SCHEMBL867377

SCHEMBL867377

C=C(C)C(=O)NCCOCC(C)C

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.46
MEN1 O00255 1/20 0.43
KMT2A Q03164 1/20 0.43
ALDH1A1 P00352 2/20 0.35
THRB P10828 1/20 0.35
TGFBR1 P36897 1/20 0.34
MMP9 P14780 1/20 0.34
MMP8 P22894 1/20 0.34
MMP14 P50281 1/20 0.34
ACACB O00763 1/20 0.33
ANPEP P15144 2/20 0.32
RNPEP Q9H4A4 2/20 0.32
DNPEP Q9ULA0 1/20 0.32
RXFP1 Q9HBX9 1/20 0.32
NAMPT P43490 1/20 0.31
CTSK P43235 1/20 0.31
GAA P10253 1/20 0.30
RAB9A P51151 1/20 0.30
SMN1; SMN2 Q16637 1/20 0.30
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20752394 0.91 MMP9 (0.43) TSHRMEN1KMT2AALDH1A1MMP9
SCHEMBL12036308 0.84 MEN1 (0.47) TSHRMEN1KMT2AALDH1A1THRB
SCHEMBL134916 0.83 TSHR (0.47) TSHRMEN1KMT2AALDH1A1THRB
SCHEMBL22425799 0.82 MEN1 (0.47) TSHRMEN1KMT2AALDH1A1ACACB
SCHEMBL13862904 0.82 MEN1 (0.50) TSHRMEN1KMT2AALDH1A1THRB
SCHEMBL18016179 0.82 MEN1 (0.50) TSHRMEN1KMT2AALDH1A1THRB
SCHEMBL10051130 0.81 USP2 (0.42) TSHRMEN1KMT2ATHRBTGFBR1
SCHEMBL553153 0.79 ALDH1A1 (0.50) TSHRMEN1KMT2AALDH1A1THRB
SCHEMBL24664661 0.79 MEN1 (0.53) TSHRMEN1KMT2AALDH1A1ACACB
SCHEMBL4849807 0.79 KMT2A (0.49) TSHRMEN1KMT2AALDH1A1THRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0283990-B1 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO LTD (JP) 1994-01-26 EP claimed
US-4996132-A Heat-resistant photosensitive resin composition TOYKO OHKA KOGYO CO. LTD. (JP) 1991-02-26 US claimed
EP-0283990-A2 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1988-09-28 EP claimed
EP-0280295-A2 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1988-08-31 EP claimed
US-10513573-B2 Process for producing silver nanowires and agent for controlling growth of silver nanowires SEIKO PMC CORPORATION (JP) 2019-12-24 US disclosed
US-20170174804-A1 Process for Producing Silver Nanowires and Agent for Controlling Growth of Silver Nanowires CHEMIPAZ CORPORATION (JP) 2017-06-22 US disclosed
US-9630250-B2 Process for producing silver nanowires and agent for controlling growth of silver nanowires SEIKO PMC CORPORATION (JP) 2017-04-25 US disclosed
US-20150062238-A1 BLACK INK COMPOSITION, INK SET, AND IMAGE FORMING METHOD FUJIFILM CORPORATION (JP) 2015-03-05 US disclosed
US-20130255444-A1 Process for Producing Silver Nanowires and Agent for Controlling Growth of Silver Nanowires SEIKO PMC CORPORATION (JP) 2013-10-03 US disclosed
US-8222326-B2 Water-based ink composition for inkjet recording FUJIFILM CORPORATION (JP) 2012-07-17 US disclosed
US-20120076951-A1 BLACK INK COMPOSITION, INK SET, AND IMAGE FORMING METHOD FUJIFILM CORPORATION (JP) 2012-03-29 US disclosed
US-20100160504-A1 WATER-BASED INK COMPOSITION FOR INKJET RECORDING FUJIFILM CORPORATION (JP) 2010-06-24 US disclosed
US-20100029840-A1 WATER BASED INKJET RECORDING INK FUJIFILM CORPORATION (JP) 2010-02-04 US disclosed
US-7202016-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2007-04-10 US disclosed
US-20050214680-A1 Radiation-sensitive resin composition MIYAJI MASAAKI 2005-09-29 US disclosed
US-6933094-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-08-23 US disclosed
US-20020058201-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2002-05-16 US disclosed
EP-1193558-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2002-04-03 EP disclosed
EP-0283990-B1 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO LTD (JP) 1994-01-26 EP disclosed
EP-0283990-A2 A heat-resistant photosensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 1988-09-28 EP disclosed