SCHEMBL890322

SCHEMBL890322

C=CC(=O)OC(C=C)OC(=O)c1ccccc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.49
TP53 P04637 1/20 0.49
AKT1 P31749 1/20 0.44
LMNA P02545 2/20 0.42
F2 P00734 1/20 0.42
PDCD1 Q15116 1/20 0.40
CD274 Q9NZQ7 1/20 0.40
ESR1 P03372 1/20 0.39
ESR2 Q92731 1/20 0.39
NPC1 O15118 3/20 0.39
RAB9A P51151 3/20 0.39
ALDH1A1 P00352 2/20 0.39
HTT P42858 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
THRB P10828 1/20 0.38
SLC6A4 P31645 1/20 0.38
SLC6A3 Q01959 1/20 0.38
POLB P06746 2/20 0.38
TDP1 Q9NUW8 1/20 0.37
PLA2G7 Q13093 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14362156 0.91 TSHR (0.57) TSHRTP53AKT1LMNAF2
SCHEMBL10427916 0.83 ALDH1A1 (0.42) AKT1ALDH1A1HTTSMN1; SMN2THRB
SCHEMBL434162 0.80 TSHR (0.49) TSHRTP53AKT1LMNAF2
SCHEMBL7200118 0.80 KDM4E (0.38) TP53ALDH1A1SMN1; SMN2THRBTDP1
SCHEMBL7200123 0.78 KDM4E (0.40) TSHRTP53ALDH1A1SMN1; SMN2THRB
SCHEMBL299999 0.78 THRB (0.46) TP53AKT1LMNAALDH1A1SMN1; SMN2
SCHEMBL277923 0.78 TSHR (0.39) TSHRTP53LMNAALDH1A1SMN1; SMN2
SCHEMBL5433205 0.77 CYP3A4 (0.34) TSHRLMNAALDH1A1HTTSMN1; SMN2
SCHEMBL3791059 0.77 TSHR (0.57) TSHRTP53AKT1LMNAF2
SCHEMBL9650729 0.76 TSHR (0.45) TSHRTP53AKT1LMNAF2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9012555-B2 UV-curable thermoformable dielectric for thermoformable circuits E I DU PONT DE NEMOURS AND COMPANY (US) 2015-04-21 US disclosed
US-20140350162-A1 UV-CURABLE THERMOFORMABLE DIELECTRIC FOR THERMOFORMABLE CIRCUITS E I DU PONT DE NEMOURS AND COMPANY (US) 2014-11-27 US disclosed
US-20140350161-A1 UV-CURABLE THERMOFORMABLE DIELECTRIC FOR THERMOFORMABLE CIRCUITS E I DU PONT DE NEMOURS AND COMPANY (US) 2014-11-27 US disclosed
EP-2571916-B1 UV-CURABLE POLYMER THICK FILM DIELECTRIC COMPOSITIONS WITH EXCELLENT ADHESION TO ITO DU PONT (US) 2014-09-17 EP disclosed
US-8329772-B2 UV-curable polymer thick film dielectric compositions with excellent adhesion to ITO E I DU PONT DE NEMOURS AND COMPANY (US) 2012-12-11 US disclosed
US-20110288197-A1 UV-CURABLE POLYMER THICK FILM DIELECTRIC COMPOSITIONS WITH EXCELLENT ADHESION TO ITO E. I. DU PONT DE NEMOURS AND COMPANY (US) 2011-11-24 US disclosed
EP-0264037-B1 UV-CURABLE DIELECTRIC COMPOSITIONS E.I. DU PONT DE NEMOURS AND COMPANY (US) 1993-01-20 EP disclosed
US-4902605-A Photoresist composition comprising cyclohexyleneoxyalkyl acrylates EASTMAN KODAK COMPANY (US) 1990-02-20 US disclosed
EP-0300203-A2 Photoresist composition comprising cyclohexyleneoxyalkyl acrylates EASTMAN KODAK COMPANY (a New Jersey corporation) (US) 1989-01-25 EP disclosed
US-4771085-A TALC AND-OR MICA DISPERSED IN ACRYLATED RUBBER MODIFIED EPOXY RESIN OLIGOMER, ACRYLATED POLYDIENE OLIGOMER AND ALKYL ACRYLATE E. I. DU PONT DE NEMOURS AND COMPANY (US) 1988-09-13 US disclosed
US-4767883-A PHOTORESISTS; FLEXIBILITY; LOW VISCOSITY, HIGH GLASS TRANSITION TEMPERATURE; CROSSLINKABLE EASTMAN KODAK COMPANY (US) 1988-08-30 US disclosed
EP-0264037-A2 UV-curable dielectric compositions E.I. DU PONT DE NEMOURS AND COMPANY (US) 1988-04-20 EP disclosed
US-4322490-A Photopolymerizable compositions featuring improved monomers EASTMAN KODAK COMPANY (US) 1982-03-30 US disclosed