SCHEMBL841758

SCHEMBL841758

O=[Si]([O-])[O-].[Al].[Ca+2].[MgH2]

nearest known ligand 0.00

Known targets — ChEMBL curated mechanism

GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGRIN1GRIN2AGRIN2BGRIN2CGRIN2DGRIN3AGRIN3BHMGCRMMP1MMP13MMP7MMP8PTGS1PTGS2ileSpolrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7796333 0.94
SCHEMBL12468705 0.94
SCHEMBL2546922 0.89
SCHEMBL313367 0.89
SCHEMBL5137565 0.89
SCHEMBL7255886 0.89
SCHEMBL8006466 0.88
SCHEMBL30507 0.88
SCHEMBL3577 0.88
SCHEMBL149311 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 57 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1772480-B1 Reduction of transfer of vibrations HENKEL AG & CO KGAA (DE) 2013-12-04 EP claimed
EP-1772480-A1 Reduction of transfer of vibrations Henkel KGaA (DE) 2007-04-11 EP claimed
US-20240132687-A1 Thermally expandable compositions comprising wax HENKEL AG & CO KGAA (DE) 2024-04-25 US disclosed
CN-113692421-B Pumpable, thermally curable and expandable formulation 汉高股份有限及两合公司 2024-03-08 CN disclosed
CN-117616074-A Thermally expandable composition comprising wax 汉高股份有限及两合公司 2024-02-27 CN disclosed
EP-3421527-B1 COMPOSITION CONTAINING A LIGHTWEIGHT FILLER HENKEL AG & CO KGAA (DE) 2023-11-15 EP disclosed
US-11505669-B2 Thermally expandable compositions comprising urea derivatives HENKEL AG & CO. KGAA (DE) 2022-11-22 US disclosed
US-20220325073-A1 MATRIX RESIN FOR LAMINATES WITH HIGH TRANSPARENCY, LOW YELLOWING AND HIGH GLASS TRANSITION TEMPERATURES HENKEL AG & CO KGAA (DE) 2022-10-13 US disclosed
US-20220251370-A1 PEO-PPO-PEO TRIBLOCK COPOLYMERS AS ADDITIVES FOR EPOXIDE-ANHYDRIDE SYSTEMS HENKEL AG & CO KGAA (DE) 2022-08-11 US disclosed
US-20220220319-A1 THERMALLY EXPANDABLE PREPARATION HENKEL AG & CO. KGAA (DE) 2022-07-14 US disclosed
US-20220033604-A1 PUMPABLE, THERMALLY CURABLE AND EXPANDABLE PREPARATIONS HENKEL AG & CO KGAA (DE) 2022-02-03 US disclosed
WO-2005100431-A2 POLYCARBOXY-FUNCTIONALIZED PREPOLYMERS HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2005-10-27 WO disclosed
US-20050215730-A1 Polycarboxy-functionalized prepolymers HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (HENKEL KGAA) (DE) 2005-09-29 US disclosed
US-6884854-B2 Composition of epoxy resin, low glass transition temperature copolymer, latent hardener and carboxy-terminated polyamide and/or polyamide HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2005-04-26 US disclosed
US-20040266899-A1 Expandable epoxy resin-based systems modified with thermoplastic polymers HENKEL KGAA (DE) 2004-12-30 US disclosed
US-20040181013-A1 Impact resistant epoxide resin compositions HENKEL TEROSON GMBH 2004-09-16 US disclosed
EP-1456286-A1 EXPANDABLE EPOXY RESIN-BASED SYSTEMS MODIFIED WITH THERMOPLASTIC POLYMERS Henkel Teroson GmbH (DE) 2004-09-15 EP disclosed
US-6776869-B1 EPOXY REACTIVE END GROUPS OR A REACTION PRODUCT OF THE COPOLYMER WITH A POLYEPOXIDE, A REACTION PRODUCT OF A POLYURETHANE PREPOLYMER AND A POLYPHENOL OR POLYAMINOPHENOL AND AT LEAST ONE EPOXY RESIN. HENKEL-TEROSON GMBH (DE) 2004-08-17 US disclosed
US-20030187154-A1 Impact-resistant epoxy resin compositions HENKEL KOMMANDITGESELLSCHAFT AUF AKTIEN (DE) 2003-10-02 US disclosed
WO-2003054069-A1 EXPANDABLE EPOXY RESIN-BASED SYSTEMS MODIFIED WITH THERMOPLASTIC POLYMERS HENKEL TEROSON GMBH (DE) 2003-07-03 WO disclosed