Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.39 |
| ▸ | TP53 | P04637 | 2/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.36 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.36 |
| ▸ | CASP1 | P29466 | 2/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | USP2 | O75604 | 1/20 | 0.36 |
| ▸ | POLB | P06746 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | MAPT | P10636 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | CASP7 | P55210 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.36 |
| ▸ | ATM | Q13315 | 1/20 | 0.36 |
| ▸ | RECQL | P46063 | 1/20 | 0.34 |
| ▸ | LMNA | P02545 | 1/20 | 0.31 |
| ▸ | ENPP2 | Q13822 | 1/20 | 0.31 |
| ▸ | ELANE | P08246 | 1/20 | 0.30 |
| ▸ | MAOB | P27338 | 2/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9804112 | 0.80 | MAPT (0.36) | TSHRCYP3A4TP53ALDH1A1KDM4E | |
| SCHEMBL31094240 | 0.79 | LMNA (0.36) | TSHRALDH1A1KDM4EMEN1HTT | |
| SCHEMBL9804229 | 0.78 | ALDH1A1 (0.44) | TSHRCYP3A4TP53ALDH1A1KDM4E | |
| SCHEMBL30038673 | 0.78 | ALDH1A1 (0.44) | TSHRCYP3A4TP53ALDH1A1KDM4E | |
| SCHEMBL23493417 | 0.77 | TP53 (0.39) | TP53MEN1KMT2A | |
| SCHEMBL29434616 | 0.77 | TP53 (0.39) | TP53MEN1KMT2A | |
| SCHEMBL705704 | 0.77 | LPL (0.30) | — | |
| SCHEMBL29434654 | 0.76 | HPGD (0.33) | KMT2ALMNA | |
| SCHEMBL23493484 | 0.76 | HPGD (0.33) | KMT2ALMNA | |
| SCHEMBL27659960 | 0.69 | CYP3A4 (0.55) | TSHRCYP3A4TP53ALDH1A1KDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0330456-B1 | Preparation of silicon-containing polyimide precursor and cured polyimides obtained therefrom | CHISSO CORP (JP) | 1994-09-07 | — | — | EP | claimed |
| EP-0216007-B1 | PROCESS FOR PRODUCING ORGANIC SILICON-TERMINATED POLYIMIDE PRECURSOR AND POLYIMIDE | HITACHI, LTD. (JP) | 1991-03-13 | — | — | EP | claimed |
| US-4748228-A | Process for producing organic silicon-terminated polyimide precursor and polyimide | HITACHI. LTD. (JP) | 1988-05-31 | — | — | US | claimed |
| EP-0216007-A2 | Process for producing organic silicon-terminated polyimide precursor and polyimide | HITACHI, LTD. (JP) | 1987-04-01 | — | — | EP | claimed |
| EP-0381506-B1 | Silicon polyimide precursor composition | CHISSO CORP (JP) | 1996-12-18 | — | — | EP | disclosed |
| EP-0456469-B1 | Photosensitive heat-resistant polymer having hydroxyphenyl group | CHISSO CORP (JP) | 1996-08-21 | — | — | EP | disclosed |
| US-5342739-A | Coating a substrate with a polyamic acid modified by an amino- or hydroxy-substituted phenol; shelf life | CHISSO CORPORATION (JP) | 1994-08-30 | — | — | US | disclosed |
| US-5320935-A | Method of forming a pattern from a photosensitive heat-resistant poly(amide)imide having hydroxyphenyl groups | CHISSO CORPORATION (JP) | 1994-06-14 | — | — | US | disclosed |
| US-5298359-A | Combined with initiator,, an azide, an unsaturated compound | CHISSO CORPORATION (JP) | 1994-03-29 | — | — | US | disclosed |
| EP-0337698-B1 | Photosensitive Polymer | CHISSO CORP (JP) | 1993-11-10 | — | — | EP | disclosed |
| EP-0526650-A1 | PHOTOSENSITIVE POLYMER COMPOSITION AND PATTERN FORMATION | CHISSO CORPORATION (JP) | 1993-02-10 | — | — | EP | disclosed |
| US-5071908-A | Crosslinking a polyamic acid modified by an amine-containing silane by a silicon compound; hard, tough films; heat resistance; adhesion | CHISSO CORPORATION (JP) | 1991-12-10 | — | — | US | disclosed |
| EP-0456469-A2 | Photosensitive heat-resistant polymer having hydroxyphenyl group | Chisso Corporation (JP) | 1991-11-13 | — | — | EP | disclosed |
| EP-0216007-B1 | PROCESS FOR PRODUCING ORGANIC SILICON-TERMINATED POLYIMIDE PRECURSOR AND POLYIMIDE | HITACHI, LTD. (JP) | 1991-03-13 | — | — | EP | disclosed |
| EP-0381506-A2 | Silicon polyimide precursor composition | Chisso Corporation (JP) | 1990-08-08 | — | — | EP | disclosed |
| EP-0216007-A2 | Process for producing organic silicon-terminated polyimide precursor and polyimide | HITACHI, LTD. (JP) | 1987-04-01 | — | — | EP | disclosed |