SCHEMBL9250290

SCHEMBL9250290

CCc1nccn1C(=O)c1c(C)cc(C)cc1C

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.42
KMT2A Q03164 4/20 0.42
KDM4E B2RXH2 3/20 0.42
MAPT P10636 2/20 0.42
ALPG P10696 3/20 0.40
PLAA Q9Y263 2/20 0.40
ALPL P05186 2/20 0.39
HPGD P15428 3/20 0.39
LMNA P02545 2/20 0.39
F2 P00734 1/20 0.39
OPRD1 P41143 1/20 0.37
SMN1; SMN2 Q16637 4/20 0.36
TSHR P16473 1/20 0.36
HCRTR1 O43613 1/20 0.35
HCRTR2 O43614 1/20 0.35
CA12 O43570 1/20 0.34
CA1 P00915 1/20 0.34
CA2 P00918 1/20 0.34
CA3 P07451 1/20 0.34
CA4 P22748 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9249012 0.82 KMT2A (0.39) ALDH1A1KMT2AKDM4EALPGPLAA
SCHEMBL10779970 0.75 KMT2A (0.46) ALDH1A1KMT2AKDM4EMAPTALPG
SCHEMBL2288576 0.75 ALPG (0.42) ALDH1A1KMT2AKDM4EMAPTALPG
SCHEMBL1165647 0.75 ALPG (0.42) ALDH1A1KMT2AKDM4EMAPTALPG
SCHEMBL616402 0.74 ESR1 (0.43) MAPTALPGPLAAOPRD1SMN1; SMN2
SCHEMBL28746087 0.73 ALPG (0.41) ALDH1A1KMT2AKDM4EMAPTALPG
SCHEMBL1353073 0.73 ALPG (0.41) ALDH1A1KMT2AKDM4EMAPTALPG
SCHEMBL28151261 0.72 ALPG (0.40) ALDH1A1KMT2AKDM4EMAPTALPG
Ethane SCHEMBL27625282 0.72 ALPG (0.40) ALDH1A1KMT2AKDM4EMAPTALPG
SCHEMBL29182136 0.68 ALPG (0.38) ALDH1A1KMT2AKDM4EMAPTALPG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380023-B Polyhydroxy resin, epoxy resin, method for producing same, epoxy resin composition using same, and cured product 日铁化学材料株式会社 2025-04-11 CN disclosed
CN-119161272-A Polyhydroxy resin, epoxy resin, method for producing same, epoxy resin composition using same, and cured product 日铁化学材料株式会社 2024-12-20 CN disclosed
CN-115380023-A Polyhydroxy resin, epoxy resin, method for producing same, epoxy resin composition using same, and cured product 日铁化学材料株式会社 2022-11-22 CN disclosed
EP-0379468-B1 Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups CIBA GEIGY AG (CH) 1995-03-01 EP disclosed
US-5006611-A Prepreg for fiber reinforced composite; adhesive films CIBA-GEIGY CORPORATION (US) 1991-04-09 US disclosed
EP-0194232-B1 CURABLE COMPOSITION CONTAINING AN EPOXY RESIN, AN IMIDAZOLIDE AND A POLYSULFONIC RESIN CIBA-GEIGY AG (CH) 1989-09-20 EP disclosed
EP-0146498-B1 HARDENABLE COMPOSITION CONTAINING AN EPOXY RESIN, AN IMIDE AND A HARDENING CATALYST CIBA-GEIGY AG (CH) 1987-04-08 EP disclosed
EP-0194232-A2 Curable composition containing an epoxy resin, an imidazolide and a polysulfonic resin CIBA-GEIGY AG (CH) 1986-09-10 EP disclosed
US-4579916-A IMPROVED STORAGE STABILITY CIBA-GEIGY CORPORATION (US) 1986-04-01 US disclosed
EP-0146498-A2 Hardenable composition containing an epoxy resin, an imide and a hardening catalyst CIBA-GEIGY AG (CH) 1985-06-26 EP disclosed