SCHEMBL8406583

SCHEMBL8406583

CCCc1ccc(Oc2ccc(N3C(=O)C=CC3=O)cc2)c(C(C)CC)c1

nearest known ligand 0.53

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 9/20 0.53
FAAH O00519 3/20 0.43
ACACB O00763 4/20 0.39
HSP90AA1 P07900 3/20 0.37
ALDH1A1 P00352 2/20 0.37
HPGD P15428 2/20 0.37
HTT P42858 2/20 0.37
MEN1 O00255 1/20 0.37
LMNA P02545 1/20 0.37
PKM P14618 1/20 0.37
CCR6 P51684 1/20 0.37
KMT2A Q03164 1/20 0.37
ATM Q13315 1/20 0.37
CACNA1B Q00975 1/20 0.34
APBA1 Q02410 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
PTGS1 P23219 1/20 0.34
PTGS2 P35354 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8853206 0.91 MGLL (0.56) MGLLFAAHACACBHSP90AA1ALDH1A1
SCHEMBL8853377 0.82 MGLL (0.60) MGLLFAAHACACBHSP90AA1ALDH1A1
SCHEMBL8853344 0.82 MGLL (0.60) MGLLFAAHACACBHSP90AA1ALDH1A1
SCHEMBL8852789 0.82 MGLL (0.60) MGLLFAAHACACBHSP90AA1ALDH1A1
SCHEMBL349321 0.82 RORC (0.45) MGLLFAAHHSP90AA1ALDH1A1HPGD
SCHEMBL8852967 0.81 MGLL (0.58) MGLLFAAHHSP90AA1ALDH1A1LMNA
SCHEMBL8853088 0.81 MGLL (0.58) MGLLFAAHACACBHSP90AA1ALDH1A1
SCHEMBL8853362 0.81 MGLL (0.58) MGLLFAAHACACB
SCHEMBL8852819 0.81 MGLL (0.58) MGLLFAAHACACBHSP90AA1ALDH1A1
SCHEMBL8579683 0.79 ACACB (0.42) ACACBALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114231240-A Circuit connecting material, circuit member connecting structure, method for producing the same, and use of composition 昭和电工材料株式会社 2022-03-25 CN disclosed
CN-105462598-A Liquid crystal aligning agent, liquid crystal alignment film, and liquid crystal display element CHI MEI CORP 2016-04-06 CN disclosed
CN-103173144-B Composition for anisotropic conductive adhesive film, anisotropic conductive adhesive film and semiconductor device CHEIL IND INC 2015-05-20 CN disclosed
CN-103102816-B Anisotropic conductive film and semiconductor device CHEIL IND INC 2015-05-13 CN disclosed
CN-104380197-A Alkaline-developable thermosetting resin composition and printed circuit board TAIYO INK MFG CO LTD 2015-02-25 CN disclosed
CN-104334604-A Alkali-developable thermosetting resin composition, and printed wiring board TAIYO INK MFG CO LTD 2015-02-04 CN disclosed
CN-102344816-B Liquid crystal alignment agent, liquid crystal alignment film prepared from same and liquid crystal display element CHI MEI CORP 2014-02-19 CN disclosed
US-5932637-A FIREPROOFING LAMINATE CONSISTS OF AN EPOXY RESIN, A MALEIMIDE COMPOUND, A CURING AGENT HAVING AMINO GROUP AND A PHOSPHORUS ESTER AND A SUBSTRATE; HALOGEN-FREE AND NON-DETERIORATION SUMITOMO BAKELITE COMPANY LIMITED (JP) 1999-08-03 US disclosed