SCHEMBL890407

SCHEMBL890407

C=CC(=O)OCC(CC)(CO)COC(=O)c1ccccc1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPK1 P28482 2/20 0.56
HIF1A Q16665 2/20 0.56
ALDH1A1 P00352 3/20 0.54
SMN1; SMN2 Q16637 3/20 0.54
CYP3A4 P08684 2/20 0.54
TP53 P04637 1/20 0.54
THRB P10828 2/20 0.47
TDP1 Q9NUW8 4/20 0.45
SLC6A3 Q01959 2/20 0.45
CYP2D6 P10635 2/20 0.45
HTR1A P08908 1/20 0.45
SCN1A P35498 1/20 0.45
SCN5A Q14524 1/20 0.45
SCN2A Q99250 1/20 0.45
SCN3A Q9NY46 1/20 0.45
LMNA P02545 1/20 0.44
KMT2A Q03164 3/20 0.42
TSHR P16473 1/20 0.39
CYP1A2 P05177 2/20 0.39
CYP2C19 P33261 2/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL822601 0.95 MAPK1 (0.63) MAPK1HIF1AALDH1A1SMN1; SMN2CYP3A4
SCHEMBL30485505 0.92 ALDH1A1 (0.65) MAPK1HIF1AALDH1A1SMN1; SMN2CYP3A4
SCHEMBL20192056 0.90 MAPK1 (0.56) MAPK1HIF1AALDH1A1SMN1; SMN2CYP3A4
Acrylic Acid SCHEMBL57609 0.89 MAPK1 (0.59) MAPK1HIF1AALDH1A1SMN1; SMN2CYP3A4
SCHEMBL11436193 0.89 MAPK1 (0.71) MAPK1HIF1AALDH1A1SMN1; SMN2TDP1
Benzoic Acid SCHEMBL893336 0.88 MAPK1 (0.55) MAPK1HIF1AALDH1A1SMN1; SMN2CYP3A4
SCHEMBL16142139 0.87 MAPK1 (0.54) MAPK1HIF1AALDH1A1SMN1; SMN2CYP3A4
SCHEMBL505769 0.86 MAPK1 (0.71) MAPK1HIF1AALDH1A1SMN1; SMN2TDP1
SCHEMBL21164111 0.85 MAPK1 (0.51) MAPK1HIF1AALDH1A1SMN1; SMN2CYP3A4
SCHEMBL21318094 0.84 ESR1 (0.51) MAPK1HIF1AALDH1A1SMN1; SMN2CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 296 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114656818-B metal oxide dispersion 凯斯科技股份有限公司 2023-11-17 CN claimed
US-7879259-B2 thermoplastic resin and a styrene-acrylonitrile (SAN) copolymer resin, a curing composition, and conductive particles; exhibiting improved adhesion and low contact resistance characteristics CHEIL INDUSTRIES, INC. (KR) 2011-02-01 US claimed
US-20080099733-A1 Anisotropic conductive film composition CHEIL INDUSTRIES, INC. 2008-05-01 US claimed
CN-115698183-B Resin composition for wiring board material, and prepreg, resin-equipped film, resin-equipped metal foil, metal foil-clad laminate and wiring board using the resin composition 松下知识产权经营株式会社 2024-06-25 CN disclosed
US-20240101843-A1 INFRARED-ABSORBING ULTRAVIOLET-CURABLE INK, AND INFRARED-ABSORBING PRINTED MATTER KYODO PRINTING CO., LTD. (JP) 2024-03-28 US disclosed
US-11912053-B2 Thermal transfer sheet, coating liquid for release layer, and method for producing thermal transfer sheet DAI NIPPON PRINTING CO., LTD. (JP) 2024-02-27 US disclosed
EP-4286164-A1 INFRARED-ABSORBING ULTRAVIOLET-CURABLE INK, AND INFRARED-ABSORBING PRINTED MATTER Kyodo Printing Co., Ltd. (JP) 2023-12-06 EP disclosed
CN-114656818-B metal oxide dispersion 凯斯科技股份有限公司 2023-11-17 CN disclosed
US-11697299-B2 Thermal transfer sheet, combination of thermal transfer sheet and intermediate transfer medium, method for producing print, and thermal transfer printer DAI NIPPON PRINTING CO., LTD. (JP) 2023-07-11 US disclosed
US-20230212392-A1 RESIN COMPOSITION FOR WIRING BOARD MATERIAL, AND PREPREG, RESIN-COATED FILM, RESIN-COATED METAL FOIL, METAL-CLAD LAMINATE, AND WIRING BOARD IN WHICH SAID RESIN COMPOSITION IS USED PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (JP) 2023-07-06 US disclosed
CN-116200744-A Flexible copper-clad laminate film, method for producing same, and electrical element comprising same 东丽尖端素材株式会社 2023-06-02 CN disclosed
US-20040024078-A1 Ultraviolet ray curable ink, ink composition for ink jet and process for preparing ink jet printed matter using the same SEIREN CO., LTD. (JP) 2004-02-05 US disclosed
EP-1378794-A1 Light sensitive composition and light sensitive planographic printing plate precursor KONICA CORPORATION (JP) 2004-01-07 EP disclosed
US-20030194649-A1 Light sensitive compostion, light sensitive planographic printing plate precursor, and image formation method KONICA CORPORATION (JP) 2003-10-16 US disclosed
EP-1335247-A2 Light sensitive composition, light sensitive planographic printing plate precursor, and image formation method KONICA CORPORATION (JP) 2003-08-13 EP disclosed
US-20030113667-A1 Method of preparing planographic printing plate FUJIFILM CORPORATION (JP) 2003-06-19 US disclosed
US-6074741-A ROUGHENED SURFACE LAYER IS FORMED FROM AN ULTRAVIOLET CURING RESIN CONTAINING AT LEAST AN EPOXY COMPOUND AND A PHOTO-CATIONIC POLYMERIZATION INITIATOR, AND BEADS OF A CROSSLINKED ACRYLIC RESIN. TOMOEGAWA PAPER CO., LTD. (JP) 2000-06-13 US disclosed
EP-0762208-B1 Light sensitive composition KONISHIROKU PHOTO IND (JP) 2000-04-12 EP disclosed
US-5773194-A PHOTOSENSITIVITY; DURABILITY KONICA CORPORATION (JP) 1998-06-30 US disclosed
EP-0762208-A2 Light sensitive composition, presensitized lithographic printing plate and image forming method employing the printing plate KONICA CORPORATION (JP) 1997-03-12 EP disclosed