Benzoic Acid

Benzoic Acid

SCHEMBL893336

C=CC(=O)OCC(CC)(CO)CO.O=C(O)c1ccccc1

nearest known ligand 0.55

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

CACNA1CCACNA1DCACNA1FCACNA1SDPP4HTR1BHTR1D

The experimentally established mechanism targets of Benzoic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 3/20 0.55
HIF1A Q16665 2/20 0.55
ALDH1A1 P00352 2/20 0.55
TP53 P04637 1/20 0.55
CYP3A4 P08684 1/20 0.55
SMN1; SMN2 Q16637 1/20 0.55
THRB P10828 3/20 0.48
TSHR P16473 3/20 0.38
DAO P14920 1/20 0.38
NAPRT Q6XQN6 1/20 0.38
AKT1 P31749 1/20 0.37
LMNA P02545 1/20 0.36
MAPT P10636 2/20 0.35
HTR1A P08908 1/20 0.35
CYP2D6 P10635 1/20 0.35
SCN1A P35498 1/20 0.35
SLC6A3 Q01959 1/20 0.35
SCN5A Q14524 1/20 0.35
SCN2A Q99250 1/20 0.35
TDP1 Q9NUW8 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL890407 0.88 MAPK1 (0.56) MAPK1HIF1AALDH1A1TP53CYP3A4
Benzoic Acid SCHEMBL28072643 0.85 THRB (0.39) MAPK1HIF1AALDH1A1TP53CYP3A4
SCHEMBL822601 0.85 MAPK1 (0.63) MAPK1HIF1AALDH1A1TP53CYP3A4
SCHEMBL134216 0.84 ALDH1A1 (0.78) MAPK1HIF1AALDH1A1TP53CYP3A4
Benzoic Acid SCHEMBL2426070 0.83 ALDH1A1 (0.46) MAPK1HIF1AALDH1A1TP53CYP3A4
Benzoic Acid SCHEMBL4622841 0.83 TSHR (0.45) MAPK1HIF1AALDH1A1TP53CYP3A4
Benzoic Acid SCHEMBL57610 0.83 TSHR (0.45) MAPK1HIF1AALDH1A1TP53CYP3A4
Formaldehyde SCHEMBL23716978 0.82 ALDH1A1 (0.75) MAPK1HIF1AALDH1A1TP53CYP3A4
SCHEMBL5278958 0.82 ALDH1A1 (0.75) MAPK1HIF1AALDH1A1TP53CYP3A4
SCHEMBL17685546 0.82 ALDH1A1 (0.75) MAPK1HIF1AALDH1A1TP53CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8173048-B2 Composition for circuit connection film and circuit connection film using the same CHEIL INDUSTRIES, INC. (KR) 2012-05-08 US claimed
US-20100148130-A1 Composition for circuit connection film and circuit connection film using the same KUKDO ADVANCED MATERIALS CO., LTD. (KR) 2010-06-17 US claimed
US-10141084-B2 Electronic device CHEIL INDUSTRIES, INC. (KR) 2018-11-27 US disclosed
US-9589696-B2 Semiconductor device using composition for anisotropic conductive adhesive film or anisotropic conductive adhesive film CHEIL INDUSTRIES, INC. (KR) 2017-03-07 US disclosed
EP-1508604-B2 HEAT-EXPANDABLE MICROCAPSULE AND USE THEREOF MATSUMOTO YUSHI SEIYAKU KK (JP) 2016-11-16 EP disclosed
US-9389338-B2 Optical member comprising anisotropic conductive film CHEIL INDUSTRIES, INC. (KR) 2016-07-12 US disclosed
US-8728352-B2 Electrical connection material and a solar cell including the same CHEIL INDUSTRIES, INC. (KR) 2014-05-20 US disclosed
US-20130213691-A1 ELECTRONIC DEVICE KUKDO CHEMICAL CO., LTD. (KR) 2013-08-22 US disclosed
US-20130113119-A1 SEMICONDUCTOR DEVICE USING COMPOSITION FOR ANISOTROPIC CONDUCTIVE ADHESIVE FILM OR ANISOTROPIC CONDUCTIVE ADHESIVE FILM KUKDO ADVANCED MATERIALS CO., LTD. (KR) 2013-05-09 US disclosed
US-20120141802-A1 OPTICAL MEMBER COMPRISING ANISOTROPIC CONDUCTIVE FILM KUKDO CHEMICAL CO., LTD. (KR) 2012-06-07 US disclosed
US-8173048-B2 Composition for circuit connection film and circuit connection film using the same CHEIL INDUSTRIES, INC. (KR) 2012-05-08 US disclosed
US-20120080068-A1 ELECTRICAL CONNECTION MATERIAL AND A SOLAR CELL INCLUDING THE SAME KUKDO CHEMICAL CO., LTD. (KR) 2012-04-05 US disclosed
EP-1508604-B1 HEAT-EXPANDABLE MICROCAPSULE AND USE THEREOF MATSUMOTO YUSHI SEIYAKU KK (JP) 2011-09-28 EP disclosed
US-20100159234-A1 Adhesive film composition for electric and electronic devices and adhesive film using the same CHEIL INDUSTRIES, INC. (KR) 2010-06-24 US disclosed
US-20100148130-A1 Composition for circuit connection film and circuit connection film using the same KUKDO ADVANCED MATERIALS CO., LTD. (KR) 2010-06-17 US disclosed
US-6984347-B2 Thermo-expansive microcapsules and their application MATSUMOTO YUSHI-SEIYAKU CO., LTD. (JP) 2006-01-10 US disclosed
EP-1508604-A1 HEAT-EXPANDING MICROCAPSULE AND USE THEREOF MATSUMOTO YUSHI-SEIYAKU CO., LTD. (JP) 2005-02-23 EP disclosed
US-20050026067-A1 Thermo-expansive microcapsules and their application MATSUMOTO YUSHI-SEIYAKU CO., LTD. (JP) 2005-02-03 US disclosed