SCHEMBL8422985

SCHEMBL8422985

CC(C)(c1ccc(O)cc1)c1ccc(O)c(-c2ccccc2)c1

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 6/20 0.61
ESR2 Q92731 6/20 0.61
CYP3A4 P08684 2/20 0.61
ALDH1A1 P00352 2/20 0.61
CNR1 P21554 4/20 0.54
CNR2 P34972 4/20 0.54
HPGD P15428 2/20 0.53
HSD17B10 Q99714 2/20 0.53
AR P10275 1/20 0.53
TSHR P16473 1/20 0.53
SLC6A2 P23975 1/20 0.53
SLC6A4 P31645 1/20 0.53
HTR6 P50406 1/20 0.53
ESRRG P62508 1/20 0.53
SLC6A3 Q01959 1/20 0.53
BACE1 P56817 2/20 0.48
ALOX5 P09917 1/20 0.47
KLF10 Q13118 1/20 0.46
PELI1 Q96FA3 1/20 0.44
BCL2L1 Q07817 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13609955 0.95 CNR1 (0.58) ESR1ESR2CYP3A4ALDH1A1CNR1
SCHEMBL11226795 0.93 CNR1 (0.60) ESR1ESR2CYP3A4ALDH1A1CNR1
SCHEMBL136305 0.93 BACE1 (0.56) ESR1ESR2CYP3A4ALDH1A1CNR1
SCHEMBL29375340 0.93 BACE1 (0.56) ESR1ESR2CYP3A4ALDH1A1CNR1
SCHEMBL29602069 0.93 BACE1 (0.56) ESR1ESR2CYP3A4ALDH1A1CNR1
SCHEMBL822109 0.93 ESR1 (0.53) ESR1ESR2CYP3A4ALDH1A1CNR1
SCHEMBL13589368 0.91 ESR1 (0.59) ESR1ESR2CYP3A4ALDH1A1CNR1
SCHEMBL30662003 0.91 ESR1 (0.51) ESR1ESR2CYP3A4ALDH1A1CNR1
SCHEMBL25404377 0.88 CNR1 (0.59) ESR1ESR2CYP3A4ALDH1A1CNR1
SCHEMBL7117740 0.87 CNR1 (0.50) ESR1ESR2CYP3A4ALDH1A1CNR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 242 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0379058-B1 Vinyl ester resins containing mesogenic/rigid rodlike moieties DOW CHEMICAL CO (US) 1999-09-29 EP claimed
EP-0364785-B1 Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board HITACHI LTD (JP) 1995-03-01 EP claimed
JP-4101888-A None JP disclosed
JP-4241989-A None JP disclosed
US-20260139169-A1 Compostable Label with Adhesive SINCLAIR SYSTEMS INT LLC (US) 2026-05-21 US disclosed
WO-2026107415-A1 COMPOSTABLE LABEL WITH ADHESIVE SINCLAIR SYSTEMS INTERNATIONAL, LLC (US) 2026-05-21 WO disclosed
US-20260092167-A1 AROMATIC POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF TEIJIN LIMITED (JP) 2026-04-02 US disclosed
CN-121755060-A Self-crosslinking ultrafiltration membrane and preparation method thereof 江苏拓邦环保科技有限公司 2026-03-31 CN disclosed
US-20260008920-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF TEIJIN LIMITED (JP) 2026-01-08 US disclosed
US-20260002024-A1 FLAME RETARDANT POLYCARBONATE FORMULATIONS TRINSEO EUROPE GMBH (CH) 2026-01-01 US disclosed
EP-4667531-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF Teijin Limited (JP) 2025-12-24 EP disclosed
CN-114072461-A Thermoplastic resin composition, molded article, and product 三菱电机株式会社 2022-02-18 CN disclosed
US-20220049088-A1 POLYCARBONATE RESIN COMPOSITION IDEMITSU KOSAN CO., LTD (JP) 2022-02-17 US disclosed
CN-110248999-B Resin composition comprising acrylic block copolymer and light diffuser 株式会社可乐丽 2022-02-15 CN disclosed
EP-3950368-A1 METHOD FOR MANUFACTURING PRINTED MATTER Toray Industries, Inc. (JP) 2022-02-09 EP disclosed
EP-0364785-B1 Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board HITACHI LTD (JP) 1995-03-01 EP disclosed
JP-H04241989-A THERMAL RECORDING MATERIAL MITSUI TOATSU CHEM INC 1992-08-28 JP disclosed
JP-H04101888-A THERMAL RECORDING MATERIAL MITSUI TOATSU CHEM INC 1992-04-03 JP disclosed
US-5045381-A Containing (iso)cyanate compound and poly(p-hydroxystyrene) derivative HITACHI, LTD. (JP) 1991-09-03 US disclosed
EP-0364785-A1 Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board HITACHI, LTD. (JP) 1990-04-25 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260008920-A1 POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF NOP2, CCT2, RPL8 ESR1 2503/4885ESR2 1788/4885CYP3A4 3180/4885
US-20260092167-A1 AROMATIC POLYCARBONATE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF PAH, SEM1, ASH2L ESR1 748/4885ESR2 1563/4885CYP3A4 1243/4885
US-20260002024-A1 FLAME RETARDANT POLYCARBONATE FORMULATIONS PFAS, FGFR3, FGFR2 ESR1 3082/4885ESR2 3438/4885CYP3A4 2613/4885
US-20260139169-A1 Compostable Label with Adhesive CDH1, VCL, HACD2 ESR1 1678/4885ESR2 2764/4885CYP3A4 1834/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.