SCHEMBL8972029

SCHEMBL8972029

C=CCC(c1ccccc1)N1C(=O)C2C3C=CC(C3)C2C1=O

nearest known ligand 0.47

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.47
SMN1; SMN2 Q16637 4/20 0.47
TSHR P16473 3/20 0.47
MEN1 O00255 2/20 0.45
KMT2A Q03164 2/20 0.45
KDM4E B2RXH2 2/20 0.44
MAPK1 P28482 1/20 0.44
LMNA P02545 3/20 0.43
HSD11B1 P28845 1/20 0.42
HSP90AA1 P07900 1/20 0.42
MAPT P10636 1/20 0.42
CYP2C19 P33261 1/20 0.41
GAA P10253 1/20 0.40
HTT P42858 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.39
HPGD P15428 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8970926 0.87 ALDH1A1 (0.46) ALDH1A1SMN1; SMN2TSHRMEN1KMT2A
SCHEMBL8971770 0.85 ALDH1A1 (0.39) ALDH1A1SMN1; SMN2TSHRMEN1KMT2A
SCHEMBL8970976 0.79 TSHR (0.55) ALDH1A1SMN1; SMN2TSHRMEN1KMT2A
SCHEMBL8854361 0.79 ALDH1A1 (0.47) ALDH1A1SMN1; SMN2TSHRMEN1KMT2A
SCHEMBL8972170 0.78 MEN1 (0.37) ALDH1A1SMN1; SMN2TSHRMEN1KMT2A
SCHEMBL8970956 0.78 MEN1 (0.46) ALDH1A1SMN1; SMN2TSHRMEN1KMT2A
SCHEMBL8854362 0.76 MEN1 (0.44) ALDH1A1SMN1; SMN2TSHRMEN1KMT2A
SCHEMBL8971289 0.76 MEN1 (0.51) ALDH1A1SMN1; SMN2TSHRMEN1KMT2A
SCHEMBL8854355 0.73 ALDH1A1 (0.55) ALDH1A1SMN1; SMN2TSHRMEN1KMT2A
SCHEMBL8971905 0.71 KMT2A (0.47) ALDH1A1SMN1; SMN2TSHRMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5521260-A ALKENYLNADIMIDE, VINYL COMPOUND, PHENOLIC RESIN MARUZEN PETROCHEMICAL CO., LTD. (JP) 1996-05-28 US disclosed
US-4885346-A HEAT CURABLE; MOLDING MATERIALS CIBA-GEIGY CORPORATION (US) 1989-12-05 US disclosed
US-4745166-A Heat-curable mixture containing substituted bicyclo (2.2.1) hept-5-ene-2,3-dicarboximide and polymaleimide, and ethylenically unsaturated phenolic compound CIBA-GEIGY CORPORATION (US) 1988-05-17 US disclosed
US-4678849-A PREPREGS, COMPOSITES, COATINGS CIBA-GEIGY CORPORATION (US) 1987-07-07 US disclosed