SCHEMBL892872

SCHEMBL892872

Cc1cc(-c2cc(C)c(CO)c(C)c2)cc(C)c1CO

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 1/20 0.48
CA2 P00918 1/20 0.48
ALDH1A1 P00352 4/20 0.41
CYP3A4 P08684 2/20 0.41
TSHR P16473 2/20 0.41
TDP1 Q9NUW8 2/20 0.41
TP53 P04637 1/20 0.41
CYP1A2 P05177 1/20 0.36
CYP2C9 P11712 1/20 0.36
CYP2C19 P33261 1/20 0.36
PGK1 P00558 1/20 0.34
PGK2 P07205 1/20 0.34
SHBG P04278 1/20 0.33
FYN P06241 1/20 0.33
KDM4E B2RXH2 2/20 0.32
HPGD P15428 1/20 0.32
HSD17B10 Q99714 1/20 0.32
GABRA1 P14867 1/20 0.32
GABRG2 P18507 1/20 0.32
GABRB3 P28472 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12226534 0.86 ESR2 (0.44) ALDH1A1TSHRKDM4ESMN1; SMN2
SCHEMBL95192 0.82 HRH3 (0.40) CA1CA2ALDH1A1TDP1TP53
SCHEMBL3469757 0.80 CYP3A4 (0.48) ALDH1A1CYP3A4TDP1SHBGKDM4E
SCHEMBL13199148 0.80 ACHE (0.43) ALDH1A1TSHRPGK1PGK2SHBG
SCHEMBL7969500 0.78 HTR1D (0.40) CA2ALDH1A1CYP3A4TSHRTDP1
SCHEMBL5729221 0.78 TSHR (0.35) ALDH1A1CYP3A4TSHRPGK1PGK2
SCHEMBL11929878 0.78 TTR (0.38) ALDH1A1PGK1PGK2SHBGKDM4E
SCHEMBL14724936 0.78 PTGS1 (0.35) CA1ALDH1A1PGK1PGK2SHBG
SCHEMBL14128817 0.77 MAPT (0.44) ALDH1A1TSHRCYP1A2KDM4EHPGD
SCHEMBL7708095 0.77 PGK1 (0.50) ALDH1A1PGK1PGK2SHBGKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130289187-A1 RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE SUMITOMO BAKELITE COMPANY LIMITED (JP) 2013-10-31 US disclosed
US-8502399-B2 Resin composition for encapsulating semiconductor and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-08-06 US disclosed
US-20120080809-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2012-04-05 US disclosed
US-20080286688-A1 Photosensitive Resin Composition and Cured Product Thereof NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2008-11-20 US disclosed
EP-1710626-A1 PHOTOSENSITIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF Nippon Kayaku Kabushiki Kaisha (JP) 2006-10-11 EP disclosed