SCHEMBL8440982

SCHEMBL8440982

CO[Si](C)(O[Si](O[Si](C)(OC)c1ccccc1)(O[Si](C)(OC)c1ccccc1)c1ccccc1)c1ccccc1

nearest known ligand 0.34

Predicted protein targets (top 4)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.34
ESR2 Q92731 1/20 0.34
CA4 P22748 1/20 0.32
TSHR P16473 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8437442 0.94 ESR1 (0.33) ESR1ESR2CA4TSHR
SCHEMBL7601773 0.89 ESR1 (0.38) ESR1ESR2CA4TSHR
SCHEMBL16001335 0.87 ESR1 (0.34) ESR1ESR2CA4
SCHEMBL10609352 0.86 ESR1 (0.37) ESR1ESR2CA4TSHR
SCHEMBL30003108 0.86 ESR1 (0.37) ESR1ESR2CA4TSHR
SCHEMBL18094271 0.86 ESR1 (0.37) ESR1ESR2CA4TSHR
SCHEMBL15455618 0.84 ESR1 (0.35) ESR1ESR2CA4TSHR
SCHEMBL14193864 0.84 ESR1 (0.35) ESR1ESR2CA4TSHR
SCHEMBL49103 0.84 ESR1 (0.41) ESR1ESR2CA4TSHR
SCHEMBL10704415 0.82 CA4 (0.35) ESR1ESR2CA4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4035332-A Water-soluble silicone-modified resin compositions SHIN-ETSU CHEMICAL CO., (JA) 1977-07-12 US claimed
EP-0967235-A1 Silicon-modified resins based on recurring units derived from allyl alcohol and their use in weather-resistant coatings Cook Composites and Polymers Company (US) 1999-12-29 EP disclosed
US-5945188-A INSULATING FILM OF ADHESIVE LAYER, POLYAMIDE RESIN, INORGANIC FILLER, EPOXY RESIN LAYER WITH SILOXANE TOMOEGAWA PAPER CO., LTD. (JP) 1999-08-31 US disclosed
US-5843550-A Adhesive tape for tape automated bonding TOMOEGAWA PAPER CO., LTD. (JP) 1998-12-01 US disclosed
US-5523137-A ORGANIC INSULATING FILM, ADHESIVE AND PROTECTIVE LAYERS, RESPECTIVELY FORMED THEREON TOMOEGAWA PAPER CO., LTD. (JP) 1996-06-04 US disclosed
US-4141926-A Method for preparing epoxy-modified silicon resins SHIN-ETSU CHEMICAL CO., LTD. (JP) 1979-02-27 US disclosed
US-4035332-A Water-soluble silicone-modified resin compositions SHIN-ETSU CHEMICAL CO., (JA) 1977-07-12 US disclosed