Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAOB | P27338 | 2/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
| ▸ | TP53 | P04637 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 2/20 | 0.33 |
| ▸ | MEN1 | O00255 | 2/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.33 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.33 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
| ▸ | GAA | P10253 | 1/20 | 0.33 |
| ▸ | GFER | P55789 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.33 |
| ▸ | MAOA | P21397 | 1/20 | 0.32 |
| ▸ | ATM | Q13315 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | OPRD1 | P41143 | 1/20 | 0.30 |
| ▸ | KCNH2 | Q12809 | 1/20 | 0.30 |
| ▸ | NPC1 | O15118 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9001097 | 0.88 | MAOB (0.46) | MAOBCYP3A4ALDH1A1TP53MAPT | |
| SCHEMBL28213823 | 0.84 | MAOA (0.38) | MAOBCYP3A4ALDH1A1MAPTMEN1 | |
| SCHEMBL7629801 | 0.78 | CYP3A4 (0.42) | MAOBCYP3A4ALDH1A1TP53MAPT | |
| SCHEMBL30302594 | 0.78 | CYP3A4 (0.42) | MAOBCYP3A4ALDH1A1TP53MAPT | |
| SCHEMBL7875560 | 0.72 | ALDH1A1 (0.42) | MAOBCYP3A4ALDH1A1MAPTMEN1 | |
| SCHEMBL10586704 | 0.71 | MAOB (0.45) | MAOBCYP3A4ALDH1A1TP53MAPT | |
| SCHEMBL14215207 | 0.69 | MAOB (0.49) | MAOBCYP3A4ALDH1A1TP53MAPT | |
| SCHEMBL7629797 | 0.67 | ALDH1A1 (0.47) | MAOBCYP3A4ALDH1A1TP53MAPT | |
| SCHEMBL9293875 | 0.65 | — | — | |
| SCHEMBL30786886 | 0.65 | OPRM1 (0.39) | MEN1KMT2ALMNAOPRD1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118063769-A | Polyimide resin | 住友化学株式会社 | 2024-05-24 | — | — | CN | disclosed |
| CN-117700990-A | Resin composition, adhesive, coating agent, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2024-03-15 | — | — | CN | disclosed |
| CN-117210002-A | Resin film, coverlay film, circuit board, resin-coated copper foil, metal-clad laminate, and multilayer circuit board | 日铁化学材料株式会社 | 2023-12-12 | — | — | CN | disclosed |
| CN-117050306-A | Method for producing polyimide | 日铁化学材料株式会社 | 2023-11-14 | — | — | CN | disclosed |
| CN-110964319-B | Resin film, polyimide, adhesive resin composition, and use thereof | 日铁化学材料株式会社 | 2023-10-10 | — | — | CN | disclosed |
| CN-116178712-A | Polyimide resin precursor | 住友化学株式会社 | 2023-05-30 | — | — | CN | disclosed |
| CN-116178953-A | Polyimide film | 住友化学株式会社 | 2023-05-30 | — | — | CN | disclosed |
| CN-116178711-A | Polyimide resin | 住友化学株式会社 | 2023-05-30 | — | — | CN | disclosed |
| CN-116178713-A | Polyimide film | 住友化学株式会社 | 2023-05-30 | — | — | CN | disclosed |
| CN-110871606-B | Metal-clad laminate, adhesive sheet, adhesive polyimide resin composition, and circuit board | 日铁化学材料株式会社 | 2023-05-16 | — | — | CN | disclosed |
| CN-113527882-A | Polyimide film and copper-clad laminate | 日铁化学材料株式会社 | 2021-10-22 | — | — | CN | disclosed |
| CN-113462300-A | Resin film, metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2021-10-01 | — | — | CN | disclosed |
| CN-107312329-B | Polyimide film and copper-clad laminate | 日铁化学材料株式会社 | 2021-09-21 | — | — | CN | disclosed |
| CN-113174231-A | Polyimide resin composition, adhesive composition, and related articles | 荒川化学工业株式会社 | 2021-07-27 | — | — | CN | disclosed |
| CN-113043690-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2021-06-29 | — | — | CN | disclosed |
| CN-112469560-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2021-03-09 | — | — | CN | disclosed |
| CN-110962410-A | Metal-clad laminate and circuit board | 日铁化学材料株式会社 | 2020-04-07 | — | — | CN | disclosed |
| CN-110964319-A | Resin film, polyimide, adhesive resin composition, and use thereof | 日铁化学材料株式会社 | 2020-04-07 | — | — | CN | disclosed |
| CN-110871606-A | Metal-clad laminate, adhesive sheet, adhesive polyimide resin composition, and circuit board | 日铁化学材料株式会社 | 2020-03-10 | — | — | CN | disclosed |
| CN-104519657-B | Copper-cover laminated plate, printing distributing board and its application method | 新日铁住金化学株式会社 | 2018-04-06 | — | — | CN | disclosed |