SCHEMBL9101086

SCHEMBL9101086

Nc1cccc(C(=O)c2cccc(C(=O)c3cccc(C(=O)c4cccc(N)c4)c3)c2)c1

nearest known ligand 0.83

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PBRM1 Q86U86 1/20 0.83
NPC1 O15118 1/20 0.69
MITF O75030 1/20 0.69
LMNA P02545 1/20 0.69
POLB P06746 1/20 0.69
TDP1 Q9NUW8 2/20 0.62
ATM Q13315 1/20 0.62
L3MBTL1 Q9Y468 1/20 0.62
CA1 P00915 2/20 0.59
CA2 P00918 2/20 0.59
CA9 Q16790 2/20 0.59
F2 P00734 1/20 0.54
PLG P00747 1/20 0.54
PRSS1 P07477 1/20 0.54
PRSS2 P07478 1/20 0.54
PRSS3 P35030 1/20 0.54
CYP3A4 P08684 1/20 0.50
CASP1 P29466 1/20 0.50
RECQL P46063 1/20 0.50
SMN1; SMN2 Q16637 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL204263 1.00 PBRM1 (0.83) PBRM1NPC1MITFLMNAPOLB
SCHEMBL29492479 1.00 PBRM1 (0.83) PBRM1NPC1MITFLMNAPOLB
Hydrochloric Acid SCHEMBL8962669 0.98 PBRM1 (0.80) PBRM1NPC1MITFLMNAPOLB
Benzene SCHEMBL8764875 0.98 PBRM1 (0.88) PBRM1NPC1MITFLMNAPOLB
SCHEMBL29363032 0.98 PBRM1 (0.87) PBRM1NPC1MITFLMNAPOLB
SCHEMBL125621 0.98 PBRM1 (0.87) PBRM1NPC1MITFLMNAPOLB
SCHEMBL9282073 0.98 PBRM1 (0.87) PBRM1NPC1MITFLMNAPOLB
Hydrochloric Acid SCHEMBL8643223 0.95 PBRM1 (0.83) PBRM1NPC1MITFLMNAPOLB
SCHEMBL203373 0.93 PBRM1 (0.88) PBRM1NPC1MITFLMNAPOLB
SCHEMBL29492473 0.93 PBRM1 (0.88) PBRM1NPC1MITFLMNAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0553612-B1 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO LTD (JP) 1996-08-21 EP disclosed
US-5508357-A SOLUBILITY IN SOLVENT, LOW MELTING POINT HITACHI CHEMICAL COMPANY, LTD. (JP) 1996-04-16 US disclosed
EP-0553612-A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO., LTD. (JP) 1993-08-04 EP disclosed