SCHEMBL7875560

SCHEMBL7875560

Nc1ccc(Oc2ccc(C3(Oc4ccc(N)cc4)C=CC=CC3)cc2)cc1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.42
TDP1 Q9NUW8 2/20 0.42
CYP3A4 P08684 1/20 0.42
TSHR P16473 1/20 0.42
MAOA P21397 2/20 0.38
MAPT P10636 5/20 0.37
TEAD4 Q15561 1/20 0.37
MAOB P27338 1/20 0.37
SMN1; SMN2 Q16637 3/20 0.36
MEN1 O00255 3/20 0.36
KMT2A Q03164 3/20 0.36
POLB P06746 1/20 0.36
MITF O75030 1/20 0.36
GAA P10253 1/20 0.36
GFER P55789 1/20 0.36
NLRP1 Q9C000 1/20 0.36
NOD2 Q9HC29 1/20 0.36
NPC1 O15118 3/20 0.34
RAB9A P51151 3/20 0.34
MAPK1 P28482 2/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28213823 0.88 MAOA (0.38) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL9001097 0.84 MAOB (0.46) ALDH1A1CYP3A4MAOAMAPTMAOB
SCHEMBL9578203 0.80 ALDH1A1 (0.47) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL4379266 0.74 CYP19A1 (0.39) ALDH1A1MAOAMAOBHPGD
SCHEMBL10355877 0.74 TDP1 (0.37) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL28213857 0.72 MAOB (0.42) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL3844505 0.72 TDP1 (0.35) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL6704874 0.69 MAOA (0.41) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL534636 0.69 MAOA (0.41) ALDH1A1TDP1CYP3A4TSHRMAOA
SCHEMBL28479057 0.68 MAOB (0.39) ALDH1A1TDP1MAOAMAPTMAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260117017-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2026-04-30 US disclosed
EP-4692159-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF Nippon Kayaku Kabushiki Kaisha (JP) 2026-02-11 EP disclosed
WO-2025121298-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF 日本化薬株式会社 2025-06-12 WO disclosed
CN-118139906-B Phenol resin, epoxy resin, curable resin composition, and cured product thereof 日本化药株式会社 2025-02-25 CN disclosed
CN-117043215-B Epoxy resin, curable resin composition, and cured product of curable resin composition 日本化药株式会社 2024-11-05 CN disclosed
CN-117120503-B Epoxy resin, curable resin composition, and cured product of curable resin composition 日本化药株式会社 2024-10-11 CN disclosed
WO-2024203145-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF 日本化薬株式会社 2024-10-03 WO disclosed
WO-2024203431-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF 日本化薬株式会社 2024-10-03 WO disclosed
WO-2024203144-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF 日本化薬株式会社 2024-10-03 WO disclosed
WO-2024195581-A1 EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF 日本化薬株式会社 2024-09-26 WO disclosed
WO-2022265096-A9 EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT THEREFROM 日本化薬株式会社 2023-01-19 WO disclosed
WO-2022265096-A1 EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT THEREFROM 日本化薬株式会社 2022-12-22 WO disclosed
CN-115335224-A Laminate for transparent conductive film, and method for producing transparent conductive film 琳得科株式会社 2022-11-11 CN disclosed
WO-2022209642-A1 EPOXY RESIN AND PRODUCTION METHOD THEREFOR, CURABLE RESIN COMPOSITION, AND CURED PRODUCT THEREOF 日本化薬株式会社 2022-10-06 WO disclosed
WO-2022107678-A1 EPOXY RESIN, CURABLE RESIN COMPOSITION, AND CURED OBJECT THEREFROM 日本化薬株式会社 2022-05-27 WO disclosed
US-6320019-B1 REACTING A TETRACARBOXYLIC DIANHYDRIDE, AN AROMATIC DIAMINE, A DIAMINE WITH A SILOXANE STRUCTURE, AND AN AROMATIC TRI- OR TETRAAMINE WITH TWO PHENYL GROUPS SAEHAN INDUSTRIES INCORPORATION (KR) 2001-11-20 US disclosed
EP-0728792-A2 Heat-resistant adhesive and method of adhesion by using adhesive MITSUI TOATSU CHEMICALS, Inc. (JP) 1996-08-28 EP disclosed
US-5300620-A Polyamic acids and/or polyimides are blocked with aromatic amine; performing adhesion under low temperature, low pressure MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1994-04-05 US disclosed
US-5252700-A Polyamic acid or polyimide endblocked with aromatic dicarboxylic anhydrides MITSUI TOATSU CHEMICALS, INC. (JP) 1993-10-12 US disclosed
EP-0511813-A2 Heat-resistant adhesive and method of adhesion by using adhesive MITSUI TOATSU CHEMICALS, Inc. (JP) 1992-11-04 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260117017-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF ASIC1, TNF, WIZ ALDH1A1 626/4885TDP1 3273/4885CYP3A4 2353/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.