SCHEMBL9249012

SCHEMBL9249012

Cc1cc(C)c(C(=O)n2ccnc2C)c(C)c1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 3/20 0.39
HCRTR1 O43613 1/20 0.38
HCRTR2 O43614 1/20 0.38
OPRD1 P41143 1/20 0.38
SMN1; SMN2 Q16637 4/20 0.37
KDM4E B2RXH2 1/20 0.37
ALDH1A1 P00352 1/20 0.37
HTT P42858 1/20 0.37
ALPL P05186 2/20 0.37
ALPG P10696 2/20 0.37
ALPI P09923 1/20 0.37
PLAA Q9Y263 1/20 0.37
HPGD P15428 1/20 0.37
EPHX2 P34913 1/20 0.37
NR3C2 P08235 1/20 0.36
GFER P55789 1/20 0.36
TAS1R3 Q7RTX0 2/20 0.36
TAS1R1 Q7RTX1 2/20 0.36
TAS1R2 Q8TE23 2/20 0.36
CYP3A4 P08684 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9250290 0.82 ALDH1A1 (0.42) KMT2AHCRTR1HCRTR2OPRD1SMN1; SMN2
SCHEMBL616402 0.80 ESR1 (0.43) OPRD1SMN1; SMN2HTTALPGPLAA
SCHEMBL10784461 0.78 FDPS (0.37) KMT2AALDH1A1ALPLALPGALPI
SCHEMBL9241467 0.72 TSHR (0.49) KMT2ASMN1; SMN2KDM4EALDH1A1HPGD
SCHEMBL1165059 0.72 FDPS (0.39) KMT2AALDH1A1ALPLALPGALPI
SCHEMBL309967 0.72 FDPS (0.39) KMT2AALDH1A1ALPLALPGALPI
SCHEMBL10816537 0.70 CYP11B1 (0.44) KMT2AHCRTR1HCRTR2KDM4EALDH1A1
SCHEMBL9502453 0.70
SCHEMBL298299 0.70
SCHEMBL10408730 0.69 FDPS (0.51) KMT2AOPRD1SMN1; SMN2KDM4EALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380023-B Polyhydroxy resin, epoxy resin, method for producing same, epoxy resin composition using same, and cured product 日铁化学材料株式会社 2025-04-11 CN disclosed
CN-119161272-A Polyhydroxy resin, epoxy resin, method for producing same, epoxy resin composition using same, and cured product 日铁化学材料株式会社 2024-12-20 CN disclosed
CN-115380023-A Polyhydroxy resin, epoxy resin, method for producing same, epoxy resin composition using same, and cured product 日铁化学材料株式会社 2022-11-22 CN disclosed
EP-0379468-B1 Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups CIBA GEIGY AG (CH) 1995-03-01 EP disclosed
US-5006611-A Prepreg for fiber reinforced composite; adhesive films CIBA-GEIGY CORPORATION (US) 1991-04-09 US disclosed
EP-0379468-A2 Curable epoxy resin composition containing a thermoplastic resin having phenolic end groups CIBA-GEIGY AG (CH) 1990-07-25 EP disclosed
EP-0194232-B1 CURABLE COMPOSITION CONTAINING AN EPOXY RESIN, AN IMIDAZOLIDE AND A POLYSULFONIC RESIN CIBA-GEIGY AG (CH) 1989-09-20 EP disclosed
EP-0194232-A2 Curable composition containing an epoxy resin, an imidazolide and a polysulfonic resin CIBA-GEIGY AG (CH) 1986-09-10 EP disclosed