SCHEMBL868671

SCHEMBL868671

OCCc1ccc(C2(c3ccc(CCO)cc3)c3ccccc3-c3ccccc32)cc1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.53
KMT2A Q03164 3/20 0.53
MAPT P10636 3/20 0.53
LMNA P02545 2/20 0.53
KDM4E B2RXH2 2/20 0.53
OPRK1 P41145 1/20 0.53
SMN1; SMN2 Q16637 1/20 0.53
PDK2 Q15119 6/20 0.50
TDP1 Q9NUW8 2/20 0.48
ESR1 P03372 1/20 0.45
ESR2 Q92731 1/20 0.45
CA2 P00918 2/20 0.42
POLB P06746 1/20 0.41
NPC1 O15118 1/20 0.35
MAPK1 P28482 1/20 0.35
RAB9A P51151 1/20 0.35
NPSR1 Q6W5P4 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
CA12 O43570 1/20 0.35
CA1 P00915 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29690347 1.00 MEN1 (0.53) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL20253534 0.92 PDK2 (0.47) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL31513318 0.90 MEN1 (0.43) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL21858091 0.90 MEN1 (0.43) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL14353392 0.85 MEN1 (0.57) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL21858067 0.84 PDK2 (0.50) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL30292768 0.84 PDK2 (0.50) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL3022254 0.79 PTGS2 (0.36) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL18184923 0.79 MEN1 (0.50) MEN1KMT2AMAPTLMNAKDM4E
SCHEMBL973220 0.78 MEN1 (0.46) MEN1KMT2AMAPTLMNAKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250263363-A1 OLIGOMERIC BINAPHTYL COMPOUNDS AND THERMOPLASTIC RESINS MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-08-21 US disclosed
EP-4594286-A1 OLIGOMERIC BINAPHTYL COMPOUNDS AND THERMOPLASTIC RESINS MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-08-06 EP disclosed
WO-2025089429-A1 OLIGOMERIC BINAPHTHYL COMPOUNDS AND THERMOPLASTIC RESINS MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-05-01 WO disclosed
WO-2025088066-A1 OLIGOMERIC BINAPHTHYL COMPOUNDS AND THERMOPLASTIC RESINS REUTER CHEMISCHE APPARATEBAU E.K. (DE) 2025-05-01 WO disclosed
EP-4514880-A1 OLIGOMERIC BINAPHTYL COMPOUNDS AND THERMOPLASTIC RESINS Mitsubishi Gas Chemical Company, Inc. (JP) 2025-03-05 EP disclosed
EP-4514787-A1 OLIGOMERIC BINAPHTHYL COMPOUNDS AND THERMOPLASTIC RESINS Reuter Chemische Apparatebau e.K. (DE) 2025-03-05 EP disclosed
US-20250034071-A1 (HET)ARYL SUBSTITUTED BISPHENOL COMPOUNDS AND THERMOPLASTIC RESINS MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2025-01-30 US disclosed
US-20250019332-A1 (HET)ARYL SUBSTITUTED BISPHENOL COMPOUNDS AND THERMOPLASTIC RESINS REUTER CHEMISCHE APPBAU E K (DE) 2025-01-16 US disclosed
WO-2024184503-A1 SULFUR-CONTAINING HETEROCYCLIC COMPOUNDS AND THERMOPLASTIC RESINS REUTER CHEMISCHE APPARATEBAU E.K. (DE) 2024-09-12 WO disclosed
EP-4399199-A1 (HET)ARYL SUBSTITUTED BISPHENOL COMPOUNDS AND THERMOPLASTIC RESINS Reuter Chemische Apparatebau e.K. (DE) 2024-07-17 EP disclosed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US disclosed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US disclosed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP disclosed
US-7714032-B2 Thiol compound and photosensitive composition using the same SHOWA DENKO K.K. (JP) 2010-05-11 US disclosed
US-7622613-B2 Thiol compound and photosensitive composition using the same SHOWA DENKO K.K. (JP) 2009-11-24 US disclosed
US-20080286690-A1 THIOL COMPOUND AND PHOTOSENSITIVE COMPOSITION USING THE SAME SHOWA DENKO K.K. 2008-11-20 US disclosed
US-20080139688-A1 Thiol Compound And Photosensitive Composition Using The Same SHOWA DENKO K.K. (JP) 2008-06-12 US disclosed
EP-1805137-B1 THIOL COMPOUND AND PHOTOSENSITIVE COMPOSITION USING THE SAME SHOWA DENKO KK (JP) 2008-03-26 EP disclosed
EP-1805137-A1 THIOL COMPOUND AND PHOTOSENSITIVE COMPOSITION USING THE SAME SHOWA DENKO KABUSHIKI KAISHA (JP) 2007-07-11 EP disclosed
WO-2006046736-A1 THIOL COMPOUND AND PHOTOSENSITIVE COMPOSITION USING THE SAME SHOWA DENKO K.K. (JP) 2006-05-04 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20080139688-A1 Thiol Compound And Photosensitive Composition Using The Same TST, TMT1A, CRY1 MEN1 1565/4885KMT2A 270/4885MAPT 658/4885
US-20250019332-A1 (HET)ARYL SUBSTITUTED BISPHENOL COMPOUNDS AND THERMOPLASTIC RESINS CBR1, CBR3, CBX2 MEN1 4579/4885KMT2A 926/4885MAPT 4185/4885
US-20250034071-A1 (HET)ARYL SUBSTITUTED BISPHENOL COMPOUNDS AND THERMOPLASTIC RESINS CBR1, CBR3, AHR MEN1 4344/4885KMT2A 956/4885MAPT 4345/4885
US-20250263363-A1 OLIGOMERIC BINAPHTYL COMPOUNDS AND THERMOPLASTIC RESINS CBX2, CNPY2, BRIX1 MEN1 3457/4885KMT2A 470/4885MAPT 4111/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.