SCHEMBL9220135

SCHEMBL9220135

CC(C)(CC(c1ccc(O)cc1)C(CC(CC(C)(CC(C)(C)c1ccc(O)cc1)c1ccc(O)cc1)c1ccc(O)cc1)C(C)(C)c1ccc(O)cc1)c1ccc(O)cc1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SHBG P04278 1/20 0.40
ESR1 P03372 8/20 0.33
ESR2 Q92731 7/20 0.33
LMNA P02545 1/20 0.33
CYP1A2 P05177 1/20 0.33
PGR P06401 1/20 0.33
CHRM2 P08172 1/20 0.33
CYP3A4 P08684 1/20 0.33
ADORA3 P0DMS8 1/20 0.33
AR P10275 1/20 0.33
CYP2D6 P10635 1/20 0.33
MAPT P10636 1/20 0.33
CHRM1 P11229 1/20 0.33
CYP2C9 P11712 1/20 0.33
ALOX15 P16050 1/20 0.33
DRD1 P21728 1/20 0.33
TBXA2R P21731 1/20 0.33
PTGS1 P23219 1/20 0.33
SLC6A2 P23975 1/20 0.33
CYP2C19 P33261 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9244771 0.79 SHBG (0.51) SHBGESR1ESR2LMNACYP1A2
SCHEMBL18139 0.72 SHBG (0.53) SHBGESR1ESR2LMNACYP1A2
SCHEMBL8625814 0.71 SHBG (0.39) SHBGESR1ESR2CYP3A4CYP2C9
SCHEMBL6157069 0.70 SHBG (0.50) SHBGESR1ESR2LMNACYP1A2
SCHEMBL9847849 0.69 SHBG (0.44) SHBGESR1ESR2LMNACYP1A2
SCHEMBL6060401 0.69 SHBG (0.72) SHBGESR1ESR2LMNACYP3A4
SCHEMBL5174803 0.69 SHBG (0.38) SHBGESR1ESR2
SCHEMBL1201797 0.68 SHBG (0.69) SHBGESR1ESR2LMNACYP3A4
SCHEMBL5140991 0.66 SHBG (0.45) SHBGESR1ESR2LMNACYP3A4
SCHEMBL14490603 0.66 ESR1 (0.50) SHBGESR1ESR2LMNACYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5396104-A Resin coated bonding wire, method of manufacturing the same, and semiconductor device NIPPON STEEL CORPORATION (JP) 1995-03-07 US disclosed
EP-0416133-A1 RESIN-COATED BONDING WIRE, METHOD OF PRODUCING THE SAME AND SEMICONDUCTOR DEVICE NIPPON STEEL CORPORATION (JP) 1991-03-13 EP disclosed