SCHEMBL869640

SCHEMBL869640

CC(S)CC(=O)OCC(C)(CO)COC(=O)CC(C)S

nearest known ligand 0.36

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.32
HSD17B10 Q99714 1/20 0.32
PRKCA P17252 1/20 0.31
TSHR P16473 2/20 0.30
CYP3A4 P08684 1/20 0.30
NFKB1 P19838 1/20 0.30
ADRA1A P35348 1/20 0.30
RAB9A P51151 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL869120 0.90 LMNA (0.34) LMNAHSD17B10PRKCATSHRCYP3A4
SCHEMBL9958476 0.88 ALDH1A1 (0.37) CYP3A4
SCHEMBL12192460 0.86 MMP1 (0.38) LMNAHSD17B10PRKCATSHRCYP3A4
SCHEMBL24146438 0.84 LMNA (0.31) LMNAHSD17B10
SCHEMBL869642 0.83 ALDH1A1 (0.37) PRKCACYP3A4
SCHEMBL25709316 0.83 ALDH1A1 (0.37) PRKCACYP3A4
SCHEMBL869409 0.83 ALDH1A1 (0.41) PRKCACYP3A4
SCHEMBL99777 0.82 SERPINE1 (0.34) PRKCA
SCHEMBL21237424 0.82 LMNA (0.30) LMNAHSD17B10
SCHEMBL98537 0.80 MAPK1 (0.31) PRKCA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP claimed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US claimed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US claimed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP claimed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US claimed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US claimed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP claimed
EP-2436715-B1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO KK (JP) 2016-08-24 EP disclosed
US-8865801-B2 Epoxy resin-based coating composition SHOWA DENKO K.K. (JP) 2014-10-21 US disclosed
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US disclosed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP disclosed
US-20120077903-A1 EPOXY RESIN-BASED COATING COMPOSITION SHOWA DENKO K.K. (JP) 2012-03-29 US disclosed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US disclosed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP disclosed