SCHEMBL9001097

SCHEMBL9001097

Nc1cccc(Oc2ccc(C3(Oc4cccc(N)c4)C=CC=CC3)cc2)c1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 1/20 0.46
ALDH1A1 P00352 5/20 0.41
MAPT P10636 2/20 0.41
SMN1; SMN2 Q16637 2/20 0.41
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
MITF O75030 1/20 0.41
GAA P10253 1/20 0.41
GFER P55789 1/20 0.41
NLRP1 Q9C000 1/20 0.41
NOD2 Q9HC29 1/20 0.41
ATM Q13315 1/20 0.40
LTA4H P09960 1/20 0.39
POLB P06746 1/20 0.36
HSP90AA1 P07900 1/20 0.36
CYP3A4 P08684 2/20 0.34
NPC1 O15118 2/20 0.34
RAB9A P51151 2/20 0.34
NLRP3 Q96P20 1/20 0.34
MAOA P21397 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28213857 0.88 MAOB (0.42) MAOBALDH1A1MAPTMEN1KMT2A
SCHEMBL7875560 0.84 ALDH1A1 (0.42) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL28213823 0.75 MAOA (0.38) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL7629801 0.75 CYP3A4 (0.42) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL30302594 0.75 CYP3A4 (0.42) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29363390 0.72 MAOB (0.86) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29352463 0.72 MAOB (0.86) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL204267 0.72 MAOB (0.86) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL128748 0.72 MAOB (0.86) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL1270913 0.72 MAOB (0.86) MAOBALDH1A1MAPTSMN1; SMN2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0728792-A2 Heat-resistant adhesive and method of adhesion by using adhesive MITSUI TOATSU CHEMICALS, Inc. (JP) 1996-08-28 EP disclosed
US-5300620-A Polyamic acids and/or polyimides are blocked with aromatic amine; performing adhesion under low temperature, low pressure MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1994-04-05 US disclosed
US-5252700-A Polyamic acid or polyimide endblocked with aromatic dicarboxylic anhydrides MITSUI TOATSU CHEMICALS, INC. (JP) 1993-10-12 US disclosed
EP-0511813-A2 Heat-resistant adhesive and method of adhesion by using adhesive MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-11-04 EP disclosed