SCHEMBL9014234

SCHEMBL9014234

CN(C)[Si](C)(C)[Si](C)(C)N(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2524347 0.84
SCHEMBL430721 0.71
SCHEMBL377532 0.71
SCHEMBL25220941 0.67
SCHEMBL49557 0.67
SCHEMBL11150558 0.63
SCHEMBL303170 0.63
SCHEMBL2099803 0.63
SCHEMBL2524116 0.63
SCHEMBL19426996 0.63

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 68 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250313953-A1 METHODS AND SYSTEMS FOR FORMING DOPED SILICON NITRIDE FILMS ASM IP HOLDING B.V. (NL) 2025-10-09 US claimed
US-12378667-B2 Methods and systems for forming doped silicon nitride films ASM IP HOLDING B.V. (NL) 2025-08-05 US claimed
US-20240359430-A1 THERMAL CHEMICAL VAPOR DEPOSITION COATING PROCESS SILCOTEK CORP 2024-10-31 US claimed
US-20230126516-A1 METHODS AND SYSTEMS FOR FORMING DOPED SILICON NITRIDE FILMS ASM IP HOLDING B.V. (NL) 2023-04-27 US claimed
US-20210087708-A1 NANO-WIRE GROWTH SILCOTEK CORP. 2021-03-25 US claimed
US-5487967-A Surface-imaging technique for lithographic processes for device fabrication AT&T CORP. (US) 1996-01-30 US claimed
US-20260125789-A1 MANUFACTURING PROCESS WITH REDUCED TRANSPORT OF METAL IONS, MANUFACTURED PRODUCTS, AND STORED PRODUCTS SILCOTEK CORP (US) 2026-05-07 US disclosed
US-20260129933-A1 CHEMICAL VAPOR DEPOSITION PROCESS AND COATING SILCOTEK CORP (US) 2026-05-07 US disclosed
US-20260042880-A1 CONTROLLABLE EXTENSION OF FLEXIBLE OLIGOMERIC DIOLS AND METHODS THEREOF THE BOEING COMPANY (US) 2026-02-12 US disclosed
EP-4692167-A1 CONTROLLABLE EXTENSION OF FLEXIBLE OLIGOMERIC DIOLS AND METHODS THEREOF The Boeing Company (US) 2026-02-11 EP disclosed
US-20260028715-A1 DIELECTRIC ARTICLE SILCOTEK CORP (US) 2026-01-29 US disclosed
US-20250362277-A1 LIQUID CHROMATOGRAPHY TECHNIQUE SILCOTEK CORP (US) 2025-11-27 US disclosed
US-12473635-B2 Dielectric article SILCOTEK CORP. (US) 2025-11-18 US disclosed
US-20180258529-A1 THERMAL CHEMICAL VAPOR DEPOSITION COATING SILCOTEK CORP (US) 2018-09-13 US disclosed
US-20180163308-A1 FLUORO-CONTAINING THERMAL CHEMICAL VAPOR DEPOSITION PROCESS AND ARTICLE SILCOTEK CORP. 2018-06-14 US disclosed
US-20170211180-A1 DIFFUSION-RATE-LIMITED THERMAL CHEMICAL VAPOR DEPOSITION COATING SILCOTEK CORP. 2017-07-27 US disclosed
EP-3196335-A1 DIFFUSION-RATE-LIMITED THERMAL CHEMICAL VAPOR DEPOSITION COATING Silcotek Corp. (US) 2017-07-26 EP disclosed
EP-3192894-A1 SILICON-NITRIDE-CONTAINING THERMAL CHEMICAL VAPOR DEPOSITION COATING Silcotek Corp. (US) 2017-07-19 EP disclosed
US-20170167015-A1 SILICON-NITRIDE-CONTAINING THERMAL CHEMICAL VAPOR DEPOSITION COATING SILCOTEK CORP. 2017-06-15 US disclosed
US-5487967-A Surface-imaging technique for lithographic processes for device fabrication AT&T CORP. (US) 1996-01-30 US disclosed