SCHEMBL8660244

SCHEMBL8660244

CCCCCCCCCCCCCCCc1cccc(C(OC(c2cccc(CCCCCCCCCCCCCCC)c2)C2CO2)C2CO2)c1

nearest known ligand 0.48

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
SPHK2 Q9NRA0 3/20 0.46
SPHK1 Q9NYA1 2/20 0.46
LPL P06858 3/20 0.43
LIPG Q9Y5X9 3/20 0.43
PPARG P37231 3/20 0.40
PPARA Q07869 3/20 0.40
THRA P10827 1/20 0.39
THRB P10828 1/20 0.39
HTR2A P28223 2/20 0.39
DRD2 P14416 1/20 0.38
SLC6A2 P23975 1/20 0.38
HTR2C P28335 1/20 0.38
SLC6A4 P31645 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8046083 1.00 SPHK2 (0.46) SPHK2SPHK1LPLLIPGPPARG
SCHEMBL8905679 0.93 PPARA (0.47) SPHK2SPHK1LPLLIPGPPARG
SCHEMBL8904567 0.93 PPARA (0.47) SPHK2SPHK1LPLLIPGPPARG
SCHEMBL8906146 0.89 PPARA (0.43) SPHK2SPHK1PPARGPPARA
SCHEMBL8905983 0.86 PPARA (0.41) SPHK2SPHK1PPARGPPARA
SCHEMBL10411867 0.83 THRA (0.49) SPHK2SPHK1LPLLIPGTHRA
SCHEMBL7871491 0.83 THRA (0.49) SPHK2SPHK1LPLLIPGTHRA
SCHEMBL27082092 0.83 THRA (0.49) SPHK2SPHK1LPLLIPGTHRA
SCHEMBL8904822 0.82 TAAR1 (0.34) SPHK2SPHK1
SCHEMBL8905830 0.79 EP300 (0.37) PPARGPPARA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114057992-A Resin composition for carbon fiber molding 上纬新材料科技股份有限公司 2022-02-18 CN claimed
CN-113956441-A Die pressing free radical modified epoxy resin composition 上纬新材料科技股份有限公司 2022-01-21 CN claimed
CN-113150496-A Epoxy resin reinforced material 上纬新材料科技股份有限公司 2021-07-23 CN claimed
CN-113150221-A Unsaturated polyester and free radical modified epoxy resin composition 上纬新材料科技股份有限公司 2021-07-23 CN claimed
US-4828771-A POLYEPOXIDES TOTO LTD. (JP) 1989-05-09 US claimed
EP-0872504-A1 CURABLE EPOXY RESIN COMPOSITION WHICH GIVES FLEXIBLE CURED ARTICLE ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1998-10-21 EP disclosed
EP-0307918-B1 RESIN COMPOSITION CURABLE WITH AN ACTIVE ENERGY RAY CONTAINING EPOXY RESIN CONTAINING AT LEAST A COMPOUND HAVING ONE OR MORE OF EPOXY GROUP IN THE MOLECULE CANON KABUSHIKI KAISHA (JP) 1993-05-26 EP disclosed
EP-0307919-B1 RESIN COMPOSITION CURABLE WITH AN ACTIVE ENERGY RAY CONTAINING EPOXY RESIN AND MONOMER WITH ETHYLENICALLY UNSATURATED BOND CANON KABUSHIKI KAISHA (JP) 1993-05-19 EP disclosed
US-5068259-A A resin curable with ultraviolet radiation or electron beams capable of forming patterns on copper coated laminates for use as a printed board CANON KABUSHIKI KAISHA (JP) 1991-11-26 US disclosed
US-5068260-A A resin curable with ultraviolet radiation or electron beams capable of forming patterns on copper coated laminates for use as a printed board CANON KABUSHIKI KAISHA (JP) 1991-11-26 US disclosed
US-4828771-A POLYEPOXIDES TOTO LTD. (JP) 1989-05-09 US disclosed
EP-0307918-A2 Resin composition curable with an active energy ray containing epoxy resin containing at least a compound having one or more of epoxy group in the molecule CANON KABUSHIKI KAISHA (JP) 1989-03-22 EP disclosed
EP-0307919-A2 Resin composition curable with an active energy ray containing epoxy resin and monomer with ethylenically unsaturated bond CANON KABUSHIKI KAISHA (JP) 1989-03-22 EP disclosed
US-4797425-A EPOXY RESIN FROM BISPHENOL WITH AMIDE HARDENERS TOTO LTD. (JP) 1989-01-10 US disclosed
US-4542192-A Reactive hardenable polymer mixture and process for the preparation of hardened products therefrom HOECHST AKTIENGESELLSCHAFT (DE) 1985-09-17 US disclosed