SCHEMBL869610

SCHEMBL869610

CCC(S)CC(=O)OCCOC(=O)CC(S)CC

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DGKA P23743 1/20 0.39
NAAA Q02083 1/20 0.34
MAPT P10636 2/20 0.33
MAPK1 P28482 1/20 0.33
NPSR1 Q6W5P4 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33
ALDH1A1 P00352 3/20 0.32
TSHR P16473 2/20 0.32
ADRA2A P08913 1/20 0.32
ADRA1A P35348 1/20 0.32
MGAM O43451 1/20 0.32
GAA P10253 1/20 0.32
SI P14410 1/20 0.32
MGAM2 Q2M2H8 1/20 0.32
BLM P54132 1/20 0.31
MET P08581 1/20 0.30
CYP2C19 P33261 1/20 0.30
RECQL P46063 1/20 0.30
TRPA1 O75762 1/20 0.30
CYP3A4 P08684 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1171157 0.94 ALDH1A1 (0.38) DGKANAAAMAPTMAPK1NPSR1
SCHEMBL16857561 0.91 NAAA (0.45) DGKANAAAMAPTMAPK1NPSR1
SCHEMBL16857565 0.91 NAAA (0.41) DGKANAAAMAPTMAPK1NPSR1
SCHEMBL5898809 0.86 GAA (0.48) L3MBTL1ALDH1A1TSHRMGAMGAA
Ethylene Glycol SCHEMBL16857564 0.86 NAAA (0.37) DGKANAAAMAPTMAPK1NPSR1
SCHEMBL11252052 0.85 NAAA (0.58) DGKANAAAMAPTMAPK1NPSR1
SCHEMBL8669032 0.82 TDP1 (0.51) MAPK1L3MBTL1ALDH1A1TSHRMET
SCHEMBL7710928 0.81 ALDH1A1 (0.40) ALDH1A1TDP1
SCHEMBL868662 0.81
SCHEMBL16632527 0.80 GAA (0.43) NPSR1ALDH1A1GAATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 136 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20170343037-A1 Reclosable Adhesive Strip HENKEL AG & CO. KGAA (DE) 2017-11-30 US claimed
EP-3227397-A2 A RECLOSABLE ADHESIVE STRIP Henkel AG & Co. KGaA (DE) 2017-10-11 EP claimed
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP claimed
WO-2016087608-A2 A RECLOSABLE ADHESIVE STRIP HENKEL AG & CO. KGAA (DE) 2016-06-09 WO claimed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US claimed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP claimed
US-12637544-B2 UV curable silicone composition and cured product thereof DUROPTIX MATERIALS KABUSHIKI KAISHA (JP) 2026-05-26 US disclosed
US-12492293-B2 Multi-component systems for preparing foamed products ARKEMA FRANCE (FR) 2025-12-09 US disclosed
US-12378450-B2 Adhesive for endoscope and cured product thereof, and endoscope and method for producing the same FUJIFILM CORPORATION (JP) 2025-08-05 US disclosed
EP-4089143-B1 LATEX COMPOSITION, MOLDED BODY AND METHOD FOR PRODUCING MOLDED BODY RESONAC CORP (JP) 2025-07-23 EP disclosed
US-20250154361-A1 RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND RECESS FILLING METHOD RESONAC CORPORATION (JP) 2025-05-15 US disclosed
EP-2055726-A1 THIOURETHANE COMPOUND AND PHOTOSENSITIVE RESIN COMPOSITION Showa Denko K.K. (JP) 2009-05-06 EP disclosed
US-20090023831-A1 Curable Composition Containing Thiol Compound SHOWA DENKO K.K. (JP) 2009-01-22 US disclosed
EP-1983017-A1 CURABLE COMPOSITION CONTAINING THIOL COMPOUND Showa Denko K.K. (JP) 2008-10-22 EP disclosed
US-7341828-B2 Thiol compound, photopolymerization initiator composition and photosensitive composition SHOWA DENKO K.K. (JP) 2008-03-11 US disclosed
US-20050153231-A1 Thiol compound, photopolymerization initiator composition and photosensitive composition SHOWA DENKO K.K. (JP) 2005-07-14 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12637544-B2 UV curable silicone composition and cured product thereof QSOX1, MGMT, TST DGKA 3527/4885NAAA 2398/4885MAPT 1377/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.