 (0.48) | MEP1BDBHCA1CA2CA4 | |
| SCHEMBL28439714 | 0.86 | CALM1 (0.52) | PTPN1 | |
| SCHEMBL9788948 | 0.86 | ESR1 (0.61) | CA1CA2CA4CA6ESR1 | |
| SCHEMBL14421368 | 0.82 | PTGS1 (0.45) | MEP1BDBHESR1ESR2 | |
| SCHEMBL2642238 | 0.80 | ACHE (0.50) | MEP1BDBHESR1ESR2ERN1 | |
| SCHEMBL6302839 | 0.78 | MEP1B (0.41) | MEP1BDBH | |
| SCHEMBL6167933 | 0.78 | MEP1B (0.46) | MEP1BDBHESR1ESR2ERN1 | |
| SCHEMBL6124950 | 0.78 | MEP1B (0.41) | MEP1BDBH | |
| SCHEMBL3694053 | 0.76 | TAAR1 (0.48) | — | |
| SCHEMBL836033 | 0.76 | CYP17A1 (0.56) | ESR1ESR2ERN1CYP17A1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 713 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4594390-A1 | TWO-COMPONENT COMPOSITION BASED ON EPOXY RESIN | Bostik SA (FR) | 2025-08-06 | — | — | EP | claimed |
| US-20250043066-A1 | AMINE COMPOSITION, EPOXY SYSTEM PREPARED FROM THE AMINE COMPOSITION AND AN EPOXY RESIN, AND USE OF THE EPOXY SYSTEM | EVONIK OPERATIONS GMBH (DE) | 2025-02-06 | — | — | US | claimed |
| CN-118955873-A | Mono-alkylated diamines for epoxy formulations: novel curing agents for epoxy systems | 赢创运营有限公司 | 2024-11-15 | — | — | CN | claimed |
| CN-111434704-B | Mono-alkylated diamines for epoxy formulations: novel curing agents for epoxy systems | 赢创运营有限公司 | 2024-10-18 | — | — | CN | claimed |
| US-12049539-B2 | Cycloaliphatic amines for epoxy formulations: a novel curing agent for epoxy systems | EVONIK OPERATIONS GMBH (DE) | 2024-07-30 | — | — | US | claimed |
| EP-4380993-A1 | AMINE COMPOSITION, EPOXY SYSTEM PREPARED FROM THE AMINE COMPOSITION AND AN EPOXY RESIN, AND USE OF THE EPOXY SYSTEM | Evonik Operations GmbH (DE) | 2024-06-12 | — | — | EP | claimed |
| WO-2024069085-A1 | TWO-COMPONENT COMPOSITION BASED ON EPOXY RESIN | BOSTIK SA (FR) | 2024-04-04 | — | — | WO | claimed |
| CN-117794975-A | Amine composition, epoxy system made of the amine composition and epoxy resin, and use of the epoxy system | 赢创运营有限公司 | 2024-03-29 | — | — | CN | claimed |
| EP-3559077-B1 | N-HYDROXYL ETHYL PIPERIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS | EVONIK OPERATIONS GMBH (DE) | 2023-12-06 | — | — | EP | claimed |
| EP-4219585-A1 | MONO-ALKYLATED DIAMINES FOR EPOXY FORMULATIONS: NOVEL CURING AGENTS FOR EPOXY SYSTEMS | Evonik Operations GmbH (DE) | 2023-08-02 | — | — | EP | claimed |
| WO-2019170563-A1 | CYCLOALIPHATIC AMINES FOR EPOXY FORMULATIONS: A NOVEL CURING AGENT FOR EPOXY SYSTEMS | EVONIK DEGUSSA GMBH (DE) | 2019-09-12 | — | — | WO | claimed |
| WO-2018118137-A1 | N-HYDXYL ETHYL PIPRIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS | EVONIK DEGUSSA GMBH (DE) | 2018-06-28 | — | — | WO | claimed |
| WO-2018111884-A1 | NOVEL LOW TEMPERATURE ANHYDRIDE EPOXY CURED SYSTEMS | EVONIK DEGUSSA GMBH (DE) | 2018-06-21 | — | — | WO | claimed |
| US-20180171067-A1 | N-HYDROXYL ETHYL PIPERIDINE (NHEP): A NOVEL CURING AGENT FOR EPOXY SYSTEMS | EVONIK OPERATIONS GMBH (DE) | 2018-06-21 | — | — | US | claimed |
| US-9279032-B2 | Low temperature curable epoxy compositions | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2016-03-08 | — | — | US | claimed |
| EP-2426159-B1 | Low temperature curable epoxy compositions | AIR PROD & CHEM (US) | 2015-03-25 | — | — | EP | claimed |
| US-20120077943-A1 | Low Temperature Curable Epoxy Compositions | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2012-03-29 | — | — | US | claimed |
| EP-2426159-A1 | Low temperature curable epoxy compositions | Air Products and Chemicals, Inc. (US) | 2012-03-07 | — | — | EP | claimed |
| EP-0333002-B1 | Heat-resistant resin composition | IDEMITSU PETROCHEMICAL CO (JP) | 1994-04-27 | — | — | EP | claimed |
| EP-0333002-A2 | Heat-resistant resin composition | IDEMITSU PETROCHEMICAL CO. LTD. (JP) | 1989-09-20 | — | — | EP | claimed |