SCHEMBL893113

SCHEMBL893113

COCc1c(C)cc(-c2cc(C)c(COC)c(C)c2)cc1C

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 2/20 0.44
HSD17B10 Q99714 2/20 0.44
ALDH1A1 P00352 3/20 0.38
TDP1 Q9NUW8 2/20 0.38
TP53 P04637 1/20 0.38
CYP3A4 P08684 1/20 0.38
TSHR P16473 1/20 0.38
CA1 P00915 1/20 0.38
CA2 P00918 1/20 0.38
BRD4 O60885 2/20 0.33
BRD9 Q9H8M2 2/20 0.33
KDM4E B2RXH2 1/20 0.32
GAA P10253 1/20 0.32
ALOX15 P16050 1/20 0.32
APOBEC3G Q9HC16 1/20 0.32
IGF1R P08069 1/20 0.31
SRC P12931 1/20 0.31
AXL P30530 1/20 0.31
PTK2 Q05397 1/20 0.31
AURKB Q96GD4 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3807690 0.84 HPGD (0.44) HPGDHSD17B10ALDH1A1KDM4EGAA
SCHEMBL14008505 0.82 HPGD (0.47) HPGDHSD17B10ALDH1A1TDP1CYP3A4
SCHEMBL15216746 0.80 ALDH1A1 (0.46) HPGDHSD17B10ALDH1A1CYP3A4TSHR
SCHEMBL13626758 0.80 HPGD (0.42) HPGDHSD17B10ALDH1A1KDM4EGAA
SCHEMBL11930746 0.80 HPGD (0.42) HPGDHSD17B10ALDH1A1KDM4EGAA
SCHEMBL23638591 0.80 HPGD (0.42) HPGDHSD17B10ALDH1A1KDM4EGAA
SCHEMBL12895706 0.78 HPGD (0.41) HPGDHSD17B10TDP1CYP3A4KDM4E
SCHEMBL14416262 0.78 HPGD (0.38) HPGDHSD17B10ALDH1A1TDP1TP53
SCHEMBL12013420 0.77 ADRA2A (0.41) HPGDHSD17B10
SCHEMBL11315118 0.74 HPGD (0.48) HPGDHSD17B10ALDH1A1TDP1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20130289187-A1 RESIN COMPOSITION FOR ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE SUMITOMO BAKELITE COMPANY LIMITED (JP) 2013-10-31 US disclosed
US-8502399-B2 Resin composition for encapsulating semiconductor and semiconductor device SUMITOMO BAKELITE CO., LTD. (JP) 2013-08-06 US disclosed
US-20120080809-A1 RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2012-04-05 US disclosed